微放电检测方法分析

首先分析了微放电的影响,指出了微放电检测的重要性。总结了现有的微放电检测方法,并对其进行分析,结合工程实践总结了各种检测方法的优缺点及适用范围。最后,总结分析了微放电检测方法,并指出了微放电检测方法的研究趋势。     

微放电试验中种子电子加载方法比较

为改进微放电试验的有效性,针对微放电试验中种子电子的加载方法进行了研究,介绍了辐射源、紫外光源、电子枪三种加载方法,并说明和比较了上述方法的优缺点和适用范围。接着重点介绍了两种辐射源加载种子电子的方法：β衰变和γ跃迁,并对两种方法加载种子电子的特性进行了定量分析。所得结果表明,基于β衰变的⁹⁰Sr及同时进行β衰变和γ跃迁的¹³⁷Cs均可产生能够穿透毫米量级铝质微波部件壁厚的不同数量的种子电子, 适合用于微放电试验中的种子电子加载。     

移动通信微波部件无源互调干扰综述

在地面通信系统中,基站的微波部件长期暴露在外,受温度、湿度、污染等因素影响,原本洁净的部件表面受到氧化、沾污等,导致接触不良,产生无源互调(PIM),干扰通信系统,导致地面移动通信中PIM的干扰不可避免。卫星通信系统中,由于通信距离远、平台限制等,必须采用收发共用模式,随着接收机灵敏度提升,对PIM指标要求更高;因系统高可靠性要求,PIM成为系统成败的关键问题之一。本文介绍了地面移动通信和星载微波部件PIM干扰的特点和研究进展,以期对PIM研究提供参考。     

Effect of Cu doping on the secondary electron yield of carbon films on Ag-plated aluminum alloy

Reducing the secondary electron yield (SEY) of Ag-plated aluminum alloy is important for high-power microwave components. In this work, Cu doped carbon films are prepared and the secondary electron emission characteristics are studied systematically. The secondary electron coefficient δ_max of carbon films increases with the Cu contents increasing at first, and then decreases to 1.53 at a high doping ratio of 0.645. From the viewpoint of surface structure, the higher the content of Cu is, the rougher the surface is, since more cluster particles appear on the surface due to the small solid solubility of Cu in the amorphous carbon network. However, from viewpoint of the electronic structure, the reduction of the sp² hybrid bonds will increase the SEY effect as the content of Cu increases, due to the decreasing probability of collision with free electrons. Thus, the two mechanisms would compete and coexist to affect the SEY characteristics in Cu doped carbon films.     

tanx的连分数展开的注记

对于将两个无穷级数之比化为连分式的问题,构造一组递推公式,通过数学归纳法推导出tanx的连分式.