An end-to-end denoising autoencoder-based deep neural network approach for fault diagnosis of analog circuit

Analog Integrated Circuits and Signal Processing - Fault diagnosis of analog circuit is critical to improve safety and reliability in electrical systems and reduce losses. Traditional fault...     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

基于MPEG-2文件的合并

介绍了具有相同音频、视频编码方式的MPEG - 2节目流如何合并成一个节目流。合并后的文件播放流畅并且时间显示正确 ,它包括PATPMT表的重写 ,系统头部分相关字段的更改 ,PCR值的修改 ,解码时间标签 (DTS)和显示时间标签 (PTS)的重新确定 ,传送速率的修改以及添加相应的空包     

稀掺杂GaNxAs1－x(x≤0.03)薄膜的调制光谱研究

利用室温下压电调制反射光(PzR)谱技术系统测量了N掺杂浓度为0.0%—3%的分子束外延生长GaN_xAs_1-x薄膜，并对图谱中所观察的光学跃迁进行了指认.在GaN_0.005As_0.995和GaN_0.01As_0.99薄膜的PzR谱中观察到此前只在椭圆偏振谱中才看到的N掺杂相关能态E₁+Δ₁+Δ_N.当N掺杂浓度达到 关键词： 压电调制反射光谱(PzR) xAs_1-x薄膜')" href="#">GaN_xAs_1-x薄膜 分子束外延(MBE)     

On Best Approximations from RS-sets in Complex Banach Spaces

The concept of an RS-set in a complex Banach space is introduced and the problem of best approximation from an RS-set in a complex space is investigated. Results consisting of characterizations, uniqueness and strong uniqueness are established,     

LAXS investigation of finger phantoms

Osteoporosis is a bone condition that is caused mainly by the degradation of trabecular and cortical bone resulting in the decrease of bone strength and eventually leads to bone fracture. A low angle X-ray scattering (LAXS) system that uses mainly the coherent scattering process for the characterisation of materials was constructed to study such bone conditions. Several finger phantoms were fabricated to simulate bone of varying densities. The LAXS method was able to identify the changes in bone density quite well by comparing energy dispersive X-ray diffraction patterns as well as the angular patterns. Quantitative information can be extracted from such patterns that relate to bone loss. Signature patterns at low exposure times were produced in order to reduce the dose received with reasonable identification power but at slightly higher statistical errors compared with long exposure patterns. Use of other parameters to increase the sensitivity was attempted.     

p+209Bi核反应微观数据的理论计算

利用光学模型、激光模型、蒸发模型及扭曲波玻恩近似理论,对入射能量从阈能到300MeV,p+²⁰⁹Bi的中子反应截面、剩余核截面、出射粒子的多重数进行了理论计算及分析,并将计算结果与实验数据进行了比较.同时得到一组能量到50?0MeV与实验数据符合很好的光学势参数.     

Magnetic and electrical transport properties of delta-doped amorphous Ge:Mn magnetic semiconductors

We report on the growth and characterization of delta-doped amorphous Ge:Mn diluted magnetic semiconductor thin films on GaAs (0 0 1) substrates. The fabricated samples exhibit different magnetic behaviors, depending on the Mn doping concentration. The Curie temperature was found to be dependent on both the Mn doping concentration and spacing between the doping layers. A sharp drop in magnetization and rise in resistivity are observed at low temperature in samples with high Mn doping concentrations, which is also accompanied by a negative thermal remanent magnetization (TRM) in the higher temperature range. The temperature at which the magnetization starts to drop and the negative TRM appears show a correlation with the Mn doping concentration. The experimental results are discussed based on the formation of ferromagnetic regions at high temperature and antiferromagnetic coupling between these regions at low temperature.     

Writing Waveguide in LN With fs Laser

We investigated the waveguide formation in Lithium Niobate with Femtosecond laser pulse writing directly. The output optical field through waveguide has been observed and refractive-index change was characterized by using grating method.     

An Area Optimization Method for Digital Filter Design

In this paper, we propose an efficient design method for area optimization in a digital filter. The conventional methods to reduce the number of adders in a filter have the problem of a long critical path delay caused by the deep logic depth of the filter due to adder sharing. Furthermore, there is such a disadvantage that they use the transposed direct form (TDF) filter which needs more registers than those of the direct form (DF) filter. In this paper, we present a hybrid structure of a TDF and DF based on the flattened coefficients method so that it can reduce the number of flip‐flops and full‐adders without additional critical path delay. We also propose a resource sharing method and sharing‐pattern searching algorithm to reduce the number of adders without deepening the logic depth. Simulation results show that the proposed structure can save the number of adders and registers by 22 and 26%, respectively, compared to the best one used in the past.