Fundamental aspects of molecular plating and production of smooth crack-free Nd targets

A general understanding of the molecular plating process was obtained recently, which serves as a first step towards further improvements of the method aiming, for example, at the production of smooth, crack-free targets for nuclear physics applications. Constant current density electrolysis experiments were performed in organic media containing the model electrolyte Nd(NO₃)₃·6H₂O. The process was investigated by considering influences of the electrolyte concentration (0.11, 0.22, 0.44 mM), the surface roughness of the deposition substrates (a few tens of nm), and the plating solvent (an isopropanol/isobutanol mixture, and N,N-dimethylformamide). The response of the process to changes of these parameters was monitored by recording cell potential curves and by characterizing the obtained deposits with γ-ray spectroscopy, X-ray photoelectron spectroscopy, and atomic force microscopy. By changing the solvent from isopropanol/isobutanol mixtures to N,N-dimethylformamide, we have succeeded in producing smooth, crack-free Nd targets.     

Simulation of displacement cascades in Ni–Al ordered alloys

Abstract

Molecular dynamics was used to investigate defect production induced by displacement cascades in ordered intermetallic alloys NiAl and Ni₃Al. The composite potentials obtained from the embedded atom potentials (EAM) and the universal function of Biersack and Ziegler were used. The number of point defects and their final structure produced by displacement cascades were investigated and compared with the standard NRT prediction. Crystalline structure, atomic mixing and chemical disordering were also studied during the evolution of the cascades, by measuring their characteristic parameters in the cells of the subdivided crystal.