The physical process analysis of the capacitance-voltage characteristics of AlGaN/AlN/GaN high electron mobility transistors

This paper deduces the expression of the Schottky contact capacitance of AlGaN/AlN/GaN high electron mobility transistors (HEMTs), which will help to understand the electron depleting process. Some material parameters related with capacitance-voltage profiling are given in the expression. Detailed analysis of the forward-biased capacitance has been carried on. The gate capacitance of undoped AlGaN/AlN/GaN HEMT will fall under forward bias. If a rising profile is obviously observed, the donor-like impurity or trap is possibly introduced in the barrier.     

GaN HEMT栅边缘电容用于缺陷的研究

本文对GaN HEMT栅漏电容的频率色散特性进行分析,认为栅边缘电容的色散是导致栅漏电容频率色散特性不同于圆肖特基二极管电容的主要原因. 通过对不同栅偏置条件下缺陷附加电容与频率关系的拟合,发现小栅压下的缺陷附加电容仅满足单能级缺陷模型,而强反向栅压下的缺陷附加电容同时满足单能级和连续能级缺陷模型. 实验中栅边缘电容的频率色散现象在钝化工艺后出现,其反映的缺陷很可能是钝化工艺引入,且位于源漏间栅金属未覆盖区域的表面. 最后通过低频噪声技术进一步验证栅边缘电容提取缺陷参数的可行性. 低频噪声技术获得的单能级 关键词： HEMT 边缘电容 缺陷 低频噪声     

Effect of SiN:H_x passivation layer on the reverse gate leakage current in GaN HEMTs

This paper concentrates on the impact of SiN passivation layer deposited by plasma-enhanced chemical vapor deposition(PECVD) on the Schottky characteristics in GaN high electron mobility transistors(HEMTs). Three types of SiN layers with different deposition conditions were deposited on GaN HEMTs. Atomic force microscope(AFM), capacitance-voltage(C-V), and Fourier transform infrared(FTIR) measurement were used to analyze the surface morphology, the electrical characterization, and the chemical bonding of SiN thin films, respectively. The better surface morphology was achieved from the device with lower gate leakage current. The fixed positive charge Q_f was extracted from C-V curves of Al/SiN/Si structures and quite different density of trap states(in the order of magnitude of 1011-1012 cm~(-2)) was observed.It was found that the least trap states were in accordance with the lowest gate leakage current. Furthermore, the chemical bonds and the %H in Si-H and N-H were figured from FTIR measurement, demonstrating an increase in the density of Q_f with the increasing %H in N-H. It reveals that the effect of SiN passivation can be improved in GaN-based HEMTs by modulating %H in Si-H and N-H, thus achieving a better Schottky characteristics.     

AlGaN/AlN/GaN高电子迁移率器件的电容电压特性的经验拟合

利用蓝宝石衬底的AlGaN/AlN/GaN 高电子迁移率器件(HEMT)的电容电压(C-V)特性,对电子费米能级与二维电子气面密度的经验关系进行表征,其结果对器件电荷控制模型的建立,跨导及电容表达式的简化有重要意义.文章创新性地提出参数α用于表征二维势阱对沟道电子限制能力,并认为α越小则二维势阱的沟道电子限制能力越强.利用上述经验关系来拟合电容,可以获得与实测电容很好的一致性. 关键词： HEMT 费米能级 C-V特性')" href="#">C-V特性 二维势阱的电子限制能力