激光定位深亚微米CMOS SRAM单粒子翻转敏感区

The pulsed laser facility for SEU sensitivity mapping is utilized to study the SEU sensitive regions of a 0.18/zm CMOS SRAM cell. Combined with the device layout micrograph, SEU sensitivity maps of the SRAM cell are obtained. TCAD simulation work is performed to examine the SEU sensitivity characteristics of the SRAM cell. The laser mapping experiment results are discussed and compared with the electron micrograph information of the SRAM cell and the TCAD simulation results. The results present that the test technique is reliable and of high mapping precision for the deep submicron technology device.     

基于低频电噪声的光电耦合器可靠性筛选方法研究

低频电噪声是表征电子器件质量和可靠性的敏感参数,通过测试低频噪声,可以快速、无损地实现光耦器件的可靠性评估。通过开展可靠性老化对光电耦合器低频噪声特性影响的试验研究,提出基于低频段宽频带噪声参数的光电耦合器可靠性筛选方法,并将可靠性筛选结果与点频噪声筛选方法结果进行对比分析。结果表明,与点频噪声参数等现有方法相比,宽频带噪声参数可以更灵敏和准确地表征器件可靠性,同时计算简便,基于宽频带噪声参数的光电耦合器可靠性筛选方法可以实现更为准确合理的可靠性分类筛选。     

光电耦合器件低频噪声特性与可靠性老化研究

在宽的输入偏置电流范围条件下,开展了光电耦合器件低频噪声特性测试与功率老化和高温老化的可靠性试验研究。结果表明,光电耦合器件的低频噪声主要是内部光敏晶体管1/f噪声,并随输入偏置电流的增大呈现先增大后减小的规律,这与器件的工作状态密切相关。功率老化试验后,高输入偏置电流条件下的低频噪声有所增大,这归因于电应力诱发的有源区缺陷。高温老化试验后,整个器件线性工作区条件下的低频噪声都明显增大,说明温度应力能够更多地激发器件内部的缺陷。相对于1/f噪声幅度参量,低频噪声宽带噪声电压参量可以更灵敏准确地进行器件可靠性表征。     

不同工艺尺寸CMOS器件单粒子闩锁效应及其防护方法

基于建立的不同工艺尺寸的CMOS器件模型,利用TCAD器件模拟的方法,针对不同工艺CMOS器件,开展了不同工艺尺寸CMOS器件单粒子闩锁效应(SEL)的研究。研究表明,器件工艺尺寸越大,SEL效应越敏感。结合单粒子闩锁效应触发机制,提出了保护带、保护环两种器件级抗SEL加固设计方法,并通过TCAD仿真和重离子试验验证防护效果,得出最优的加固防护设计。结果表明,90nm和0.13μm CMOS器件尽量选用保护带抗SEL结构,0.18μm或更大工艺尺寸CMOS器件建议选取保护环抗SEL结构。     

A single-event transient induced by a pulsed laser in a silicon-germanium heterojunction bipolar transistor

A study on the single event transient (SET) induced by a pulsed laser in a silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) is presented in this work. The impacts of laser energy and collector load resistance on the SET are investigated in detail. The waveform, amplitude, and width of the SET pulse as well as collected charge are used to characterize the SET response. The experimental results are discussed in detail and it is demonstrated that the laser energy and load resistance significantly affect the SET in the SiGe HBT. Furthermore, the underlying physical mechanisms are analyzed and investigated, and a near-ideal exponential model is proposed for the first time to describe the discharge of laser-induced electrons via collector resistance to collector supply when both base-collector and collector-substrate junctions are reverse biased or weakly forward biased. Besides, it is found that an additional multi-path discharge would play an important role in the SET once the base-collector and collector-substrate junctions get strongly forward biased due to a strong transient step charge by the laser pulse.     

90nm互补金属氧化物半导体静态随机存储器局部单粒子闩锁传播效应诱发多位翻转的机理

基于单粒子效应脉冲激光实验装置,开展了90 nm互补金属氧化物半导体静态随机存储器的单粒子翻转和闩锁效应实验,并给出了器件单粒子翻转效应位图.实验发现,器件出现了大量的多位翻转和约20 mA的电源电流脉冲.借助器件仿真工具,揭示了器件发生单粒子多位翻转效应的原因.结果表明,器件局部阵列发生单粒子闩锁效应并传播到多个位单元是诱发多位翻转的主要原因.通过对比分析脉冲激光和器件仿真实验结果,发现P/N阱电势塌陷是导致90 nm互补金属氧化物半导体静态随机存储器出现单粒子闩锁传播效应的内在物理机制.     

Comparative research on “high currents” induced by single event latch-up and transient-induced latch-up

By using the pulsed laser single event effect facility and electro-static discharge(ESD) test system, the characteristics of the "high current", relation with external stimulus and relevance to impacted modes of single event latch-up(SEL)and transient-induced latch-up(TLU) are studied, respectively, for a 12-bit complementary metal–oxide semiconductor(CMOS) analog-to-digital converter. Furthermore, the sameness and difference in physical mechanism between "high current" induced by SEL and that by TLU are disclosed in this paper. The results show that the minority carrier diffusion in the PNPN structure of the CMOS device which initiates the active parasitic NPN and PNP transistors is the common reason for the "high current" induced by SEL and for that by TLU. However, for SEL, the minority carrier diffusion is induced by the ionizing radiation, and an underdamped sinusoidal voltage on the supply node(the ground node) is the cause of the minority carrier diffusion for TLU.     

温度和利用率对CPU性能的影响研究

随着高性能计算机处理器(CPU)功率密度的增大,温度对CPU计算性能的影响愈发突出。为了解决温度与CPU计算性能之间缺乏定量分析的问题,研究了CPU利用率对温度的影响以及温度对CPU评测分值的影响。采用SPEC CPU2006作为评测基准程序集,结合环境温度试验进行测评,对利用率、温度进行了监测采集。利用试验数据建立了温度和评测分值的对应模型,给出了更精确的评测分值。该结果能使CPU工作于合适的评测温度范围,减少温度对CPU评测分值的影响。     

高带宽存储器的技术演进和测试挑战

高带宽存储器（HBM）是一种采用三维堆叠和硅通孔技术的超高宽带、低功耗的新型动态随机存取存储器（DRAM）,主要应用在高性能计算处理器、人工智能计算加速卡、高端专业显卡等高性能计算领域。国际电子元件工业联合会（JEDEC）先后发布了3代HBM技术标准,并在2022年1月发布了第四代JESD238 HBM3 DRAM技术标准,为新一代高带宽内存指定了发展方向。系统梳理了HBM技术标准的发展,介绍了HBM技术在输入输出接口速度、带宽和存储容量方面的突破,结合HBM的技术特点,研究分析了HBM晶圆级堆叠芯片的测试技术及其面临的挑战。