GaN基纳米阵列LED器件制备及发光特性

为了降低GaN材料中因应变诱导的量子斯托克斯效应,增加器件有源区内的电子-空穴波函数在实空间的交叠从而提高GaN基LEDs的发光效率,采用紫外软压印技术制备了均匀的周期性纳米柱阵列结构,结合常规LED器件微加工技术获得了In GaN/GaN基蓝光与绿光纳米阵列LED器件并对其进行了表征分析。结果表明:纳米柱阵列LED器件具有均匀的发光和稳定的光电性能。纳米结构不仅有效缓解了量子阱中的应力积累(弛豫度~70%),提高了器件的辐射复合几率和出光效率,同时结合纳米柱侧壁的化学钝化处理进一步降低了器件有源区的缺陷密度,显著降低了LED器件的漏电流(~10-7),最终提高了器件的发光效率。     

Fabrication and Characterization of GaN-Based Micro-LEDs on Silicon Substrate

GaN-based micro light emitting diodes(micro-LEDs) on silicon(Si)substrates with 40μm in diameter are developed utilizing standard photolithography and inductively coupled plasma etching techniques.From currentvoltage curves,the relatively low turn-on voltage of 2.8 V and low reverse leakage current in the order of 10~(-8) A/cm~2 indicate good electrical characteristics.As the injection current increases,the electroluminescence emission wavelength hardly shifts at around 433 nm, and the relative external quantum efficiency slightly decays,because the impact of quantum-confined Stark effect is not serious in violet-blue micro-LEDs.Since GaN-LEDs are cost effective on large-area Si and suitable for substrate transfer or vertical device structures,the fabricated micro-LEDs on Si should have promising applications in the fields of high-resolution display and optical communication.     

Structural characterization of indium-rich nanoprecipitate in InGaN V-pits formed by annealing

InGaN layers capped with GaN were annealed at 550℃ for 1 hour. During annealing, cracks appeared and dissolved In GaN penetrated through the microcracks into the V-pits to form indium-rich nanoprecipitates. Some precipitates, in-situ annealed under nitrogen ion irradiation by MBE, were confirmed to be cubic GaN on the tops of precipitates, formed by nitriding the pre-existing Ga droplets under nitrogen ions irradiation.     

Enhancement in solar hydrogen generation efficiency using InGaN photoelectrode after surface roughening treatment with nano-sized Ni mask

A significant enhancement in solar hydrogen generation efficiency has been achieved by inductive coupled etching （ICP） surface roughening treatment using nano-sized nickel mask. As much as 7 times improvement of photocurrent is demonstrated in comparison with a planar one fabricated from the same parent wafer. Under identical illumination conditions in HBr solution, the incident photon conversion efficiency （IPCE） shows an enhancement with a factor of 3, which even exceed 54% at 400 nm wavelength. We believe the enhancement is attributed to several facts including improvement in absorption, reacting area, carder localization and carrier lifetime.