High-performance liquid chromatographic determination of isepamicin in plasma, urine and dialysate

A high-performance liquid chromatographic method for the measurement of isepamicin, a new aminoglycoside, in plasma, urine and dialysate is reported. The assay utilizes a simple extraction of isepamicin in plasma using commercially available Cyano solid-phase cartridges and dilution of urine and dialysate samples. The separation is performed on a Hypersil C18 column (15 cm X 4.6 mm I.D., 5 microns particle size) and utilizes a mobile phase consisting of 10% methanol and 90% buffer solution containing 0.01 M sodium hexanesulfonate, 0.1 M sodium sulfate and 17 mM acetic acid. The flow-rate is 1.1 ml/min. Dibekacin is used as the internal standard. Isepamicin is derivatized post-column with o-phthalaldehyde for spectrofluorometric detection. The method can also be used for the measurement of other aminoglycosides, i.e. tobramycin, kanamycin, netilmicin and gentamicin. The assay is fast, accurate and has a quantitation limit of 100 ng/ml isepamicin in plasma and 50 ng/ml in urine and dialysate.     

VISCOMETRIC STUDY OF POLY(METHYL METHACRYLATE) AND POLYSTYRENE BLENDS IN DIFFERENT SOLVENTS

The intermolecular interaction between poly(methyl methacrylate) (PMMA) and polystyrene (PS) intetrahydrofuran (THF) and N,N'-dimethyl formamide (DMF) solvents was studied at 28℃ using a dilute solution viscometrymethod. Solvent is believed to play a key role in characterizing the viscosity behavior of the polymer solution. The intrinsicviscosity and viscosity interaction parameter were experimentally measured for the binary (solvent/polymer) and for theternary systems in two solvents. The compatibility of the polymer mixture was discussed in terms of the sign of △b_m. Theresults show that the compatibility of PMMA/PS blend in DMF is larger than that in THF.     

Studies on crystals of <Emphasis Type="SmallCaps">d</Emphasis>-, <Emphasis Type="SmallCaps">l</Emphasis>-, and <Emphasis Type="SmallCaps">dl</Emphasis>-alaninato nickel(II) complexes

An attempt to link the heat of reaction obtained from analysis of UV spectra, bond energies deduced from crystallographic data and calorimetric measurements of [bis(d-, l-, and dl-alaninato)diaqua] nickel(II) dihydrate complexes to theoretical values obtained from calculation is described. The heat of reaction, which includes energy of ligand exchange in addition to crystal field stabilization energy of the three complexes, was calculated from changes in spectral shifts, bond lengths, and free energy between nickel(II) ion and the d-, l-, and dl-alanine complexed nickel(II) ion in aqueous solution. These investigations were done by UV–visible spectroscopy, X-ray crystallography, and isothermal calorimetry. The results reveal that the experimental heat of reaction based on the three mentioned parameters is in good agreement with the theoretical value. The results are found to be of considerable interest in its linking of spectrochemical quantities with thermodynamic functions.     

Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions

The behavior of lead-free solder alloys under complex loading scenarios is still not well understood. Common damage accumulation rules fail to account for strong effects of variations in cycling amplitude, and random vibration test results cannot be interpreted in terms of performance under realistic service conditions. This is a result of the effects of cycling parameters on materials properties. These effects are not yet fully understood or quantitatively predictable, preventing modeling based on parameters such as strain, work, or entropy. Depending on the actual spectrum of amplitudes, Miner’s rule of linear damage accumulation has been shown to overestimate life by more than an order of magnitude, and greater errors are predicted for other combinations. Consequences may be particularly critical for so-called environmental stress screening. Damage accumulation has, however, been shown to scale with the inelastic work done, even if amplitudes vary. This and the observation of effects of loading history on subsequent work per cycle provide for a modified damage accumulation rule which allows for the prediction of life. Individual joints of four different Sn-Ag-Cu-based solder alloys (SAC305, SAC105, SAC-Ni, and SACXplus) were cycled in shear at room temperature, alternating between two different amplitudes while monitoring the evolution of the effective stiffness and work per cycle. This helped elucidate general trends and behaviors that are expected to occur in vibrations of microelectronics assemblies. Deviations from Miner’s rule varied systematically with the combination of amplitudes, the sequences of cycles, and the strain rates in each. The severity of deviations also varied systematically with Ag content in the solder, but major effects were observed for all the alloys. A systematic analysis was conducted to assess whether scenarios might exist in which the more fatigue-resistant high-Ag alloys would fail sooner than the lower-Ag ones.     

