Packaging multi-wavelength DFB laser array using REC technology

Packaging of Distributed feedback （DFB） laser array based on reconstruction=equivalent-chirp （REC） tech- nology is a bridge from chip to system, and influences the practical process of REC chip. In this letter, DFB laser arrays of 4 channel @1 310 nm and 8 channel @1 550 nm are packaged. Experimental results show that both 4 channel @1 310 nm and 8 channel @1 550 nm have uniform wavelength spacing and average side mode suppression ratio （SMSR）〉35 dB. When I=35 mA, we get the total output power 1 mW of 4 channel @1 310 nm, and 227 μW of 8 channel @1 550 nm, respectively. The high frequency characteristic of the packaged chips is also demonstrated, and the requirements of 4× 10 G or even 8× 10 G system can be reached, we demonstrate the practical and low cost performance of REC technology and indicates its potential application in the future fiber-to-the-home （FTTH）.     

Photonic angle-of-arrival and time-difference-of-arrival measurement based on dual drive 1 × 2 MZM

We propose and experimentally demonstrate a photonic approach to estimate the time-difference-of-arrival (TDOA) and the angle-of-arrival (AOA) of a microwave signal. TDOA and AOA are estimated from the carrier power difference of the two outputs of the Mach-Zehnder modulator (MZM) using only one dualdrive 1 × 2 MZM. Experimentally, the TDOA of a microwave signal at 3 GHz from 27.78 to 166.67 ps is measured with maximum measurement errors of ± 2.24 ps; correspondingly, the AOA from 60°to 85.2°is measured with maximum measurement errors of ± 0.4° .     

可调谐DFB阵列激光器的制备与测试

针对一种新型重构-等效啁啾技术的分布反馈式(DFB)激光器阵列芯片封装的特点,研制并测试输出波长范围为1310～1319nm的可调谐激光器,以1310nm窗口波段光通信为研究对象,使用PC机和微处理器(MCU)通信实现激光器阵列波长调谐.研究结果表明,该系统可应用于1310 nm波段的密集波分复用(DWDM)系统并且能够保持50 GHz间隔0.01 nm的波长精度.