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1.
This letter presents a new polarizer which has a simple comb structure inside a circular waveguide. The electrical performance of the proposed comb polarizer is optimized by a circular waveguide radius and by the physical parameters of the comb plates. This polarizer is suitable for providing good performance in millimeter‐band application because of its simple structure and low fabrication cost. In our experiments the dual‐band comb polarizer designed in band 1(K) and band 2(Ka) showed good electrical performance without any tuning elements. 相似文献
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Fullerenes have unique structural and electronic properties that make them attractive candidates for diagnostic, therapeutic, and theranostic applications. However, their poor water solubility remains a limiting factor in realizing their full biomedical potential. Here, we present an approach based on a combination of supramolecular and covalent chemistry to access well-defined fullerene-containing polymer nanoparticles with a core–shell structure. In this approach, solvophobic forces and aromatic interactions first come into play to afford a micellar structure with a poly(ethylene glycol) shell and a corannulene-based fullerene-rich core. Covalent stabilization of the supramolecular assembly then affords core-crosslinked polymer nanoparticles. The shell makes these nanoparticles biocompatible and allows them to be dried to a solid and redispersed in water without inducing interparticle aggregation. The core allows a high content of different fullerene types to be encapsulated. Finally, covalent stabilization endows nanostructures with stability against changing environmental conditions.A polymer nanoparticle approach to biorelevant and robust fullerene nanoparticles is presented. 相似文献
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Kwang‐Seong Choi Ki‐Jun Sung Byeong‐Ok Lim Hyun‐Cheol Bae Sunghae Jung Jong‐Tae Moon Yong‐Sung Eom 《ETRI Journal》2010,32(2):342-344
A novel, maskless, low‐volume bumping material, called solder bump maker, which is composed of a resin and low‐melting‐point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out‐gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 µm and 150 µm. 相似文献
6.
Kwang‐Seong Choi Haksun Lee Hyun‐Cheol Bae Yong‐Sung Eom Jin Ho Lee 《ETRI Journal》2015,37(2):387-394
A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than 150°C. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than 150°C. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip‐chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a 20 μm pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at 130°C. 相似文献
7.
Young-Ho Eom Klaus M. Frahm András Benczúr Dima L. Shepelyansky 《The European Physical Journal B - Condensed Matter and Complex Systems》2013,86(12):1-9
X-ray circular magnetic dichroism, polarized neutron diffraction, ac susceptibility, and Seebeck effect have been measured for several members of the RCo2 series (R = Ho, Tm, Er) as a function of temperature and applied magnetic field. The experimental results show robust parimagnetism (a general behaviour along the RCo2 series with R being a heavy rare earth ion) and two reversal temperatures in some systems, which is an unexpected result. Polarised neutron diffraction show differences between results obtained on single crystals or polycrystalline ingots. We propose an interpretation of parimagnetic RCo2 as a Griffiths phase of the high temperature, magnetically ordered, amorphous RCo2 phase. 相似文献
8.
Yong‐Sung Eom Keon‐Soo Jang Ji‐Hye Son Hyun‐Cheol Bae Kwang‐Seong Choi 《ETRI Journal》2019,41(6):820-828
A highly reliable conductive adhesive obtained by transient liquid‐phase sintering (TLPS) technologies is studied for use in high‐power device packaging. TLPS involves the low‐temperature reaction of a low‐melting metal or alloy with a high‐melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag‐coated Cu, a Sn96.5‐Ag3.0‐Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 °C, consistent with the transient behavior of Ag3Sn + Cu6Sn5 → liquid + Cu3Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed. 相似文献
9.
The design variable tolerance effects on the natural frequency variance of constrained multi-body systems in dynamic equilibrium are investigated in this study. Monte-Carlo simulation is often employed for such investigations, but it is known to have serious drawbacks. Excessive amount of computation time needs to be consumed since a large number of evaluations are usually required for the method. Furthermore, the solution accuracy cannot be always guaranteed in spite of the excessive amount of computation time. In order to overcome such drawbacks, a method employing eigenvalue sensitivity information is proposed to obtain the variance of natural frequency in this study. In order to verify the accuracy and the efficiency of the method, some numerical examples of multi-body systems in dynamic equilibrium are solved and the results are compared to those obtained by an analytical method and Monte-Carlo simulation. 相似文献
10.
Ayoung Pyo Sudeok Kim Manian Rajesh Kumar Aleum Byeun Min Sik Eom Min Su Han Sunwoo Lee 《Tetrahedron letters》2013
Paraformaldehyde was employed as a hydride source in the palladium-catalyzed hydrodehalogenation of aryl iodides and bromides. High throughput screening using a paper-based colorimetric iodide sensor (PBCIS) showed that Pd(OAc)2 and Cs2CO3 were the best catalyst and base, respectively. Aryl iodides and bromides were hydrodehalogenated to produce the reduced arenes using Pd(OAc)2 and Pd(PPh3)4 catalyst. This catalytic system showed good functional group tolerance. In addition, it was found that paraformaldehyde is the hydride source and the reducing agent for the formation of palladium nanoparticles. 相似文献