多晶硅/CoSi_2/Si结构热稳定性研究

本文利用俄歇电子谱(AES)、X射线衍射(XRD)和电学测量等方法研究了原位掺杂多晶硅/CoSi_2/Si_(衬底)多层结构在700—900℃的温度范围内在惰性气体和真空中进行热处理的稳定性.结果表明,当退火温度低于 850℃,这种结构有良好的热稳定性.当温度高于 850℃,多晶硅与硅化物间将发生互扩散和界面反应.随着退火温度升高,在惰性气体的气氛中,CoSi_2迁移到表面层,而硅外延生长在硅衬底上,形成 CoSi_2/Si 双层结构;在真空中热处理仍可保持 poly-Si/CoSi_2/Si 三层结构.     

A STUDY OF THE CRYSTALLIZATION OF AMORPHOUS Cu60Zr40 ALLOY

The crystallization of the amorphous Cu₆₀Zr₄₀ alloy has been studied by differential scanning calorimetry (DSC), scanning Auger microprobe (SAM) and transmission electron microscopy (TEM). The DSC trace showed that the sample exhibited a glass transition at 750 K and a strong exothermic effect beginning from 782 K. An enrichment of the element Zr and significant oxygen contamination in a zone near the surface to a depth of about 10 nm were revealed by SAM in the analysis of surface competition and depth profiles of the Cu₆₀Zr₄₀ sample. Also, the change of concentration ratio of Ca to Zr in amorphous matrix at the clean Cu₆₀Zr₄₀ surface as a function of annealing temperature was examined in detail, and it was found that the concentration of Zr at the surface is slightly higher than that in the bulk until 780K and that the concentration ratio of Cu to Zr in matrix has an abrupt increase in the temperature range of 780-800K. The observations by high resolution TEM revealed the appearance of cluster-like regions of approximately 1.5-2.0 nm in size just before crystallization and they distributed randomly throughout the sample. This phenomenon is analogous to the results obtained using field ion microscopy (FIM) by the present authors. The microstructural changes of the sample daring heating show the gradual crystallization of the amorphous matrix.     

AlxGa1-xAs俄歇灵敏度因子的测定

利用PHI610俄歇谱仪测定了Al,Ga和As的俄歇灵敏度因子。对6种不同x值的Al_xGa_1-xAs样品进行俄歇定量分析。结果与X射线双晶衍射测量值非常一致。结果表明,利用自身谱仪测定的俄歇灵敏度因子进行的定量分析结果,与目前通常使用的手册或内标法提供的元素相对灵敏度因子的定量分析结果相比,测量精度得到大大提高。 关键词：     

In_xGa_(1-x)As的俄歇电子谱定量分析

采用As元素作为内标对分子束外延生长In_xGa_(1-x)As进行定量俄歇分析。实验测定了元素相对灵敏度因子、基体修正因子和离子溅射修正因子,给出一个定量修正公式。检测结果与电子探针、X射线双晶衍射和手册灵敏度因子法等结果进行了比较。     

Co与Si和SiO_2在快速热退火中的反应

利用四探针、AES、XRD、XPS和SEM等技术研究了快速热退火中Co与Si和SiO_2反应动力学、相序、层的形貌。测量了薄层电阻与退火温度和时间的关系。结果表明,随退火温度的升高,淀积在硅衬底上的钴膜逐步转变为Co_2Si、CoSi_(?)最后完全转化为CoSi_2。CoSi_2对应的电阻率最低。Co与SiO_2不会反应,即使在1050℃的高温下也没有观察到任何形成钴硅化物的证据。     

PASSIVATION OF THE InP(100) SURFACE USING (NH4)2Sx

InP(100) surface treated with (NH₄)₂S_x has been investigated by using photolumines-cence(PL), Auger electron spectroscopy and X-ray photoelectron spectroscopy, It is found that PL intensity increased by a factor of 3.3 after (NH₄)₂S_x passivation and the sulfur remained on the surface only bonded to indium, not to phosphorus. This suggests that the sulfur atoms replace the phosphorus atoms on the surface and occupy the phosphorus vacancies.     

A STUDY OF THE CRYSTALLIZATION OF AMORPHOUS Cu60Zr40 ALLOY

The crystallization of the amorphous Cu₆₀Zr₄₀ alloy has been studied by differential scanning calorimetry (DSC), scanning Auger microprobe (SAM) and transmission electron microscopy (TEM). The DSC trace showed that the sample exhibited a glass transition at 750 K and a strong exothermic effect beginning from 782 K. An enrichment of the element Zr and significant oxygen contamination in a zone near the surface to a depth of about 10 nm were revealed by SAM in the analysis of surface competition and depth profiles of the Cu₆₀Zr₄₀ sample. Also, the change of concentration ratio of Ca to Zr in amorphous matrix at the clean Cu₆₀Zr₄₀ surface as a function of annealing temperature was examined in detail, and it was found that the concentration of Zr at the surface is slightly higher than that in the bulk until 780K and that the concentration ratio of Cu to Zr in matrix has an abrupt increase in the temperature range of 780-800K. The observations by high resolution TEM revealed the appearance of cluster-like regions of approximately 1.5-2.0 nm in size just before crystallization and they distributed randomly throughout the sample. This phenomenon is analogous to the results obtained using field ion microscopy (FIM) by the present authors. The microstructural changes of the sample daring heating show the gradual crystallization of the amorphous matrix.     

利用快速热退火在n－GaAs上形成Ge／PdGe欧姆接触

利用Ｇｅ／Ｐｄ／ＧａＡｓ结构和快速热退火工艺在ｎ－ＧａＡｓ上形成低阻的欧姆接触．研究了比接触电阻率与退火的温度和时间关系，４００～５００℃之间退火的欧姆接触的比接触电阻率为～１０－６Ω·ｃｍ２．接触层的表面光滑、界面平整．利用俄歇电子谱（ＡＥＳ）和二次离子质谱（ＳＩＭＳ）一揭示和讨论了比接触电阻率的欧姆接触形成的机理．