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1.
A. Swinnen I. Haeldermans M. vandeVen J. D'Haen G. Vanhoyland S. Aresu M. D'Olieslaeger J. Manca 《Advanced functional materials》2006,16(6):760-765
A new ordered structure of the C60 derivative PCBM ([6‐6]‐phenyl C61‐butyric acid methyl ester) is obtained in thin films based on the blend PCBM:regioregular P3HT (poly(3‐hexylthiophene)). Rapid formation of needlelike crystalline PCBM structures of a few micrometers up to 100 μm in size is demonstrated by submitting the blended thin films to an appropriate thermal treatment. These structures can grow out to a 2D network of PCBM needles and, in specific cases, to spectacular PCBM fans. Key parameters to tune the dimensions and spatial distribution of the PCBM needles are blend ratio and annealing conditions. The as‐obtained blended films and crystals are probed using atomic force microscopy, transmission electron microscopy, selected area electron diffraction, optical microscopy, and confocal fluorescence microscopy. Based on the analytical results, the growth mechanism of the PCBM structures within the film is described in terms of diffusion of PCBM towards the PCBM crystals, leaving highly crystalline P3HT behind in the surrounding matrix. 相似文献
2.
Farzaneh Fayazpour Bart Lucas Roosmarijn E. Vandenbroucke Stefaan Derveaux Jan Tavernier Sam Lievens Joseph Demeester Stefaan C. De Smedt 《Advanced functional materials》2008,18(18):2716-2723
To obtain more biologically relevant data there is a growing interest in the use of living cells for assaying the biological activity of unknown chemical compounds. Density ‘multiplex’ cell‐based assays, where different cell types are mixed in one well and simultaneously investigated upon exposure to a certain compound are beginning to emerge. To be able to identify the cells they should be attached to microscopic carriers that are encoded. This paper investigates how digitally encoded microparticles can be loaded with cells while keeping the digital code in the microcarriers readable. It turns out that coating the surface of the encoded microcarriers with polyelectrolytes using the layer‐by‐layer (LbL) approach provides the microcarriers with a ‘highly functional’ surface. The polyelectrolyte layer allows the growth of the cells, allows the orientation of the cell loaded microcarriers in a magnetic field, and does not hamper the reading of the code. It has further been shown that the cells growing on the polyelectrolyte layer can become transduced by adenoviral particles hosted by the polyelectrolyte layer. It is concluded that the digitally encoded microparticles are promising materials for use in biomedical and pharmaceutical in‐vitro research where cells are used as tools. 相似文献
3.
Bart M. J. M. Suijkerbuijk Duncan M. Tooke Anthony L. Spek Gerard van Koten Robertus J. M. Klein Gebbink Prof. Dr. 《无机化学与普通化学杂志》2007,633(15):2649-2653
A tin(IV) porphyrin was combined with two axial NCN‐pincer platinum(II) fragments by utilizing the oxophilicity of the apical positions on the tin atom and the acidic nature of the NCN‐pincer platinum derived benzoic acid. The solid‐state structure determined by X‐ray crystallography revealed some close contacts between the pincer complexes and the meso‐p‐tolyl subsitutents of the porphyrin. It was shown by 1H NMR spectroscopy that these close contacts were not present in solution and that this compound can potentially act as a novel building block for supramolecular architectures. 相似文献
4.
Yu Yang Hugo Bender Kai Arstila Bart Swinnen Bert Verlinden Ingrid De Wolf 《Microelectronics Reliability》2008,48(8-9):1517-1520
Focused ion beam (FIB) and nano-probing were applied for failure analysis of three-dimensional stacked circuits with copper through-silicon-vias between the stacked chips. The failure analysis was done after high temperature storage and thermal cycling tests. Passive voltage contrast in FIB allowed to pinpoint the open sites. FIB cross-sections showed the presence of opens at the bottom of the copper vias. The failure cause was suspected to be an interlayer particle, which was confirmed by optical profilometry. Nano-probing was used on another sample to pinpoint the failure location through the measurement of the local resistance within the daisy chains. The failure was traced out to be related with surface contamination. 相似文献
5.
