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Tau protein undergoes complex biochemical processes involved in normal and diseased cellular functions; specifically, tau pathology has been linked to neurodegeneration. At the heart of tau biochemistry are three pillars: microtubules, phosphorylation, and aggregation. However, these three processes are also regulated through other biomolecules in the biological setting, such as metal ions and small and larger ligands, including proteins and nucleic acids. This review describes the latest electrochemical approaches toward greater understanding of tau biochemistry, early disease diagnosis, and drug inhibitor screening.  相似文献   
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Journal of Radioanalytical and Nuclear Chemistry - Liquid scintillation cocktails loaded with neutron capture agents such as 6Li are used in both neutron and neutrino detectors. For detectors...  相似文献   
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Austempered ductile iron (ADI) has complex microstructure containing a multiphase matrix (called ‘ausferrite’), graphite spheres and oxide inclusions. The corrosion resistance of ADI is related to its microstructure which is determined by heat treatment parameters (like austempering temperature, austempering time, austenitising temperature and austenitising time). In the present paper, the electrochemical behaviour and corrosion resistance of ADI have been investigated by means of the electrochemical microcell technique and classical electrochemical measurements in sodium chloride solution. Particular attention has been paid to the influence of austempering temperature on the microstructure and pitting corrosion. It has been shown that ADI austempered at 430 °C has upper ausferritic microstructure and reveals a better corrosion resistance in sodium chloride solution than ADI austempered at 280 °C. Moreover, the corrosion resistance increases as the volume fracture of ferrite increases and the carbon content of austenite decreases. The good corrosion behaviour of ADI austempered at 430 °C was also related to the good coarsening of the austenite grains and broad ferrite needles (less ferrite/austenite interfaces). It has been demonstrated that silicon is the alloying element hindering the anodic dissolution of the alloy.  相似文献   
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