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This work focuses on numerical modeling of hydrostatic stress,which is critical to the formation of stress-induced voiding(SIV) in copper damascene interconnects.Using three-dimensional finite element analysis, the distribution of hydrostatic stress is examined in copper interconnects and models are based on the samples, which are fabricated in industry.In addition,hydrostatic stress is studied through the influences of different low-k dielectrics,barrier layers and line widths of copper lines,and the results indicate that hydrostatic stress is strongly dependent on these factors.Hydrostatic stress is highly non-uniform throughout the copper structure and the highest tensile hydrostatic stress exists on the top interface of all the copper lines. 相似文献
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低碳钢退火板中粗大晶粒成因的EBSD分析 总被引:2,自引:1,他引:1
以SPCD低碳钢罩式炉退火板为例,利用电子背散射衍射(EBSD)技术,针对晶粒尺寸不均匀样品中粗大晶粒的产生原因进行了分析.测量结果表明,大部分粗大晶粒为(111)//ND即{111}取向的晶粒;少数为<112>//ND即{112}取向的晶粒.其成因可能有两点:(1)热轧薄板表层中形成的粗大铁素体组织将会遗传到随后经冷轧-退火的钢板中,引起个别晶粒异常粗大;(2)AIN粒子钉扎作用的不均匀使具有生长优势的{111}和{112}晶粒长大,最终形成粗大的晶粒. 相似文献
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本文根据工业上使用的铜大马士革互连线尺寸建立了三维有限元模型,模拟计算了铜大马士革互连线中对应力诱导形成空洞很关键的静水应力分布,对比分析了不同低k介质、阻挡层材料和互连线深宽比对静水应力的影响。研究结果表明,静水应力受k介质、阻挡层材料和互连线深宽比影响很大,静水应力在铜大马士革互连线中分布不均匀且最大应力出现在互连线表面。 相似文献
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