Effects of latent damage of recrystallization on lead free solder joints

Recrystallization behavior and microstructure evolution during liquid–liquid thermal shock of lead free solder alloys have been investigated in this study. SAC305 (Sn–3.0Ag–0.5Cu) solder alloy was used as the base solder alloy in which 5 different pitch sizes of ball grid array (BGA) were cycled in liquid–liquid thermal shock with (0/100 °C) profile and almost zero dwell time. The results show that recrystallization takes place in all BGA assemblies regardless of pitch size, but at different times. However, the larger the pitch sizes the sooner recrystallization will take place. This partially due to strain magnitude difference between central and outer joints. Thus larger pitch size coupons were subjected to higher strain magnitude, especially corner joints and hence recrystallization takes place on these coupons earlier. Moreover, it was found that cracks usually start and extend along the recrystallized regions.     

The role of nickel(II) on the homochirality of amino acids in living systems

<正>The origin of homochirality in living organisms is controversial,stands out of being particularly important and a question which is still not satisfactorily answered.A mental picture of sequence of events that is thought to have preceded the existence of chirality in molecules is described.A chemical model to mimic the original abiotic conditions in an attempt to explain the preference of homochirality in living systems was tried.The effect which might have influenced this preference is presented.The surprising and unexpected results are indeed interesting,significant,repeatable and indicate that complexing alanine with nickel(Ⅱ) ion alters the racemization rates of D and L isomers of the amino acid.However,why this difference happens is unclear and is difficult to explain.     

Exact Error Rate Analysis of MIMO-MRC System under Cochannel Interference and Imperfect Channel State Information

In this paper, we derive closed-form solution for the bit error rate of multi-input multi-output (MIMO) system with maximum ratio combining. We consider binary PSK modulation suffers from cochannel interference (CCI) and imperfect channel state information (CSI). We assume a propagation model wherein the desired and interfering signals undergo independent and identically distributed (i.i.d.) Rayleigh fading channels. Furthermore, the signal-to-noise ratio (SNR) gain penalty caused by the interference signals and the root mean square of the CSI were demonstrated. The numerical results presented in this paper demonstrate the system performance under very realistic propagation and detection conditions including MIMO system, CCI, imperfect CSI, generalized fading channels, and AWGN. Hence our results are expected to be of significant practical use for such scenarios.     

Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue

The recrystallization of β-Sn profoundly affects deformation and failure of Sn-Ag-Cu solder joints in thermomechanical fatigue (TMF) testing. The numerous grain boundaries of recrystallized β-Sn enable grain boundary sliding, which is absent in as-solidified solder joints. Fatigue cracks initiate at, and propagate along, recrystallized grain boundaries, eventually leading to intergranular fracture. The recrystallization behavior of Sn-Ag-Cu solder joints was examined in three different TMF conditions for five different ball grid array component designs. Based on the experimental observations, a TMF damage accumulation model is proposed: (1) strain-enhanced coarsening of secondary precipitates of Ag₃Sn and Cu₆Sn₅ starts at joint corners, eventually allowing recrystallization of the Sn grain there as well; (2) coarsening and recrystallization continue to develop into the interior of the joints, while fatigue crack growth lags behind; (3) fatigue cracks finally progress through the recrystallized region. Independent of the TMF condition, the recrystallization appeared to be essentially complete after somewhat less than 50% of the characteristic life, while it took another 50% to 75% of the lifetime for a fatigue crack to propagate through the recrystallized region.