柔性透明导电薄膜ZAO

随着电子器件向小型化和轻便化方向发展,柔性衬底的透明导电薄膜有望成为硬质衬底透明导电薄膜的更新换代产品,因此其研究备受关注.柔性透明导电薄膜ZAO具有优异的光电性能且资源丰富、成本低、对环境无污染,成为当前的研究热点.总结了近年来对柔性衬底材料处理的方法,介绍了柔性透明导电薄膜ZAO的结构和光电特性.评述了柔性ZAO薄膜的研究现状,并对其近期研究和应用工作做了展望.     

p-Si TFT栅绝缘层用SiN薄膜的研究

以NH3和SiH4为反应源气体,采用射频等离子体增强化学气相沉积(RF-PECVD)法在多晶硅(p-Si)衬底上沉积了一系列SiN薄膜,并利用椭圆偏振测厚仪、超高电阻-微电流计、C-V测试仪对所沉积的薄膜作了相关性能测试.系统分析了沉积温度和射频功率对SiN薄膜的相对介电常数、电学性能及界面特性的影响.分析表明,沉积温度和射频功率主要是通过影响SiN薄膜中的Si/N比影响薄膜的性能,在制备高质量的p-Si TFT栅绝缘层用SiN薄膜方面具有重要的参考价值.     

Low-temperature deposition of transparent conducting Mn-W co-doped ZnO thin films

Mn-W co-doped ZnO(ZMWO) thin films with low resistivity and high transparency were successfully prepared on glass substrate by direct current(DC) magnetron sputtering at low temperature.The sputtering power was varied from 65 to 150 W.The crystallinity and resistivity of ZMWO films greatly depend on sputtering power while the optical transmittance and optical band gap are not sensitive to sputtering power.All the deposited films are polycrystalline with a hexagonal structure and have a preferred orientat...     

缓冲层厚度对透明导电薄膜ZnO∶Zr性能的影响(英文)

利用直流磁控溅射法在有ZnO∶Zr缓冲层的水冷玻璃衬底上成功制备出了ZnO∶Zr透明导电薄膜,缓冲层的厚度介于35～208nm。利用XRD、SEM、四探针测试仪和紫外-可见分光光度计研究ZnO∶Zr薄膜的结构、形貌、电光性能。结果表明,薄膜的颗粒尺寸和电阻率对缓冲层厚度具有较强的依赖性。当缓冲层厚度从35nm增加到103nm时,薄膜的颗粒尺寸增大,电阻率减小。而当缓冲层厚度从103nm增加到208nm时,薄膜的颗粒尺寸减小,电阻率增大。当缓冲厚度为103nm时,薄膜的电阻率最小为2.96×10^-3Ω.cm,远小于没有缓冲层时的12.9×10^-3Ω.cm。实验结果表明,在沉积薄膜之前先沉积一层适当的缓冲层是提高ZnO∶Zr薄膜质量的一种有效方法。     

Influence of the distance between target and substrate on the properties of transparent conducting Al-Zr co-doped zinc oxide thin films

Highly transparent and conducting Al-Zr co-doped zinc oxide (ZAZO) thin films were successfully prepared on glass substrate by direct current (DC) magnetron sputtering at room temperature.The distance between target and substrate was varied from 45 to 70 mm.All the deposited films are polycrystalline with a hexagonal structure and have a preferred orientation along the c-axis perpendicular to the substrate.The crystallinity increases obviously and the electrical resistivity decreases when the distance betwe...     

p-Si TFT栅绝缘层用SiNx薄膜界面特性的研究

以NH3和SiH4为反应源气体,在低温下采用射频等离子体增强化学气相沉积(RF-PECVD)法在多晶硅(p-Si)衬底上沉积了SiNx薄膜.系统地分析讨论了沉积温度、射频功率、反应源气体流量比对SiNx薄膜界面特性的影响.分析表明,沉积温度和射频功率主要是通过影响SiNx薄膜中的si/N比和H含量影响薄膜的界面特性,而NH3/SiH4流量比则主要通过影响薄膜中的H含量影响薄膜界面特性.实验制备的SiNx薄膜层中的固定电荷密度、可动离子密度、SiNx与p-si之间的界面态密度分别达到了1.7×1012/cm2、1.4×1012/cm2、3.5×1012/(eV·cm2),其界面特性达到了制备高质量p-si TFT栅绝缘层的性能要求.     

