Schottky Barrier Height Inhomogeneity of Ti／n—GaAs Contact Studied by the I—V—T Technique

The current-voltage characteristics of Ti/n-GaAs Schottky diodes measured over a temperature range of 78-299K have been interpreted on the basis of thermionic emission across an inhomogeneous Schottky contact.The experiment shows that the apparent barrier height (φap) increases from 0.437eV at 78K to 0.698eV at room temperature.the plot of φap versus 1/T does not exhibit a simple linear relationship over the whole temperature range,indicating that the barrier height distribution is more complicated than the frequently observed single Gaussian distribution.A new multi-Gaussian distribution model is developed.Our experimental results can be explained by a double Gaussian distribution of the barrier heights.The weight,the mean barrier height,and the standard deviation of the two Gaussian functions are 0.00001 and 0.99999,0.721 and 0.696,0.069 and 0.012eV,respectively.     

气相色谱-质谱法同时测定地下水中42种半挥发性有机污染物

建立了同时测定地下水中多环芳烃(PAHs)、多氯联苯(PCBs)、有机氯农药(OCPs)和有机磷农药(OPPs)等42种半挥发性有机污染物的分析方法,对固相萃取、液-液萃取、萃取溶剂和色谱柱等分析条件进行优化。最终采用乙酸乙酯-正己烷(1∶4)液液萃取,DB-5MS色谱柱分离,GC-MS/SIM测定,内标法定量。结果表明,42种目标物在0.5~1 000μg/L范围内线性关系良好(r20.995);方法检出限为0.05~3.08 ng/L。在10、40、400 ng/L加标水平下,42种目标物的基体加标平均回收率为73.0%~107%,相对标准偏差(RSD,n=5)为1.4%~11.3%。将方法应用于石家庄周边地区水样检测,结果可靠。该方法灵敏、准确、简单易行,可显著提高地下水中主要有机污染物的分析效率。     

Effect of Pretreatment of TaN Substrates on Atomic Layer Deposition Growth of Ru Thin Films

The polycrystalline ruthenium films are grown on TaN substrates by atomic layer deposition （ALD） using bis（cyclopentadienyl） ruthenium [RuCp2] and oxygen as ruthenium precursor and reactant respectively at a deposition temperature of 330℃. The low-energy Ar ion bombardment and Ru pre-deposition are performed to the underlying TaN substrates before ALD process in order to improve the Ru nucleation. X-ray diffraction, x-ray photoelectron spectroscopy, scanning electron microscopy and atomic force microscopy are carried out to characterize the properties of ALD Ru films. The results show that the nucleation density of Ru films with Ar^＋ bombardment to the underlying TaN substrates is much higher than that of the ones without any pretreatment. The possible reasons are discussed.     

对半导体pn结接触电势的一个讨论

讨论了半导体pn结内建电场和接触电势的形成与可测性，回答了在半导体物理学pn结内容教学中学生经常会提出的一个似是而非的问题．从热力学第一定律、金属-半导体接触等不同角度详细解释了热平衡(零偏下)时pn结不可能对外输出电压和电流的原因．     

Double threshold behaviour of I－V characteristics of CoSi2/Si Schottky contacts

The forward current－voltage (I－V) characteristics of polycrystalline CoSi₂/n-Si(100) Schottky contacts have been measured in a wide temperature range. At low temperatures (≤200K), a plateau-like section is observed in the I－V characteristics around 10^-4A·cm^-2. The current in the small bias region significantly exceeds that expected by the model based on thermionic emission (TE) and a Gaussian distribution of Schottky barrier height (SBH). Such a double threshold behaviour can be explained by the barrier height inhomogeneity, i.e. at low temperatures the current through some patches with low SBH dominates at small bias region. With increasing bias voltage, the Ohmic effect becomes important and the current through the whole junction area exceeds the patch current, thus resulting in a plateau-like section in the I－V curves at moderate bias. For the polycrystalline CoSi₂/Si contacts studied in this paper, the apparent ideality factor of the patch current is much larger than that calculated from the TE model taking the pinch-off effect into account. This suggests that the current flowing through these patches is of the tunnelling type, rather than the thermionic emission type. The experimental I－V characteristics can be fitted reasonably well in the whole temperature region using the model based on tunnelling and pinch-off.     

Erlang(2)扩散风险模型的Gerber-Shiu期望折现惩罚函数

将由布朗运动刻画的随机干扰项加入到Erlang(2)风险模型中,在模型中引入了由Gerber和Shiu定义的期望折现惩罚函数,并给出了这类模型的Gerber-Shiu函数所满足的积分微分方程.     

《半导体器件物理与工艺》书评

施敏教授所著<半导体器件物理与工艺>的英文第2版由美国John Wiley & Sons出版公司出版,其简体中文版由苏州大学电子信息学院组织翻译,于2002年12月由苏州大学出版社出版.该书介绍了现代半导体器件的物理原理和先进的工艺技术,具有权威性且充分体现教育性是此书的显著特色.     

Trapezoid mesa trench metal-oxide semiconductor barrier Schottky rectifier: an improved Schottky rectifier with better reverse characteristics

An improved structure of Schottky rectifier,called a trapezoid mesa trench metal-oxide semiconductor (MOS) barrier Schottky rectifier (TM-TMBS),is proposed and studied by two-dimensional numerical simulations.Both forward and especially better reverse I-V characteristics,including lower leakage current and higher breakdown voltage,are demonstrated by comparing our proposed TM-TMBS with a regular trench MOS barrier Schottky rectifier (TMBS) as well as a conventional planar Schottky barrier diode rectifier.Optimized device parameters corresponding to the requirement for high breakdown voltage are given.With optimized parameters,TM-TMBS attains a breakdown voltage of 186 V,which is 6.3% larger than that of the optimized TMBS,and a leakage current of 4.3×10 6 A/cm 2,which is 26% smaller than that of the optimized TMBS.The relationship between optimized breakdown voltage and some device parameters is studied.Explanations and design rules are given according to this relationship.     

钛－镍－硅固相反应形成的镍硅化物/n-硅(100)接触的I-V-T研究

在不同退火温度下，有一薄层钛覆盖层的镍－硅经过固相反应生成了镍硅化物/n-硅(100)接触，研究了其在80K到室温的电流－电压（I-V）特性。低温I-V曲线在低偏压区的电流显著地比传统的热电子发射（TE）模型预计的要大。用基于Tung的夹断模型简化得到的双肖特基势垒模型分析了实测的I-V曲线，从中可以得到肖特基势垒不均匀性的量度。较高温度退火导致较大的势垒不均匀性，意味着硅化物薄膜均匀性的变坏。钛覆盖薄层可以稍微提高硅化镍的相转变温度，以及形成的一硅化镍的热稳定性。