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Noble C. Woo Kunigunde Cherenack Gerhard Tr?ster Ralph Spolenak 《Applied Physics A: Materials Science & Processing》2010,100(1):281-285
Reducing the strain in brittle device layers is critical in the fabrication of robust flexible electronic devices. In this
study, the cracking behavior of micro-patterned 500-nm-thick Ti films was investigated via uniaxial tensile testing by in
situ SEM and 4-point probe measurements. Both visual observations by SEM and 4-pt resistance measurements showed that strategically
patterned oval holes, off-set and rotated by 45°, had a significant effect on limiting the extent of cracking, specifically,
in preventing cracks from converging. Failure with regard to electrical conduction was delayed from less than 2% to more than
10% strain. 相似文献
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