超临界流体触媒作用下石墨-金刚石转变

 研究了超临界流体CO₂在石墨-金刚石转变中的触媒作用。实验中，采用Ag₂O作为流体触媒的先驱材料，在7.7 GPa压力下，Ag₂O在1 200 ℃分解成Ag和O₂，O₂与石墨套管在高温高压下反应形成CO₂超临界流体。研究结果表明，在7.7 GPa和1 500 ℃以上温度条件下，石墨在CO₂流体触媒的作用下可转变为金刚石晶体，在1 500～1 700 ℃温度范围内合成出的金刚石具有完好的八面体形貌，与天然金刚石的生长特征非常相似。     

Undercooling and Unidirectional Solidification of CuNi Alloy Melts

Cylinder-shaped CusoNi20 alloy melt is undercooled and solidified by the combination of the electromagnetic levitation technique and the flux treatment method. Nearly constant temperature gradient of 8-10 K/cm is realized for the cylindrical melts with differen~ undercooling levels at the bottom ends. The experimental results reveal that with the increase of the undercoo]ing of the melts from 35 to 220 K, the microstructures undergo transition from coarse dendrites to granular grains, unidirectional dendrites, and finally to equiaxed grains.     

Structural relaxation of Zr_(41)Ti_(14)Cu_(12.5)Ni_(10)Be_(22.5) bulk metallic glass under high pressure

Zr41Ti14Cu12.5Ni10Be22.5bulk metallic glass (BMG) is annealed at 573 K under 3 GPaand its structural relaxation is investigated by X-ray diffraction, ultrasonic study, compression as well as sliding wear measurements. It is found that after the ZrTiCuNiBe BMG sample was annealed under high pressure, the mechanical properties were improved. Moreover, the BMG with relaxed structure exhibits markedly different acoustic properties. These results are attributed to the fact that relaxation under high-pressure results in a microstructural transformation in the BMG.     

Zr基大块非晶合金的热膨胀与超塑性

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Zr-Cu Amorphous Films Prepared by Magnetron Co-sputtering Deposition of Pure Zr and Cu

ZrxCu100-x amorphous films are prepared on Si （111） substrates by magnetron co-sputtering of pure Zr and Cu. It is found that the glass forming ability （GFA） of the films increases with x when x is in the range from 35 to 65 and with the best glass forming ability at x = 65. It is therefore different from the bulk counterparts, for which only x = 35 and 50 were reported to have high glass forming ability during casting. The structure of the films is sensitive to the substrate temperature and the sputtering argon pressure.