Identification and elimination of inductively coupled plasma-induced defects in AlxGa1 - xN/GaN heterostructures

By using temperature-dependent Hall,variable-frequency capacitance-voltage and cathodoluminescence (CL) measurements,the identification of inductively coupled plasma (ICP)-induced defect states around the Al x Ga 1-x N/GaN heterointerface and their elimination by subsequent annealing in Al x Ga 1-x N/GaN heterostructures are systematically investigated.The energy levels of interface states with activation energies in a range from 0.211 to 0.253 eV below the conduction band of GaN are observed.The interface state density after the ICP-etching process is as high as 2.75×10 12 cm 2 ·eV 1.The ICP-induced interface states could be reduced by two orders of magnitude by subsequent annealing in N 2 ambient.The CL studies indicate that the ICP-induced defects should be Ga-vacancy related.     

GaN1-xPx三元合金的红外谱

对GaN1-xPx三元合金进行了红外谱的测试和拟合. 分析结果表明在GaN1-xPx三元合金中存在两个彼此竞争的机制制约着载流子浓度的变化. 一个是来自等电子陷阱的影响，它将减少三元合金中载流子的浓度；另一个来自缺陷的影响，它将增加三元合金中载流子的浓度. 对合金介电函数的倒数的虚部进行了计算，其结果显示，随着合金中P组分比的增加，纵向光学声子-等离激元（LPP）耦合模式向高频方向移动，同时LPP模式线宽逐渐增宽，说明随着合金中P组分比的增加，LPP模式的耦合作用增加，阻尼增强.     

GaN1-x Px三元合金的红外谱

对GaN1-xPx三元合金进行了红外谱的测试和拟合.分析结果表明在GaN1-xPx三元合金中存在两个彼此竞争的机制制约着载流子浓度的变化.一个是来自等电子陷阱的影响,它将减少三元合金中载流子的浓度;另一个来自缺陷的影响,它将增加三元合金中载流子的浓度.对合金介电函数的倒数的虚部进行了计算,其结果显示,随着合金中P组分比的增加,纵向光学声子-等离激元(LPP)耦合模式向高频方向移动,同时LPP模式线宽逐渐增宽,说明随着合金中P组分比的增加,LPP模式的耦合作用增加,阻尼增强.     

Comparision between Ga- and N-polarity InGaN solar cells with gradient-In-composition intrinsic layers

Performances of Ga-and N-polarity solar cells(SCs) adopting gradient-In-composition intrinsic layer(IL) are compared.It is found the gradient ILs can greatly weaken the negative influence from the polarization effects for the Gapolarity case,and the highest conversion efficiency(η) of 2.18%can be obtained in the structure with a linear increase of In composition in the IL from bottom to top.This is mainly attributed to the adsorptions of more photons caused by the higher In composition in the IL closer to the p-GaN window layer.In contrast,for the N-polarity case,the SC structure with an InGaN IL adopting fixed In composition prevails over the ones adopting the gradient-In-composition IL,where the highest η of 9.28%can be obtained at x of 0.62.N-polarity SC structures are proven to have greater potential preparations in high-efficient InGaN SCs.     

Thermal annealing behaviour of Al/Ni/Au multilayer on n-GaN Schottky contacts

Recently GaN-based high electron mobility transistors (HEMTs) have revealed the superior properties of a high breakdown field and high electron saturation velocity. Reduction of the gate leakage current is one of the key issues to be solved for their further improvement. This paper reports that an Al layer as thin as 3 nm was inserted between the conventional Ni/Au Schottky contact and n-GaN epilayers, and the Schottky behaviour of Al/Ni/Au contact was investigated under various annealing conditions by current--voltage (I--V) measurements. A non-linear fitting method was used to extract the contact parameters from the I--V characteristic curves. Experimental results indicate that reduction of the gate leakage current by as much as four orders of magnitude was successfully recorded by thermal annealing. And high quality Schottky contact with a barrier height of 0.875 eV and the lowest reverse-bias leakage current, respectively, can be obtained under 12 min annealing at 450°C in N₂ ambience.     

