Z′ mediated flavor changing neutral currents in B meson decays

We study the effects of an extra U(1)′ gauge boson with flavor changing couplings with fermion mass eigenstates on certain B meson decays that are sensitive to such new physics contributions. In particular, we examine to what extent the current data on B_d→φK and B_d→η′K decays may be explained in such models, concentrating on the example in which the flavor changing couplings are left-chiral. We find that within reasonable ranges of parameters, the Z′ contribution can readily account for the anomaly in S_φKS but is not sufficient to explain large branching ratio of B_d→η′K with the same parameter value. S_φKS and S_η′KS are seen to be the dominant observables that constrain the extra weak phase in the model.     

闪存器与移动电子设备

闪存器技术于上世纪80年代中期面世,在不到20年的时间里,就出现了迅猛增长,其应用范围从个人电脑的引导代码存储一直到近期出现的PDA、数码相机和手机中的代码和数据存储。随着移动电子的持续增长,我们对在移动电子中获得成功应用的闪存器功能和优点进行一次回顾。闪存器的历史沿革“闪存(Flash)”这一名称,是源于该存储器件只需单步操作即能擦除其中所有内容的能力。军用装备很早就从这一能力中获益,军用装备都包含机密信息,一旦即将落入敌手,就应该迅速予以破坏。与EEPROM类似,Flash的数据存储也是通过向其晶体管栅区存入电荷来实现…     

Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis

The stress buffer layer (SBL) is a widely applied improvement in many advanced packages used to release the stress concentration at solder joints. However, it has been generally found that the metal line adjacent to the SBL may suffer larger deformation and its reliability should be addressed. In this study, the panel level package (PLP) technology with solder on polymer (SOP) structure is selected as the testing sample to investigate the effect of SBL. The ball shear strength test is conducted first to investigate the reliability of metal trace in PLP. In addition, finite element (FE) analysis is applied to understand the actual thermo-mechanical behavior of PLP after its assembly. The package-level and board-level reliability assessments are compared, and the suggested layout of the redistribution layer on the SBL is provided herein.     

A wafer-level microcap array to enable high-yield microsystem packaging

Packaging represents a significant and expensive obstacle in commercializing microsystem technology (MST) devices such as microelectromechanical systems (MEMS), microopticalelectromechanical systems (MOEMS), microsensors, microactuators, and other micromachined devices. This paper describes a novel wafer-level protection method for MSTs which facilitate improved manufacturing throughput and automation in package assembly, wafer-level testing of devices, and enhanced device performance. The method involves the use of a wafer-sized microcap array. This array consists of an assortment of small caps molded onto a material with adjustable shapes and sizes to serve as protective structures against the hostile environments associated with packaging. It may also include modifications which enhance its adhesion to the MST wafer or increase the MST device function. Depending on the application, the micromolded cap can be designed and modified to facilitate additional functions, such as optical, electrical, mechanical, and chemical functions, which are not easily achieved in the device by traditional means. The fabrication and materials selection of the microcap device is discussed in this paper. The results of wafer-level microcap packaging demonstrations are also presented.     

Birefringence in benzocyclobutene strip optical waveguides

We report the fabrication of benzocyclobutene strip optical waveguides and the measurement of their birefringence properties. To take into account the stress-induced birefringence in the waveguide, we generalize the formulas reported previously for the analysis of strip waveguides. Our experimental results are shown to agree closely with the theoretical calculation. The condition for achieving zero modal birefringence by control of the aspect ratio of the strip of the waveguide is highlighted. The dependence of the birefringence in the waveguides on the temperature is also measured and discussed.     

ROI-based Watermarking Scheme for JPEG 2000

A new region of interest (ROI)-based watermarking method for JPEG 2000 is presented. The watermark is embedded into the host image based on the characteristics of the ROI to protect rights to the images. This scheme integrates the watermarking process with JPEG 2000 compression procedures. Experimental results have demonstrated that the proposed watermark technique successfully survives JPEG 2000 compression, progressive transmission, and principal attacks.     

Synthesis of 5‐Radioiodoarabinosyl Uridine Analog for Probing the HSV‐1 Thymidine Kinase Gene

Tumor cells transduced with herpes simplex virus thymidine kinase gene have been intensively applied to the field of positron emission tomography via imaging of its substrate. As a pilot synthesis approach, a facile preparation of 5‐[¹²⁵I] iodoarabinosyl uridine starting from commercially available uridine is reported herein.     

Study of ferromagnetism–superconductivity interactions in Co/Nb multilayers

We investigate Co/Nb multilayers to explore the spontaneous π-phase shift between the superconducting (SC) layers, which is attributed for causing the non-monotonic change of the SC transition temperature (T_c) with the ferromagnetic (FM) layer thickness (t_FM) in several FM/SC multilayered systems. The issue of interfacial roughness is also explored by growing Co/Nb multilayers at various sputtering pressures. Transport measurements show a non-monotonic dependence of T_c on t_FM, and this dependence is insensitive to the structural variation present in the samples, as measured by X-ray scattering.