硼、砷双注入载流子浓度分布的测量及计算机模拟

本文研究了双极型器件中硼、砷双注入载流子浓度分布的规律,考察了双注入情况下两者的相互作用。为了模拟基区载流子的浓度分布,用一个指数衰变场来模拟基区载流子在E-B结处的下陷,用有效扩散系数模拟尾部的增强扩散效应.并调试了计算双注入的载流子浓度分布的程序.     

高剂量As注入单晶Si低温加热和高温电子束两步退火性能研究

本文研究高剂量As注入P-Si单晶,经过低温热退火和高温电子束扫描两步退火方式后的性能。用高压电子显微镜观察样品注入层的剩余缺陷,结果表明:只经过一步高温热退火或电子束退火的样品,剩余缺陷密度为10~3/cm~2以上,线缺陷长度为2-4μm,有位错环和位错网存在.两步退火后,样品注入层的缺陷密度降到10~7/cm~2量级,线缺陷长度小于0.5μm.位错网消失。     

Effect of void formation during MEVVA tungsten ion implantation on the microstructure and surface properties of H13 die steel

H13 die steel was implanted with tungsten using a metal vapour vacuum arc (MEVVA) ion source. When the pulsed beam current density of tungsten ions increased to 6mA?cm^-2, some voids appeared in the high voltage electron microscope (HVEM) micrograph, which would disappear at an annealing temperature of 600℃. HVEM and x-ray diffraction were used for observing the phase structure of the annealed and un-annealed H13 steel after the steel was implanted. Results of wear and hardness tests indicated that whether the voids appear significantly influences the hardness and wear of H13 steel. Reasons for the formation of voids and the relation between the surface mechanical property and voids are discussed in terms of collision theory.     

(Si,Er)双注入热氧化硅的光致发光

采用强流金属蒸汽真空弧（MEVVA）离子源注入机，先将Si大束流注入热氧化SiO2/单晶硅，直接形成镶嵌在SiO2中的纳米晶Si，再小束流注入Er。Er离子在掺杂层中的浓度可达10^21cm^-3量级，大大地提高了作为孤立发光中心的Er^3 浓度。在77K和室温下，观察到了Er^3 的1.54цm特征发射。     

强流金属离子束材料表面改性研究

综合评述了本课题组在金属离子注入钢强化机理、表面摩擦学、抗磨损特性、离子注入表面热化学效应、硅化物合成、表面抗氧化和抗腐蚀研究中所取得的新的实验结果． A review of our research work is given in this paper. It is about strengthening mechanism; surface trobology; resistance in wear, oxidation and corrosion; thermal atom chemistry in steel during ion implantation; silicides synthesis.     

注钼纯铝的研究

利用从金属蒸汽真空弧离子源（简称ＭＢＶＶＡ源）引出的强束流钼离子对纯铝进行了不同束流密度的离子注入。加速电压为４８ｋＶ，剂量为３×１０￣（１７）ｃｍ￣（－２），束流密度为２５和４７μＡ·ｃｍ￣（－２），Ｘ衍射分析证明在注入层内可形成Ａｌ＿（１２）Ｍｏ晶体，背散射（ＲＢＳ）分析证明Ａｌ＿（１２）Ｍｏ的厚度可达６００至７００ｎｍ。     

钛离子注入硅薄层硅化物结构和特性

用大束流密度的钛金属离子注入硅,能够直接合成性能良好的薄层硅化物,随束流密度的增加,硅化钛生长,薄层硅化物的薄层电阻（Ｒｓ） 明显下降,当束流密度（Ｊ）为０－７５Ａ／ｍ２ 时,Ｒｓ 达到最小值１６Ω／□,电阻率达到０－６４μΩ·ｍ 。经过１０５０ ℃快速退火２０ｓ 后,Ｒｓ 可下降到２－２Ω／ □,说明退火可进一步改善硅化钛的质量。扫描电子显微镜观察表明,枝状连续的硅化物已经形成。Ｘ衍射分析表明,注入层中形成了ＴｉＳｉ和ＴｉＳｉ２ 。背散射分析表明,其薄层厚度为８０ｎｍ 。利用ＭＥＶＶＡ金属离子注入,可获得直径达到Φ５００ｍ ｍ 注入斑点。     

Phase transition and pitting corrosion behaviour for Mo—implanted aluminium

Molybdenum ions are implanted into aluminium with high ion flux and high dose at elevated temperatures of 200℃, 400℃ and 500℃. Due to the high temperature and high flux of vacancies and interstitial atoms, the atom diffusion and chemical effects are enhanced during the ion implantation. The effects increase with increasing ion flux and dose, so that new phase formation and phase transition emerge noticeably. X-ray diffraction analysis shows that when the aluminium is implanted with Mo ions at a low ion flux (25μA/cm²), the Al₅Mo alloy is formed. The atomic ratio of Mo/Al of the Al₅Mo phase is close to 20%. When the aluminium is implanted with Mo ions at a high ion flux (50μA/cm²), the phase transition from Al₅Mo to Al₁₂Mo appears, and the latter is dominant, which is determined to be the final phase. The ratio of Mo/Al in Al₁₂Mo is 7.7%. Rutherford backscattering spectroscopy indicates also that the Mo/Al atom ratio is ～7% to ～8% in Mo-implanted aluminium. The atomic ratios of the constituents in Al₅Mo and Al₁₂Mo are of stoichiometric composition for these alloys. The thicknesses of the Al₁₂Mo alloy layers for Mo-implanted Al with ion doses of 3×10¹⁷/cm² and 1×10¹⁸/cm² are 550nm and 2000nm, respectively. The pitting corrosion potential V_p increases obviously. It is clear that due to the formation of Al₁₂Mo alloy layer, the pitting corrosion resistance is enhanced.     

铒掺杂富硅热氧化SiO2/Si发光薄膜的显微结构

利用金属蒸气真空弧 (MEVVA)离子源将稀土元素Er离子掺杂到富硅热氧化SiO2 /Si薄膜中。卢瑟福背散射 (RBS)和X 射线电子能谱仪 (XPS)分析表明 ,Er浓度可达原子百分数 (x)～ 10 ,即Er的原子体浓度为～ 10 2 1·cm-3 。XPS研究发现 ,随着Si注量增大 ,退火态样品表面硅含量增多 ,热氧化硅含量减少。反射式高能电子衍射 (RHEED)和原子灵敏度因子法 (AFM)研究表明 ,样品表面没有大量Er析出或铒硅化物形成 ,退火后表层中Si外延再生长、有针状微晶硅颗粒形成。在 77K及室温下 ,研究了Er掺杂富硅热氧化SiO2 /Si薄膜的近红外区 1 5 4μm附近光致发光光谱     

Si,As双注入GaAs的RTA研究

本文研究了Si注入GaAs的快速退火(RTA)特性。得出930—950℃退火5s为最佳退火条件。测量结果表明,当注入剂量大于10~(13)cm~(-2)时,电子浓度呈饱和现象。为提高电子浓度本文提出Si,As双注入GaAs的方法,研究了(60—80)keV,(5—10)×10~(14)Si/cm~2+(150—180)keV,(5—30)×10~(14)As/cm~2注入并经RTA后的电特性。结果表明,双注入后样品中电子浓度有明显提高,对80keV,10~(15)Si/cm~2+150keV,3×10~(15)As/cm~2来说,电子浓度大于10~(19)cm~(-3)。TEM观察表明,双注入样品的剩余缺陷密度大大低于单注入的情况。本文并对双注入补偿机理进行了讨论。