氢化作用对低能电子束辐照下GaN发光演变的影响

结合氢在GaN中的扩散特性,运用阴极荧光（CL）谱,对氢化前后低能电子束辐照下GaN带边发光强度的演变进行了研究.实验发现,氢化前GaN在低能电子束辐照下带边发光强度呈现衰减的趋势,而氢化后带边发射强度先上升后衰减,而且氢化后的衰减比氢化前弱.1 h辐照过程中,氢化后GaN带边发光强度的变化比氢化前要小很多.另外,实验中发现经过氢化处理的GaN在辐照后20 h内没有观察到带边发射强度的恢复.研究表明氢原子在GaN中可以钝化缺陷来增强发光,但这种钝化缺陷的作用必须通过克服高的扩散势垒来实现,而低能电子束可以 关键词： 阴极荧光 低能电子束 氢化 演变     

成核层退火压力对形成高阻GaN的作用

采用了MOCVD生长技术来获得高阻GaN,发现GaN的方块电阻会随着成核层退火压力的降低而迅速升高.当成核层退火压力降到75torr时,形成了高阻GaN,方块电阻达到1011Ω/□以上.原子力显微镜结果显示高阻GaN的表面非常平整,表面粗糙度只有0.15nm.在位激光检测发现高阻样品的成核层经过退火后会形成密度较高的成核岛.样品的X射线分析结果表明,随着退火压力的改变,刃型位错相对于螺型位错会有较大变化.说明刃型位错是GaN电阻变化的主要原因.     

GaN和AlxGa1-xN/CaN异质结的高温性质

通过高温Hall测量研究了GaN和AlxGa1-xN/GaN异质结从室温到500℃高温下的输运性质.实验发现GaN背景载流子浓度随着温度的升高而升高,载流子浓度变化的幅度和GaN的位错密度存在正比关系,持续光电导的跃迁幅度和GaN的位错密度也存在正比关系,说明位错相关的深施主或者陷阱对GaN在高温下的背景浓度有很大影响.实验发现AlxGa1-xN/GaN异质结中二维电子气的浓度在室温到250℃的范围内随着温度的升高而下降,然后随着温度的升高开始增加.前者主要是由于随着温度的升高,AlxGa1-xN/GaN异质结的导带不连续减小引起的,后者主要是由GaN层背景载流子浓度增加导致的.通过求解自洽的薛定谔和泊松方程得到的二维电子气浓度的温度关系和实验结果一致.     

GaN1-x Px三元合金的红外谱

对GaN1-xPx三元合金进行了红外谱的测试和拟合.分析结果表明在GaN1-xPx三元合金中存在两个彼此竞争的机制制约着载流子浓度的变化.一个是来自等电子陷阱的影响,它将减少三元合金中载流子的浓度;另一个来自缺陷的影响,它将增加三元合金中载流子的浓度.对合金介电函数的倒数的虚部进行了计算,其结果显示,随着合金中P组分比的增加,纵向光学声子-等离激元(LPP)耦合模式向高频方向移动,同时LPP模式线宽逐渐增宽,说明随着合金中P组分比的增加,LPP模式的耦合作用增加,阻尼增强.     

Epitaxial evolution on buried cracks in a strain-controlled AlN/GaN superlattice interlayer between AlGaN/GaN multiple quantum wells and a GaN template

Epitaxial evolution of buried cracks in a strain-controlled AlN/GaN superlattice interlayer(IL) grown on GaN template, resulting in crack-free AlGaN/GaN multiple quantum wells(MQW), was investigated. The processes of filling the buried cracks include crack formation in the IL, coalescence from both side walls of the crack, build-up of an MQW-layer hump above the cracks, lateral expansion and merging with the surrounding MQW, and two-dimensional step flow growth.It was confirmed that the filling content in the buried cracks is pure GaN, originating from the deposition of the GaN thin layer directly after the IL. Migration of Ga adatoms into the cracks plays a key role in the filling the buried cracks.