一种接触质量高和兼容特性好的金属-量子点-金属结构的自对准制备方法

我们报道了一种“金属-量子点-金属”结构的自对准制备方法。该方法主要包括“电子束曝光-薄膜淀积-刻蚀”工艺,具有套刻容限大、开发周期短以及可兼容多种材料等优点,尤其适用于具有类似结构的纳米器件制备。该方法中使用的牺牲层工艺和强化版图,降低了剥离工艺的难度,提升了可制备器件结构的力学强度。最后,作为应用实例,我们用该方法制备了尺寸为 255 nm × 45 nm × 30 nm（ 长 × 宽 × 高)的相变节点。     

侧墙技术在相变存储器中的应用

从相变存储器(phase change random access memory,PCRAM)的基本结构和工作原理出发,首先介绍了PCRAM的技术优势、面临的技术挑战、常用的解决策略以及存在的相应问题;接着阐述了在微电子加工中广泛应用的关键工艺——侧墙技术,并将其在PCRAM中的应用成果进行了分类;然后从加热电极的制备、相变材料限制结构的制备、新相变材料的制备与表征和器件间互联等4个方面展开叙述;最后展望了该技术在相变存储领域应用发展的趋势。侧墙技术因其具备自对准的特点,制备工艺可控性好,制备精度不依赖于光刻精度,在纳米技术飞速发展的今天,侧墙技术将会在更高精度上发挥其作用。     

Investigation and solution of low yield problem for phase change memory with lateral fully-confined structure

This paper mainly focuses on solving the low yield problem for lateral phase change random access memory with a fully confined phase change material node. Improper over-etching and bad step-coverage of physical vapor deposition were the main reasons for the poor contact quality, which leads to the low yield problem. Process improvement was carried out to better control over-etching within 10 nm. Atomic layer deposition process was used to replace physical vapor deposition to guarantee good step coverage. Contrasting cross-sectional photos taken by scanning electron microscopy showed great improvement in contact quality. The atom layer deposition process was demonstrated to have good prospects in nano-contact for phase change memory application.