Design of a high-order single-loop Σ△ ADC followed by a decimator in 0.18μm CMOS technology

This work presents an oversampled high-order single-loop single-bit sigma–delta analog-to-digital converter followed by a multi-stage decimation filter.Design details and measurement results for the whole chip are presented for a TSMC 0.18μm CMOS implementation to achieve virtually ideal 16-b performance over a baseband of 640 kHz.The modulator in this work is a fully differential circuit that operates from a single 1.8 V power supply. With an oversampling ratio of 64 and a clock rate of 81.92 MHz,the modulator achieves a 94 dB dynamic range. The decimator achieves a pass-band ripple of less than 0.01 dB,a stop-band attenuation of 80 dB and a transition band from 640 to 740 kHz.The whole chip consumes only 56 mW for a 1.28 MHz output rate and occupies a die area of 1×2 mm^2.     

超薄栅氧MOS器件传统关态栅泄漏电流研究

理论分析了MOSFET关态泄漏电流产生的物理机制,深入研究了栅氧化层厚度为1.4nm MOSFET传统关态下边缘直接隧穿栅泄漏现象.结果表明：边缘直接隧穿电流服从指数变化规律;传统关态下边缘直接隧穿对长沟道器件的影响大于短沟道器件;衬底反偏在一定程度上减小边缘直接隧穿泄漏电流.     

Improved low-distortion sigma-delta ADC with DWA for WLAN standards

An improved low distortion sigma-delta ADC(analog-to-digital converter) for wireless local area network standards is presented.A feed-forward MASH 2-2 multi-bit cascaded sigma-delta ADC is adopted;however,this work shows a much better performance than the ADCs which have been presented to date by adding a feedback factor in the second stage to improve the performance of the in-band SNDR(signal to noise and distortion ratio),using 4-bit ADCs in both stages to minimize the quantization noise.Data weighted ...     

基于0.18µm CMOS工艺的高阶单环∑△ADC以及降采样数字滤波器的设计

设计了一个过采样、高阶一位单环∑△模数转换器以及后级降采样数字滤波器。整个芯片采用TSMC 0.18µm CMOS工艺实现,芯片面积1mm×2mm,功耗为56mW。 调制器采用1.8V全差分电路结构,在过采样率64,时钟频率81.92MHz,640kHz带宽内,实测精度达到了15.32位,动态范围94dB。降采样数字滤波器的通带波纹小于0.01dB,阻带衰减75dB,过渡带为640kHz-740kHz。     

非线性时变系统自适应backstepping学习控制

针对含有混合未知参数的高阶非线性系统,利用backstepping方法,提出了一种自适应重复学习控制方法,该方法与分段积分机制相结合,可以处理时变参数在一个未知紧集内周期性快时变的非线性系统,通过构造微分-差分参数自适应律,设计了一种自适应控制策略,使跟踪误差在误差平方范数意义下渐近收敛于零,利用Lyapunov泛函,给出了闭环系统收敛的一个充分条件.实例仿真结果说明了该方法的有效性.     

GIDL应力下超薄栅氧LDD NMOS器件退化

The degradation of device under GIDL （gate-induced drain leakage current） stress has been studied using LDD NMOSFETs with 1.4 nm gate oxides. Experimental result shows that the degradation of device parameters depends more strongly on Vd than on Vg. The characteristics of the GIDL current are used to analyze the damage generated during the stress. It is clearly found that the change of GIDL current before and after stress can be divided into two stages. The trapping of holes in the oxide is dominant in the first stage, but that of electrons in the oxide is dominant in the second stage. It is due to the common effects of edge direct tunneling and band-to-band tunneling. SILC（stress induced leakage current）in the NMOSFET decreases with increasing stress time under GIDL stress. The degradation characteristic of SILC also shows saturating time dependence. SILC is strongly dependent on the measured gate voltage. The higher the measured gate voltage, the less serious the degradation of the gate current. A likely mechanism is presented to explain the origin of SILC during GIDL stress.     

一种高精度音频Σ-Δ调制器的研究

简要介绍了Σ-Δ调制器的基本原理,设计了一种适合数字音频应用的16位Σ-Δ调制器.该电路采用Chartered 0.5 μm标准CMOS工艺实现,工作电源电压为5 V,在工作频率为6.144 MHz、过采样率为128时,输入带内信噪比可达107 dB.     

直接隧穿栅电流对CMOS逻辑电路的影响

对于纳米级的CMOS电路,由于MOS器件具有超薄的氧化层,栅隧穿漏电流的存在严重地影响了电路的正常工作。本文基于可靠性理论和电路级仿真深入地研究直接隧穿电流对CMOS逻辑电路的影响。仿真结果很好地与理论分析相符合,这些理论和仿真将有助于以后的集成电路设计。     

直接隧穿应力下超薄栅氧MOS器件退化

研究了栅氧厚度为1.4nm MOS器件在恒压直接隧穿应力下器件参数退化和应力感应漏电流退化. 实验结果表明,在不同直接隧穿应力过程中,应力感应漏电流（SILC）的退化和Vth的退化均存在线性关系. 为了解释直接隧穿应力下SILC的起因,建立了一个界面陷阱和氧化层陷阱正电荷共同辅助遂穿模型.     

Hot-Carrier Stress Effects on GIDL and SILC in 90nm LDD-MOSFET with Ultra-Thin Gate Oxide

Hot-carrier degradation for 90 nm gate length lightly-doped drain （LDD） NMOSFET with ultra-thin （1.4 nm） gate oxide is investigated under the low gate voltage stress （LGVS） and peak substrate current （Isub max） stress. It is found that the degradation of device parameters exhibits saturating time dependence under the two stresses. We concentrate on the effect of these two stresses on gate-induced-drain leakage （GIDL） current and stress induced leakage current （SILC）. The characteristics of the GIDL current are used to analyse the damage generated in the gate-to-LDD region during the two stresses. However, the damage generated during the LGVS shows different characteristics from that during Isub stress. SILC is also investigated under the two stresses. It is found experimentally that there is a linear correlation between the degradation of SILC and that of threshold voltage during the two stresses. It is concluded that the mechanism of SILC is due to the combined effect of oxide charge trapping and interface traps for the ultra-short gate length and ultra-thin gate oxide LDD NMOSFETs under the two stresses.