Growth and Characterization of A1GaN/A1N/GaN HEMT Structures with a Compositionally Step-Graded A1GaN Barrier Layer

A new A1GaN/A1N/GaN high electron mobility transistor （HEMT） structure using a compositionally step-graded A1GaN barrier layer is grown on sapphire by metalorganic chemical vapour deposition （MOCVD）. The structure demonstrates significant enhancement of two-dimensional electron gas （2DEG） mobility and smooth surface morphology compared with the conventional HEMT structure with high A1 composition A1GaN barrier. The high 2DEG mobility of 1806 cm2/Vs at room temperature and low rms surface roughness of 0.220 nm for a scan area of 5μm×5 μm are attributed to the improvement of interracial and crystal quality by employing the stepgraded barrier to accommodate the large lattice mismatch stress. The 2DEG sheet density is independent of the measurement temperature, showing the excellent 2DEG confinement of the step-graded structure. A low average sheet resistance of 314.5Ω/square, with a good resistance uniformity of 0.68%, is also obtained across the 50 mm epilayer wafer. HEMT devices are successfully fabricated using this material structure, which exhibits a maximum extrinsic transconductance of 218 mS/ram and a maximum drain current density of 800 mA/mm.     

Dispersion effect on the current voltage characteristic of AlGaN/GaN high electron mobility transistors

The current voltage (IV) characteristics are greatly influenced by the dispersion effects in AlGaN/GaN high electron mobility transistors. The direct current (DC) IV and pulsed IV measurements are performed to give a deep investigation into the dispersion effects, which are mainly related to the trap and self-heating mechanisms. The results show that traps play an important role in the kink effects, and high stress can introduce more traps and defects in the device. With the help of the pulsed IV measurements, the trapping effects and self-heating effects can be separated. The impact of time constants on the dispersion effects is also discussed. In order to achieve an accurate static DC IV measurement, the steady state of the bias points must be considered carefully to avoid the dispersion effects.     

Small-signal modeling of GaN HEMT switch with a new intrinsic elements extraction method

A novel and accurate method is proposed to extract the intrinsic elements of the GaN high-electron-mobility transistor(HEMT) switch.The new extraction method is verified by comparing the simulated S-parameters with the measured data over the 5-40 GHz frequency range.The percentage errors E_(ij) within 3.83% show the great agreement between the simulated S-parameters and the measured data.     

GaN HEMT栅边缘电容用于缺陷的研究

本文对GaN HEMT栅漏电容的频率色散特性进行分析,认为栅边缘电容的色散是导致栅漏电容频率色散特性不同于圆肖特基二极管电容的主要原因. 通过对不同栅偏置条件下缺陷附加电容与频率关系的拟合,发现小栅压下的缺陷附加电容仅满足单能级缺陷模型,而强反向栅压下的缺陷附加电容同时满足单能级和连续能级缺陷模型. 实验中栅边缘电容的频率色散现象在钝化工艺后出现,其反映的缺陷很可能是钝化工艺引入,且位于源漏间栅金属未覆盖区域的表面. 最后通过低频噪声技术进一步验证栅边缘电容提取缺陷参数的可行性. 低频噪声技术获得的单能级 关键词： HEMT 边缘电容 缺陷 低频噪声     

GaN MMIC中SiN介质MIM电容的可靠性

本文通过恒定应力加速实验对GaN微波单片集成电路中SiN介质MIM电容的可靠性进行了评估, 研究了高场下MIM电容的两种失效模式、临界介质击穿电荷密度以及平均失效前时间. 通过不同温度下介质电容的导电特性求解了介质内的缺陷能级.重点分析了SiN介质MIM电容的退化机理, 研究认为高应力下介质内产生新的施主型缺陷,并占据主导地位,其缺陷能级逐渐向深能级转移; 缺陷的持续增加加剧了介质内载流子的散射,导致应力后期泄漏电流降低. SiN介质MIM电容退化机理的研究为加固介质电容提供了依据.