Influences of high-temperature annealing on atomic layer deposited Al2 O3/4H-SiC

High-temperature annealing of the atomic layer deposition (ALD) of Al2O3 films on 4H-SiC in O 2 atmosphere is studied with temperature ranging from 800℃ to 1000℃. It is observed that the surface morphology of Al2O3 films annealed at 800℃ and 900℃ is pretty good, while the surface of the sample annealed at 1000℃ becomes bumpy. Grazing incidence X-ray diffraction (GIXRD) measurements demonstrate that the as-grown films are amorphous and begin to crystallize at 900℃. Furthermore, C-V measurements exhibit improved interface characterization after annealing, especially for samples annealed at 900℃ and 1000℃. It is indicated that high-temperature annealing in O2 atmosphere can improve the interface of Al2O3 /SiC and annealing at 900℃ would be an optimum condition for surface morphology, dielectric quality, and interface states.     

不同退火温度下Mo/4H-SiC肖特基接触势垒不均匀及XRD分析北大核心

为探究退火温度对Mo/4H-SiC肖特基接触势垒不均匀程度的影响,对在不同退火温度下形成的Mo/4H-SiC肖特基接触进行了不同测试温度下的电流-电压（I-V）及电容-电压（CV）测试,运用Tung理论模型和＂T0反常＂中的T0值评价势垒不均匀程度,X射线衍射（XRD）分析肖特基接触的物相组成。分析结果表明,测试温度升高时I-V测试提取的势垒高度接近于C-V测试提取的势垒高度,退火温度500℃及以上时Mo与4H-SiC发生反应,且导致较低的势垒高度。退火温度为600℃时,肖特基接触具有最低的势垒不均匀程度,且此退火温度下势垒高度相对500℃及700℃时较高,物相组成为Mo2C及Mo4.8Si3C0.6。     

不同退火温度下Mo/4H-SiC肖特基接触界面特性分析

为研究退火温度对肖特基接触界面特性的影响,在不同温度下测试了不同退火温度处理的Mo/4H-SiC肖特基接触的I-V及C-V特性.根据金属-绝缘层-半导体(MIS)结构二极管模型理论,认为在金属与半导体间存在薄介质层,通过估算介质层电容值,得到了肖特基接触界面态密度(N88)的能级分布情况,N8s约为1012 eV-1·cm-2量级.退火温度升高,N8s的能级分布靠近导带底;测试温度升高,Ns8增加且其能级分布远离导带底.利用X射线光电子能谱(XPS)分析表征肖特基接触界面态化学组分,分析结果证实接触界面存在SiO.SiO组分随退火温度的升高而减少,在退火温度为500℃及以上时检测到Mo-C成分,说明Mo与4H-SiC发生反应.     

High-mobility SiC MOSFET with low density of interface traps using high pressure microwave plasma oxidation

The microwave plasma oxidation under the relatively high pressure(6 kPa)region is introduced into the fabrication process of SiO2/4 H-SiC stack.By controlling the oxidation pressure,species,and temperature,the record low density of interface traps(~4×10¹⁰cm^-2·eV^-1@Ec-0.2 eV)is demonstrated on SiO2/SiC stack formed by microwave plasma oxidation.And high quality SiO2 with very flat interface(0.27-nm root-mean-square roughness)is obtained.High performance Si C metal–oxide–semiconductor field-effect transistors(MOSFETs)with peak field effect mobility of 44 cm^-2·eV^-1is realized without additional treatment.These results show the potential of a high-pressure plasma oxidation step for improving the channel mobility in SiC MOSFETs.     

采用Ni/Ti/Ni多层金属在N型4H-SiC衬底改善粘附性和界面的欧姆接触

The Ni/Ti/Ni multilayer ohmic contact properties on a 4H-SiC substrate and improved adhesion with the Ti/Au overlayer have been investigated. The best specific contact resistivity of 3.16 × 10^-5 Ω.cm^2 was obtained at 1050 ℃. Compared with Ni/SiC ohmic contact, the adhesion between Ni/Ti/Ni/SiC and the Ti/Au overlayer was greatly improved and the physical mechanism under this behavior was analyzed by using Raman spectroscopy and X-ray energy dispersive spectroscopy （EDS） measurement. It is shown that a Ti-carbide and Ni-silicide compound exist at the surface and there is no graphitic carbon at the surface of the Ni/Ti/Ni structure by Raman spectroscopy, while a large amount of graphitic carbon appears at the surface of the Ni/SiC structure, which results in its bad adhesion. Moreover, the interface of the Ni/Ti/Ni/SiC is improved compared to the interface of Ni/SiC.     