Bart De Bruyn 《Journal of Algebraic Combinatorics》2006,24(1):23-29
Brouwer and Wilbrink [3] showed the nonexistence of regular near octagons whose parameters s, t2, t3 and t satisfy s ≥ 2, t2 ≥ 2 and t3 ≠ t2(t2+1). Later an arithmetical error was discovered in the proof. Because of this error, the existence problem was still open
for the near octagons corresponding with certain values of s, t2 and t3. In the present paper, we will also show the nonexistence of these remaining regular near octagons.
MSC2000 05B25, 05E30, 51E12
Postdoctoral Fellow of the Research Foundation - Flanders 相似文献
6.
Valuations of dense near polygons were introduced in 16 . In the present paper, we classify all valuations of the near hexagons ??1 and ??2, which are related to the respective Witt designs S(5,6,12) and S(5,8,24). Using these classifications, we prove that if a dense near polygon S contains a hex H isomorphic to ??1 or ??2, then H is classical in S. We will use this result to determine all dense near octagons that contain a hex isomorphic to ??1 or ??2. As a by‐product, we obtain a purely geometrical proof for the nonexistence of regular near 2d‐gons, d ≥ 4, whose parameters s, t, ti (0 ≤ i ≤ d) satisfy (s, t2, t3) = (2, 1, 11) or (2, 2, 14). The nonexistence of these regular near polygons can also be shown with the aid of eigenvalue techniques. © 2005 Wiley Periodicals, Inc. J Combin Designs 14: 214–228, 2006 相似文献
7.
8.
Arun Chandrasekhar Steven Brebels Serguei Stoukatch Eric Beyne Walter De Raedt Bart Nauwelaers 《Microelectronics Reliability》2003,43(3):351-357
At frequencies beyond 1 GHz, every component of the IC package contributes to the RF performance, whether required or not. In this work, we study the effects of packaging materials namely, the substrate and the globtop/underfill material on RF performance. We have measured interconnects on two area-array CSPs, the ball grid array and the polymer stud grid array using IMEC’s MCM-D technology. The measurements on the package interconnect show that the losses in the package substrate material account for about 50% of the total losses at 1.8 GHz and this drops to less than 20% at 5.2 GHz. The losses due to impedance mismatch dominate the losses especially below 10 GHz and considerable improvement in performance cannot be obtained by using an improved/expensive substrate. The other study is about the influence of globtop/underfill materials on wirebonds (through 3D EM simulations) as well as on standard 50 Ω MCM-D transmission lines (through experiments). While a higher value of dielectric constant of the globtop/underfill material is better on wirebonds, the influence of loss tangent is felt only above values of 0.1. The influence of seven different globtop/undefill materials on 50 Ω transmission lines has been used to extract their dielectric constant and loss tangent values at 30 GHz. These results are very valuable since one can hardly find the properties of globtop/underfill materials beyond 1 GHz. 相似文献
9.
The notion of pseudorandomness is the theoretical foundation on which to consider the soundness of a basic structure used in some block ciphers. We examine the pseudorandomness of the block cipher KASUMI, which will be used in the next‐generation cellular phones. First, we prove that the four‐round unbalanced MISTY‐type transformation is pseudorandom in order to illustrate the pseudorandomness of the inside round function FI of KASUMI under an adaptive distinguisher model. Second, we show that the three‐round KASUMI‐like structure is not pseudorandom but the four‐round KASUMI‐like structure is pseudorandom under a non‐adaptive distinguisher model. 相似文献
10.
Adrian Maxim Ramin Poorfard Bart DeCanne 《电子设计应用》2007,(8):82-84,85,91
CMOS技术是把L波段卫星调谐器、解调器和其它功能整合至低成本、高效能单芯片的关键。本文将探讨新型低中频和传统零中频DBS调谐器架构在单芯片DBS射频前端设计中的优缺点。 相似文献