Using I2P (Invisible Internet Protocol) Encrypted Virtual Tunnels for a Secure and Anonymous Communication in VANets: I2P Vehicular Protocol (IVP)

Wireless Personal Communications - The Invisible Internet Project (I2P) as a secure protocol uses robust mechanisms and strong algorithms to reinforce the security and the anonymity of the...     

Determination of titanium content in pyrope by Raman spectroscopy

The titanium content of pyrope garnet can be quantified using the intensity of a Raman band at about 830 cm⁻¹ that is normalized to the 363 cm⁻¹ band using a spectrometer‐specific calibration using 10 to 15 chromian pyropes from Bohemia, Czech Republic. An accuracy of 0.025 wt% could be achieved for TiO₂ contents between 0.17 and 0.67 wt% TiO₂ with a Raman spectrometer with a spectral resolution of better than 3.9 cm⁻¹. The technique can be used in petrological and gemmological studies. Copyright © 2015 John Wiley & Sons, Ltd.     

Known good die meets chip size package

The increasing density, functionality, and high speed performance of integrated circuit components are fueling demands for smaller and faster portable electronic systems. Designers are becoming more experienced at cutting size, delays, and costs wherever possible. One area that offers attractive benefits for reducing size and improving performance is in the IC package itself, either eliminating it altogether, or reducing the size to the point where it takes up very little more space than the IC. In that context, chip size packages (CSPs) offer a viable solution to the problem. The electrical performance of a circuit is degraded by any capacitance, inductance, and lead length added to the IC bond pads. In addition to the performance limitations of the IC package itself, the larger footprint of the package implies that the next level of interconnect will also be sub optimal due to size and fanout of the IC interconnections. CSPs address these problems, too     

Known Good Die

Advances in reducing size and increasing functionality of electronics have been due primarily to the shrinking geometries and increasing performance of integrated circuit technologies. Recently, development efforts aimed at reducing size and increasingfunctionality have focused on the first level of the electronicpackage. The result has been the development of multichip packaging,technologies in which bare IC chips are mounted on a single high density substrate that serves to package thechips, as well as interconnect them. A number of benefits accruebecause of multichip packaging, namely, increased chip density,space savings, higher performance, and less weight. Therefore, thesetechnologies are attractive for today's light weight, portable, highperformance electronic equipment and devices.In spite of these benefits, multichip packaging has not shown the kind of explosive growth and expansion that was predicted[1]. A major inhibitor for these technologies has been theavailability of fully tested and conditioned bare die, orknown good die. This paper reviews the issues and technologies associated with test and burn-in of bareor minimally packaged IC products.     

Deeply bound 1s and 2p pionic states in 205Pb and determination of the s-wave part of the pion-nucleus interaction

We observed well-separated 1s and 2p pi(-) states in 205Pb in the 206Pb(d,3He) reaction at T(d) = 604.3 MeV. The binding energies and the widths determined are B(1s) = 6.762+/-0.061 MeV, Gamma(1s) = 0.764(+0.154)(-0.171) MeV, B(2p) = 5.110+/-0.045 MeV, and Gamma(2p) = 0.321(-0.062)(+0.060) MeV. They are used to deduce the real and imaginary strengths of the s-wave part of the pion-nucleus interaction, which translates into a positive mass shift of pi(-) in 205Pb.     

Validity of the NLS approximation for periodic quantum graphs

We consider a nonlinear Schrödinger (NLS) equation on a spatially extended periodic quantum graph. With a multiple scaling expansion, an effective amplitude equation can be derived in order to describe slow modulations in time and space of an oscillating wave packet. Using Bloch wave analysis and Gronwall’s inequality, we estimate the distance between the macroscopic approximation which is obtained via the amplitude equation and true solutions of the NLS equation on the periodic quantum graph. Moreover, we prove an approximation result for the amplitude equations which occur at the Dirac points of the system.     

Discovery of deeply bound π− states in the208Pb(d,3He) reaction

Narrow lines were observed around 133 MeV excitation energy in the²⁰⁸Pb(d,³He) reaction atT _d=300 MeV/u using the Fragment Separator System at GSI. They are assigned to the deeply boundπ ^??²⁰⁷Pb states with configurations of $\left( {2p} \right)_{\pi ^ - } $ (3p_1/2, 3p_3/2) _n ^?1 .