表面为二维光子晶体结构的AlGaInP系发光二极管的研究

近年来,GaN基光子晶体发光二极管(light emitting diode,LED)的研究已经取得了一定的进展,利用光子晶体的光子带隙效应和光栅衍射原理,在LED上制作光子晶体结构将会提高出光效率.本文为了提高AlGaInP系LED的光提取效率,分析了常规LED光提取效率受到限制的原因,将光子晶体结构引入了AlGaInP系LED的器件结构设计,通过理论分析与实验验证,结果显示:光子晶体结构对于提高AlGaInP系LED的光提取效率同样起到了明显的效果,引入光子晶体后,LED的输出光强比常规结构LED平均 关键词： AlGaInP系LED 光子晶体 光提取效率 光强     

Improvement on short-circuit ability of SiC super-junction MOSFET with partially widened pillar structure

A novel 1200 V SiC super-junction (SJ) MOSFET with a partially widened pillar structure is proposed and investigated by using the two-dimensional numerical simulation tool. Based on the SiC SJ MOSFET structure, a partially widened P-region is added at the SJ pillar region to improve the short-circuit (SC) ability. After investigating the position and doping concentration of the widened P-region, an optimal structure is determined. From the simulation results, the SC withstand times (SCWTs) of the conventional trench MOSFET (CT-MOSFET), the SJ MOSFET, and the proposed structure at 800 V DC bus voltage are 15 μs, 17 μs, and 24 μs, respectively. The SCWTs of the proposed structure are increased by 60% and 41.2% in comparison with that of the other two structures. The main reason for the proposed structure with an enhanced SC capability is related to the effective suppression of saturation current at the high DC bias conditions by using a modulated P-pillar region. Meanwhile, a good Baliga's FOM ($BV^{2}/R_{\rm on}$) also can be achieved in the proposed structure due to the advantage of the SJ structure. In addition, the fabrication technology of the proposed structure is compatible with the standard epitaxy growth method used in the SJ MOSFET. As a result, the SJ structure with this feasible optimization skill presents an effect on improving the SC reliability of the SiC SJ MOSFET without the degeneration of the Baliga's FOM.     

带介质分布式Bragg反射镜结构高性能共振腔发光二极管的研究

采用等离子体增强化学气相沉积高低频交替生长法生长了SiO₂/Si₃N₄透明介质分布式Bragg反射镜(DDBR), 提出了对DDBR采用干、湿法并用的腐蚀方法. 采用传输矩阵法理论分析了DDBR, 得出了为满足出光增益要求的反射率和DDBR结构. 使用光致发光(PL)谱仪测量分析了DDBR反射谱和光致发光谱, 获得了使光致发光谱辐射增强的DDBR结构, 在整个光致发光谱380–780 nm波段, 整体辐射增强1.058倍, 在谐振波长处辐射增强1.5倍, 半峰全宽值由23 nm变窄为10.5 nm, 获得了很好的光谱纯度. 利用最优DDBR结构制成了高性能共振腔发光二极管器件, 与普通结构相比, 实现了低开启电压1.78 V; 在20 mA注入电流下, 轴向光强提高了20%, 光功率和光效分别提高了27.7%和26.8%, 光功率衰减缓慢; 在0–100 mA注入电流下, 没有明显的下降趋势, 表现出了良好的温度稳定性. 关键词： 发光二极管 共振腔 介质分布式布拉格反射镜 辐射增强     

Analysis of the inhomogeneous barrier and phase composition of W/4H-SiC Schottky contacts formed at different annealing temperatures

The electrical characteristics of W/4H-SiC Schottky contacts formed at different annealing temperatures have been measured by using current-voltage-temperatures(I-V -T) and capacitance-voltage-temperatures(C-V -T) techniques in the temperature range of 25℃-175℃. The testing temperature dependence of the barrier height(BH) and ideality factor(n) indicates the presence of inhomogeneous barrier. Tung's model has been applied to evaluate the degree of inhomogeneity, and it is found that the 400℃ annealed sample has the lowest T0 of 44.6 K among all the Schottky contacts. The barrier height obtained from C-V -T measurement is independent of the testing temperature, which suggests a uniform BH.The x-ray diffraction(XRD) analysis shows that there are two kinds of space groups of W when it is deposited or annealed at lower temperature(≤500℃). The phase of W_2C appears in the sample annealed at 600℃, which results in the low BH and the high T_0. The 500℃ annealed sample has the highest BH at all testing temperatures, indicating an optimal annealing temperature for the W/4H-SiC Schottky rectifier for high-temperature application.     

槽栅型SiC MOSFET器件单粒子响应特性研究

利用TCAD Sentaurus模拟仿真软件,研究分析了三种不同结构的槽栅型1 200 V SiC MOSFET单粒子响应特性,器件包括传统单沟槽MOSFET、双沟槽MOSFET和非对称沟槽MOSFET结构。仿真结果表明,双沟槽MOSFET的抗单粒子特性优于其它两种结构器件。通过分析可知,双沟槽MOSFET结构的优越性在于有较深的源极深槽结构,有助于快速收集单粒子碰撞过程产生的载流子,从而缓解大量载流子聚集带来的内部电热集中,相比其它两种结构能有效抑制引起单粒子烧毁的反馈机制。