溅射压强对柔性PET衬底ZnO薄膜性能的影响

利用直流磁控溅射法,在室温水冷柔性PET衬底上成功制备出了掺钛氧化锌(ZnO:Ti,TZO)透明导电薄膜。通过X射线衍射(XRD)研究了薄膜的结构,用扫描电镜(SEM)研究了薄膜的表面形貌,用四探针和紫外-可见分光光度计等仪器对薄膜的特性进行测试分析,研究了溅射压强对ZnO:Ti薄膜表面结构、形貌、力学、电学和光学性能的影响。结果表明,溅射压强对PET衬底上的TZO薄膜的性能有显著的影响,实验制备的ZnO:Ti薄膜为具有C轴择优取向的六角纤锌矿结构的多晶薄膜;当溅射压强从2Pa增加到4Pa时,薄膜的电阻率由10.87×10-4Ω.cm快速减小到4.72×10-4Ω.cm,随着溅射压强由4Pa继续增大到6Pa,薄膜的电阻率变化平缓,溅射压强为5Pa时薄膜的电阻率最小,为4.21×10-4Ω.cm;经计算得到6Pa时样品薄膜应力最小,为0.785 839GPa;所有样品都具有高于91%的可见光区平均透过率。     

利用直流磁控溅射法在柔性衬底上制备ZnO: Zr新型透明导电薄膜

室温下利用直流磁控溅射法在有ZnO缓冲层的柔性衬底 PET上制备出了可见光透过率高、电阻率低的掺锆氧化锌(ZnO: Zr)透明导电薄膜,研究了厚度对ZnO: Zr薄膜结构及光电性能的影响.结果表明,ZnO: Zr薄膜为六方纤锌矿结构的多晶薄膜.实验获得ZnO: Zr薄膜的最小电阻率为2.4×10-3 Ω·cm,其霍尔迁移率为18.9 cm2·V-1·s-1 ,载流子浓度为2.3×1020 cm-3.实验制备的ZnO: Zr薄膜具有良好的附着性能,其可见光平均透过率超过92;.     

直流磁控溅射法制备铝铬共掺杂氧化锌薄膜及其结构和光电性能的研究

利用直流磁控溅射法在玻璃衬底上制备了铝铬共掺杂氧化锌(ZACO)透明导电薄膜.通过X射线衍射(XRD)和扫描电镜(SEM)等表征方法对薄膜特性进行测试分析,研究了溅射压强和溅射功率对薄膜生长速率以及光电特性的影响.结果表明,随着溅射气压(1.5～4.5 Pa)的增大,薄膜沿c轴方向的结晶质量提高,薄膜表面更加致密,晶粒大小更加均匀.薄膜生长率随压强的增大而减小,但电阻率先减小后增大.当溅射功率由80 W增大到100 W时,薄膜的生长速率增大,电阻率减小.溅射压强为3.5 Pa,溅射功率为100 W时,薄膜的电阻率达到最小值2.574×10-3 Ω·cm.紫外-可见透射光谱表明,所有薄膜在可见光区的透过率均超过89.9;.     

Influence of the sputtering pressure on the properties of transparent conducting zirconium-doped zinc oxide films prepared by RF magnetron sputtering

Transparent conducting zirconium-doped zinc oxide films with high transparency and relatively low re-sistivity have been successfully prepared on water-cooled glass substrate by radio frequency magnetron sputtering at room temperature. The Ar sputtering pressure was varied from 0.5 to 3 Pa. The crystallinity increases and the electri-cal resistivity decreases when the sputtering pressure increases from 0.5 to 2.5 Pa. The cystallinity decreases and the electrical resistivity increases when the sputtering pressure increases from 2.5 to 3 Pa. When the sputtering pressure The deposited films are polycrystalline with a hexagonal structure and a preferred orientation perpendicular to the substrate.