Potential for micromachined actuation of ultra-wide continuously tunable optoelectronic devices

Tailored scaling represents a principle of success that, both in nature and in technology, allows the effectiveness of physical effects to be enhanced. Mutation and selection in nature are imitated in technology, e.g. by model calculation and design. Proper scaling of dimensions in natural photonic crystals and our fabricated artificial 1D photonic crystals (DBRs, distributed Bragg reflectors) enable efficient diffractive interaction in a specific spectral range. For our optical microsystems we illustrate that tailored miniaturization may also increase the mechanical stability and the effectiveness of spectral tuning by thermal and electrostatic actuation, since the relative significance of the fundamental physical forces involved considerably changes with scaling. These basic physical principles are rigorously applied in micromachined 1.55-μm vertical-resonator-based devices. We modeled, implemented and characterized 1.55-μm micromachined optical filters and vertical-cavity surface-emitting laser devices capable of wide, monotonic and kink-free tuning by a single control parameter. Tuning is achieved by mechanical actuation of one or several air-gaps that are part of the vertical resonator including two ultra-highly reflective DBR mirrors of strong refractive index contrast: (i) Δn=2.17 for InP/air-gap DBRs (3.5 periods) using GaInAs sacrificial layers and (ii) Δn=0.5 for Si₃N₄/SiO₂ DBRs (12 periods) with a polymer sacrificial layer to implement the air-cavity. In semiconductor multiple air-gap filters, a continuous tuning of >8% of the absolute wavelength is obtained. Varying the reverse voltage (U=0–5 V) between the membranes (electrostatic actuation), a tuning range of >110 nm was obtained for a large number of devices. The correlation of the wavelength and the applied voltage is accurately reproducible without any hysteresis. In two filters, tuning of 127 and 130 nm was observed for about ΔU=7 V. The extremely wide tuning range and the very small voltage required are record values to the best of our knowledge. For thermally actuated dielectric filters based on polymer sacrificial layers, Δλ/ΔU=-7 nm/V is found. Received: 10 May 2002 / Published online: 8 August 2002     

Multiple air-gap filters and constricted mesa lasers – material processing meets the front of optical device technology

Real three-dimensional material structures enable enormous perspectives in the functionality of advanced electronic and optoelectronic III/V semiconductor devices. We report on the technological implementation of surface-micromachined III/V semiconductor devices for optoelectronic applications. Considering fabrication technology, the general principles can be reduced to three fundamental process steps: deposition of a layered heterostructure on a substrate, vertical structurization and horizontal undercutting by selectively removing sacrificial layers. Very useful quality-control elements for precise process control are presented. The basic principles are applied and illustrated in detail by presenting two selected optoelectronic examples. (i) The fabrication technology of buried mushroom stripe lasers is shown. Bent waveguides on homogeneous grating fields are used to obtain chirped gratings, enabling a high potential to tailor specific performances. Excellent optical properties are obtained. (ii) The fabrication technology of vertical optical cavity based tunable single- or multi-membrane devices including air gaps is shown. Record optical tuning characteristics for vertical cavity Fabry–Pérot filters are presented. Single parametric wavelength tuning over 142 nm with an actuation voltage of only 3.2 V is demonstrated. PACS 85.60.-q; 87.80.Mj; 68.65.Ac     

InGaAsP/InP 1.55-μm lasers with chemically assisted ion beam-etched facets

Chemically assisted ion beam etching (CAIBE) involving an Ar ion beam and a halogen ambient gas (Cl₂, IBr₃) has been used to etch high-quality laser facets for InGaAsP/InP bulk lasers (1.55 m). We achieved eich rates of 40.0–75.0 nm min^–1 at substrate temperatures between-5 and +10°C. These low temperatures have allowed us to utilize UV-baked photoresists as well as PMMA as etch masks, facilitating very simple process development. Higher substrate temperatures (50 to 120°C) yield still higher etch rates, but at the expense of severely degraded surface morphologies. Angle resolved x-ray photoelectron spectroscopy (XPS) was investigated for observing etched InP surfaces. A disproportioned surface has been detected after etching in the higher temperature range; low temperatures yield stoichiometric surfaces.