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用反应离子刻蚀(RIE)剥层的微分霍耳法(DHE)对等离子体掺杂、离子注入制备的Si超浅p n结进行了电学表征.通过对超浅p n结样品RIE剥层的DHE测试和二次离子质谱(SIMS)测试及比较,发现用反应离子刻蚀(RIE)剥层的DHE测试获得的杂质浓度分布及结深与SIMS测试结果具有良好的一致性,DHE具有良好的可控性与重复性.测试杂质浓度达1021cm-3量级的Si超浅结样品,其深度分辨率可达nm量级. 相似文献
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本文介绍制备均匀硅化钛导电薄膜的一种新方法,高频NH_3等离子体和感应加热的共同作用,使淀积在硅片表面的Ti膜产生氮化和硅化反应,实验表明,在低气压下NH_3等离子体增强的Ti膜表面氮化,可以有效地克服通常很难避免的氧沾污的有害影响,有利于通过固相反应形成自对准TiSi_2导电薄膜。 相似文献
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The forward current-voltage (I-V) characteristics of polycrystalline CoSi2/n-Si(100) Schottky contacts have been measured in a wide temperature range. At low temperatures (≤200K), a plateau-like section is observed in the I-V characteristics around 10-4A·cm-2. The current in the small bias region significantly exceeds that expected by the model based on thermionic emission (TE) and a Gaussian distribution of Schottky barrier height (SBH). Such a double threshold behaviour can be explained by the barrier height inhomogeneity, i.e. at low temperatures the current through some patches with low SBH dominates at small bias region. With increasing bias voltage, the Ohmic effect becomes important and the current through the whole junction area exceeds the patch current, thus resulting in a plateau-like section in the I-V curves at moderate bias. For the polycrystalline CoSi2/Si contacts studied in this paper, the apparent ideality factor of the patch current is much larger than that calculated from the TE model taking the pinch-off effect into account. This suggests that the current flowing through these patches is of the tunnelling type, rather than the thermionic emission type. The experimental I-V characteristics can be fitted reasonably well in the whole temperature region using the model based on tunnelling and pinch-off. 相似文献
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在注入As的Si表面上,采用离子束溅射淀积Co/Ti双层金属膜。在氮气氛下对Co/Ti/Si进行多步热处理,研究As原子在Co/Ti/Si三元固相反应过程中的行为。实验采用背散射技术测量As原子在反应各阶段中的分布。结果表明,随着反应形成TiN(O)/Co-Ti-Si/CoSi2/Si多层薄膜结构,一部分Si衬底中的As原子被分凝出来,向表面运动,并聚集在Co-Ti-Si三元硅化物中。对As原子的这一再分布行为进行了讨论。
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