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目前,随着集成电路规模的不断发展,传统的铝互连技术已由铜互连技术取代。铜的超填充主要采用Damascene工艺进行电镀。在电镀液中有机添加剂(包括加速剂、抑制剂和平坦剂)虽然含量很少,但对镀层性能的影响至关重要。本文以Enthone公司的ViaForm系列添加剂为例,研究了不同添加剂浓度组合对脉冲铜镀层性能的影响。 相似文献
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目前,随着集成电路规模的不断发展,传统的铝互连技术已由铜互连技术取代。铜的超填充主要采用Damascene工艺进行电镀。在电镀液中有机添加剂(包括加速剂、抑制剂和平坦剂)虽然含量很少,但对镀层性能的影响至关重要。本文以Enthone公司的ViaForm系列添加剂为例,研究了不同添加剂浓度组合对脉冲铜镀层性能的影响。 相似文献
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Preparation of Ultra Low- k Porous SiOCH Films from Ring-Type Siloxane with Unsaturated Hydrocarbon Side Chains by Spin-On Deposition
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An ultra-low-dielectric-constant (ultra low-k, or ULK) porous SiOCH film is prepared using a single ring-type siloxane precursor of the 2,4,6,8-tetravinyl-2,4,6,8-tetramethylcyclotetrasiloxane by means of spin-on deposition, followed by crosslinking reactions between the precursor monomers under UV irradiation. The as-prepared film has an ultra low k of 2.41 at 1 MHz due to incorporation of pores and hydrocarbon crosslinkages, a leakage current density of 9.86×10-7 A/cm2 at 1 MV/cm, as well as a breakdown field strength of ~1.5 MV/cm. Further, annealing at 300°C results in lower k (i.e., 1.94 at 1 MHz), smaller leakage current density (2.96×10-7 A/cm2 at 1 MV/cm) and higher breakdown field strength (about 3.5 MV/cm), which are likely caused by the short-ranged structural rearrangement and reduction of defects in the film. Finally, the mechanical properties and surface morphology of films are also evaluated after different temperature annealing. 相似文献
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