排序方式: 共有76条查询结果,搜索用时 187 毫秒
1.
利用脉冲激光淀积法(PLD)在α-Al2O3衬底上淀积了ZnO薄膜, 通过ZnO和α-Al2O3固相反应制备了具有ZnAl2O4覆盖层的α-Al2O3衬底. X射线衍射谱(XRD)表明ZnAl2O4薄膜随反应时间由单一(111)取向转变为多晶取向, 然后变为不完全的(111)择优取向. 同时扫描电子显微镜(SEM)照片表明ZnAl2O4表面形貌随反应时间由均匀的岛状结构先变为棒状结构, 然后再变为突起的线状结构. 另外, XRD谱显示低温制备的ZnAl2O4在高温下不稳定. 在ZnAl2O4覆盖的α-Al2O3衬底上利用光加热低压MOCVD法直接生长了GaN薄膜. XRD测量表明随ZnAl2O4厚度增加GaN由c轴单晶变为多晶, 单晶GaN的摇摆曲线半高宽为0.4°. 结果表明薄ZnAl2O4覆盖层的岛状结构有利于GaN生长初期的成核, 从而提高了GaN的晶体质量. 相似文献
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With the solid phase reaction between pulsed-laser-deposited (PLD) ZnOfilm and α-Al2O3 substrate, ZnAl2O4/α-Al2O3 complex substrates were synthesized. X-ray diffraction (XRD) spectra show that as the reaction proceeds, ZnAl2O4 changes from the initial (111)-oriented single crystal to poly-crystal, and then to inadequate (111) orientation. Corresponding scanning electron microscope (SEM)images indicate that the surface morphology of ZnAl2O4 transforms from uniform islands to stick structures, and then to bulgy-line structures. In addition, XRDspectra present that ZnAl2O4 prepared at low temperature is unstable at the environment of higher temperature. On the as-obtained ZnAl2O4/α-Al2O3 substrates, GaN films were grown without any nitride buffer using light-radiation heating low-pressure MOCVD (LRH-LP-MOCVD). XRD spectra indicate that GaN film on this kind of complex substrate changes from c-axis single crystal to poly-crystal as ZnAl2O4 layer is thickened. For the single crystal GaN, its full width at half maximum (FWHM) of X-ray rocking curve is 0.4°. Results indicate that islands on thin ZnAl2O4 layer can promote nucleation at initial stage of GaN growth, which leadsto the (0001)-oriented GaN film. 相似文献
3.
结合氢在GaN中的扩散特性,运用阴极荧光(CL)谱,对氢化前后低能电子束辐照下GaN带边发光强度的演变进行了研究.实验发现,氢化前GaN在低能电子束辐照下带边发光强度呈现衰减的趋势,而氢化后带边发射强度先上升后衰减,而且氢化后的衰减比氢化前弱.1 h辐照过程中,氢化后GaN带边发光强度的变化比氢化前要小很多.另外,实验中发现经过氢化处理的GaN在辐照后20 h内没有观察到带边发射强度的恢复.研究表明氢原子在GaN中可以钝化缺陷来增强发光,但这种钝化缺陷的作用必须通过克服高的扩散势垒来实现,而低能电子束可以
关键词:
阴极荧光
低能电子束
氢化
演变 相似文献
4.
Ⅲ-Ⅴ族氮化物宽禁带半导体材料体系中,普通方法生长的p型外延层电导率一般都很低,成为了制约器件性能提高的瓶颈。在p-AlxGa1-xN材料中,Mg受主的激活能较大,并且随Al组份增加而增大。通过在p-AlxGa1-xN材料生长过程中引入三甲基铟(TMIn),发现能有效地降低AlxGa1-xN材料中受主态的激活能。为研究不同In气氛下生长的p-AlxGa1-xN材料的性质,在使用相同二茂基镁(CP2Mg)的情况下,改变TMIn流量,生长了A,B,C和D四块样品。X射线衍射(XRD)组份分析表明:在1100℃下生长AlxGa1-xN外延层时,In的引入不会影响晶体组份。利用变温霍尔(Hall)测试研究了p-AlxGa1-xN材料中受主的激活能,结果表明:In气氛下生长的外延层相比无In气氛下生长的外延层,受主激活能明显降低,电导率显著提高。采用这种方法改进深紫外发光二极管(LED)的p-AlxGa1-xN层后,LED器件性能明显提高。 相似文献
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研究发展了用肖特基电容电压特性数值模拟确定调制掺杂AlxGa1-xN/GaN异质结中极化电荷的方法.在调制掺杂的Al0.22Ga0.78N/GaN异质结上制备了Pt肖特基接触,并对其进行了C-V测量.采用三维费米模型对调制掺杂的Al0.22Ga0.78N/GaN异质结上肖特基接触的C-V特性进行了数值模拟,分析了改变样品参数对C-V特性的影响.利用改变极化电荷、n-AlGaN
关键词:
xGa1-xN/GaN异质结')" href="#">AlxGa1-xN/GaN异质结
极化电荷
电容电压特性
数值模拟 相似文献
7.
