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We propose a metal organic vapor phase epitaxy(MOVPE) method of pre-introducing TMIn during the growth of uGa N to improve the subsequent growth of In Ga N and discuss the impact of this method in detail. Monitoring the MOVPE by the interference curve generated by the laser incident on the film surface, we found that this method avoided the problem of the excessive In Ga N growth rate. Further x-ray diffraction(XRD), photoluminescence(PL), and atomic force microscope(AFM) tests showed that the quality of In Ga N is improved. It is inferred that by introducing TMIn in advance, the indium atom can replace the gallium atom in the reactor walls, delivery pipes, and other corners. Hence the auto-incorporation of gallium can be reduced when In Ga N is grown, so as to improve the material quality.  相似文献   
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介绍了GaN基pin雪崩探测器的制作过程和测试结果。制作的器件在71 V反向偏压下发生雪崩,倍增因子达到5×104。我们发现,p层载流子浓度是影响器件性能的重要参数。结合电场强度分布的分析,本文提出了一种估算p层载流子浓度的方法,进一步计算得到刚好雪崩击穿时的最大电场值为2.6 MV/cm,与以往GaN雪崩器件所报道的研究结果相似。最后,霍尔测试和SIMS测量p层载流子浓度的结果与模型计算的估算值吻合。  相似文献   
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