CALCE/RAMCAD for Electronics

The University of Maryland's Computer Aided Life Cycle Engineering (CALCE) research effort is aimed at developing techniques for design, analysis, prediction, and optimization of electronics with respect to a variety of design goals. Performance, producibility, reliability, maintainability, life-cycle cost, safety, etc., are the design criteria which are being integrated through the application of interactive heuristic and algorithmic design optimization techniques. The University of Maryland Reliability and Maintainability Computer-Aided Design (RAMCAD) research is CALCE and is focused on second- and third-level electronic package design with respect to interfacing thermal, mechanical, and reliability analysis. The goal is to make reliability and maintainability an integral, real-time, and upfront part of the design process, such that the need to resubmit designs will be eliminated. The motivation behind this project was the fact that schedule constraints are often compromising the effectiveness and efficiency of the design process. To achieve the goal of CALCE/RAMCAD, a cohesive and extensible design environment for analysis and tradeoff tools was developed. A system executive controller that integrates tools for analysis while providing system transparency, design data management, and process management was developed to guide the user through the design process and provide direct access to the design tools. These developments required the integration of computer-aided design (CAD), artificial intelligence (AI), and decision support (DS) techniques. Attention to human factors and the use of interactive graphics were also instrumental in the development.     

Orientation selective ESEEM studies on the blue oxidases laccase and ascorbate oxidase

The blue oxidases, laccase and ascorbate oxidase, contain three spectroscopically distinct copper binding sites, two of which are EPR detectable in the oxidized Cu(II) state, called type 1 (T1) and type 2 (T2). The three dimensional structure of ascorbate oxidase has recently been determined (Messerschmidt A.et al.: J. Mol. Biol.206, 513 (1989)) while that of laccase has not. We have therefore carried out comparative electron spin echo envelope modulation (ESEEM) measurements on ascorbate oxidase, laccase and laccase in which T1 Cu(II) was substituted with Hg(II) in order to obtain structural information about the copper sites in laccase. The ESEEM results clearly show that there are as many histidines in laccase as in ascorbate oxidase, i.e., at least two at each site. Orientation selective ESEEM experiments showed that in the T1 site in both enzymes the two remote (uncoordinated) nitrogens are magnetically inequivalent and have different hyperfine interactions. Furthermore, the isotropic hyperfine constants of both remote nitrogens in laccase T1 are larger than those in ascorbate oxidase T1. In laccase T2 two remote nitrogens show similar hyperfine couplings and the modulation depth is significantly deeper than in ascorbate oxidase. Finally, it is suggested that the difference between the NQR frequencies of the remote nitrogens in T1 and T2 in both oxidases can be attributed to the alkyl group of the side chain being adjacent to the bound imidazole in T1 and to the remote nitrogen in T2. This is in accordance with the known X-ray structure of ascorbate oxidase.     

Assessing the operating reliability of land grid array elastomersockets

The contact resistances of 2300 elastomer button contacts used for LGA (land grid array) package interconnections were measured over a range of contact loads. The experimental data, fitted using three probability distribution functions, show that an inverse Gaussian distribution best describes elastomer button contact resistance behavior. Using this probability function, the minimum operating contact load necessary for a desired socket operating reliability can be determined     

Intramolecular electron transfer in nitrite reductases.

The copper- and heme-containing nitrite reductases (NiRs) are key enzymes in denitrification. Their subunits contain two distinct redox-active metal centers, an electron-accepting site and a nitrite-reducing site, to carry out the single-electron reduction of nitrite to nitric oxide. Catalytic cycles of both enzyme families employ intramolecular electron transfer that can be rate-determining for their activity. Herein, we report results comparing these two enzyme families in order to resolve the different mechanisms controlling intramolecular electron transfer in these proteins.     

Physics-of-failure assessment of a cruise control module

The purpose of a cruise control system is to accurately maintain the driver’s desired set speed, without intervention from the driver, by actuating the throttle-accelerator pedal linkage. Over the past five years, owners of a particular cruise control have complained that it did not operate properly. Complaints ranged from not engaging upon command, to the cruise unexpectedly accelerating past the desired speed. A common thread among all the complaints was the intermittent nature of the problems. More than 96% of the reported failed modules removed from vehicles and returned to the company, passed bench tests.This paper presents a physics-of-failure process to identify, induce and analyze failure mechanisms causing intermittent failures, high warranty returns and cannot duplicate (CND) problems of the digital electronic cruise control module (CCM). In addition, we explain why the manufacturer’s tests were not representative of the actual automotive environments, nor were they conducted in a manner to access actual failures. We conclude with a recommendation for a physics-of-failure approach for future product development.     

The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth

This paper presents the results of an eight-month design-of-experiment assessment of whisker growth on bright and matte tin-plated copper, mechanically deformed and unformed coupons, subject to a continuous 50 °C/50%RH environment, with and without the presence of a constant electrical current density magnitude of 0.48 × 10² A/cm². Whiskers were observed to grow both at the anode and cathode end. The distribution-based data showed a reduction in whisker density due to annealing and/or the application of electrical current for both bright and matte tin. However, the application of electrical current was observed to increase the standard deviation of the length distribution, and to generate longer whiskers.     

Assessment of Ni/Pd/Au–Pd and Ni/Pd/Au–Ag Preplated Leadframe Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests

Preplated leadframes packages with a new noble metal finish type were exposed to various electrochemical migration tests, and mixed flowing gas environments to assess the quality and reliability due to these environmental conditions. Packages were tested as discrete parts and also as parts mounted onto printed circuit boards to assess the effect of reflow soldering. Selected packages with SnPb plated leadframes were tested for comparison purposes. After test exposure, optical microscopy, scanning electron microscope, and energy dispersive spectroscopy analyses were conducted to evaluate the corrosion behavior. Corrosion and creep corrosion on the leads were observed on all the preplated test samples subject to the mixed flowing gas. Creep corrosion over the mold compound surface was identified on the unmounted quad flat no-lead packages. The creep corrosion products were found to be electrically conductive and could bridge adjacent lead pairs     

Statistical analysis of tin whisker growth

As the result of the global movement to lead-free electronics, companies which assemble semiconductor devices are switching from finishes incorporating lead to pure tin or high tin lead-free alloys. This transition has resulted in a reliability issue, concerning the formation of conductive tin whiskers which can grow across leads of a package and cause current leakage or short circuits. This paper presents the results of an experimental tin whisker growth study of bright tin on brass substrates. A probabilistic model is applied to describe the phenomenon of whisker growth in terms of whisker density, length and growth rate.