桑立雯 ;秦志新 ;岑龙斌 ;沈波 ;张国义 ;李书平 ;陈航洋 ;刘达艺 ;康俊勇 ;成彩晶 ;赵鸿燕 ;鲁正雄 ;丁嘉欣 ;赵岚 ;司俊杰 ;孙维国 《中国物理快报》2008,25(1):258-261
We report AlGaN-based back-illuminated solar-blind Schottky-type ultraviolet photodetectors with the cutoff- wavelength from 280nm to 292nm without bias. The devices show low dark current of 2.1× 10^-6A/cm^2 at the reverse bias of 5 V. The specific detectivity D* is estimated to be 3.3 × 10^12cmHz^1/2 W^-1 . To guarantee the performance of the photodetectors, the optimization of AlGaN growth and annealing condition for Schottky contacts were performed. The results show that high-temperature annealing method for Ni/Pt Schottky contacts is effective for the reduction of leakage current. 相似文献
8.
Identification and elimination of inductively coupled plasma-induced defects in AlxGa1 - xN/GaN heterostructures 下载免费PDF全文
By using temperature-dependent Hall,variable-frequency capacitance-voltage and cathodoluminescence (CL) measurements,the identification of inductively coupled plasma (ICP)-induced defect states around the Al x Ga 1-x N/GaN heterointerface and their elimination by subsequent annealing in Al x Ga 1-x N/GaN heterostructures are systematically investigated.The energy levels of interface states with activation energies in a range from 0.211 to 0.253 eV below the conduction band of GaN are observed.The interface state density after the ICP-etching process is as high as 2.75×10 12 cm 2 ·eV 1.The ICP-induced interface states could be reduced by two orders of magnitude by subsequent annealing in N 2 ambient.The CL studies indicate that the ICP-induced defects should be Ga-vacancy related. 相似文献
9.
Frequency-dependent capacitance-voltage (C-V) measurements have been performed on modulation-doped Al0.22 Ga0.78N/GaN heterostructures to investigate the characteristics of the surface states in the AlxGa1-xN barrier. Numerical fittings based on the experimental data indicate that there are surface states with high density locating on the AlxGa1-xN barrier. The density of the surface states is about 10^12cm^-2eV^-1, and the time constant is about 1μs. It is found that an insulating layer (Si3N4) between the metal contact and the surface of AlxGa1-xN can passlvate the surface states effectively. 相似文献
10.
室温300K下,由于AlxGa1-xN的带隙宽度可以从GaN的3.42eV到AlN的6.2eV之间变化,所以AlxGa1-xN是紫外光探测器和深紫外LED所必需的外延材料.高质量高铝组分AlxGa1-xN材料生长的一大困难就是AlxGa1-xN与常用的蓝宝石衬底之间大的晶格失配和热失配.因而采用MOCVD在GaN/蓝宝石上生长的AlxGa1-xN薄膜由于受张应力作用非常容易发生龟裂.GaN/AlxGa1-xN超晶格插入层技术是释放应力和减少AlxGa1-xN薄膜中缺陷的有效方法.研究了GaN/AlxGa1-xN超晶格插入层对GaN/蓝宝石上AlxGa1-xN外延薄膜应变状态和缺陷密度的影响.通过拉曼散射探测声子频率从而得到材料中的残余应力是一种简便常用的方法,AlxGa1-xN外延薄膜的应变状态可通过拉曼光谱测量得到.AlxGa1-xN外延薄膜的缺陷密度通过测量X射线衍射得到.对于具有相同阱垒厚度的超晶格,例如4nm/4nm,5nm/5nm,8nm/8nm的GaN/Al0.3Ga0.7N超晶格,研究发现随着超晶格周期厚度的增加AlxGa1-xN外延薄膜缺陷密度降低,AlxGa1-xN外延薄膜处于张应变状态,且5nm/5nmGaN/Al0.3Ga0.7N超晶格插入层AlxGa1-xN外延薄膜的张应变最小.在保持5nm阱宽不变的情况下,将垒宽增大到8nm,即十个周期的5nm/8nmGaN/Al0.3Ga0.7N超晶格插入层使AlxGa1-xN外延层应变状态由张应变变为压应变.由X射线衍射结果计算了AlxGa1-xN外延薄膜的刃型位错和螺型位错密度,结果表明超晶格插入层对螺型位错和刃型位错都有一定的抑制效果.透射电镜图像表明超晶格插入层使位错发生合并、转向或是使位错终止,且5nm/8nmGaN/Al0.3Ga0.7N超晶格插入层导致AlxGa1-xN外延薄膜中的刃型位错倾斜30°左右,释放一部分压应变. 相似文献