A Two-Dimensional Photonic Crystal Slab Mirror with Silicon on Insulator for Wavelength 1.3μm

A concrete two-dimensional photonic crystal slab with triangular lattice used as a mirror for the light at wavelength 1.3μm with a silicon-on-insulator （SOI） substrate is designed by the three-dimensional plane wave expansion method. For TE-like modes, the bandgap in the Г-K direction is from 1087nm to 1559nm. The central wavelength in the bandgap is about 1.3μm, hence the incident light at wavelength 1.3μm will be strongly reflected. Experimentally, such a photonic crystal slab is fabricated on an SOI substrate by the combination of EBL and ICP etching. The measurement of its transmission characteristics shows the bandgap edge in a longer wavelength is about 1540 nm. The little discrepancy between the experimental data and the theoretical values is mainly due to the size discrepancy of the fabricated air holes.     

Paired interference 3-dB coupler based on SOI rib waveguides with anisotropic chemical wet etching

A 3-dB paired interference (PI) optical coupler in silicon-on-insulator (SOI) based on rib waveguides with trapezoidal cross section was designed with simulation by a modified finite-difference beam propagation method (FD-BPM) and fabricated by potassium hydroxide (KOH) anisotropic chemical wet etching.The- oretically,tolerances of width,length,and port distance are more than 1,100,and 1μm,respectively. Smooth interface was obtained with the propagation loss of 1.1 dB/cm at the wavelength of 1.55μm.The coupler has a good uniformity of 0.2 dB and low excess loss of less than 2 dB.     

A Base-Emitter Self-Aligned Multi-Finger Sil-xGex/Si Power Heterojunction Bipolar Transistor

With a crystal orientation dependent on the etch rate of Si in KOH-based solution, a base-emitter self-Migned large-area multi-finger configuration power SiGe heterojunction bipolar transistor （HBT） device （with an emitter area of about 880μm^2） is fabricated with 2μm double-mesa technology. The maximum dc current gain is 226.1. The collector-emitter junction breakdown voltage BVcEo is 10 V and the collector-base junction breakdown voltage BVcBo is 16 V with collector doping concentration of 1 × 10^17 cm^-3 and thickness of 400nm. The device exhibited a maximum oscillation frequency fmax of 35.5 GHz and a cut-off frequency fT of 24.9 GHz at a dc bias point of Ic = 70 mA and the voltage between collector and emitter is VCE = 3 V. Load pull measurements in class-A operation of the SiGe HBT are performed at 1.9 GHz with input power ranging from OdBm to 21 dBm. A maximum output power of 29.9dBm （about 977mW） is obtained at an input power of 18.SdBm with a gain of 11.47dB. Compared to a non-self-aligned SiGe HBT with the same heterostructure and process, fmax and fT are improved by about 83.9% and 38.3%, respectively.     

一种分析三维楔脊形光波导与光纤耦合的方法

和直波导的不同在于，三维楔脊形波导中的光场都是不稳定的.分别对波导-光纤耦合、光纤-波导耦合两种情况，将三维楔脊形波导等效为多段短的直波导，利用束传播法同时对三维楔脊形波导内不稳定的入射、反射场，及它们在传播方向上的偏导进行处理，再用自由空间辐射模法计算透射率和反射率.以SOI楔脊形波导和光纤的耦合为例，验证了该方法的可行性. 关键词： 自由空间辐射模法 束传播法 耦合 透射 楔脊形光波导 绝缘体上硅(SOI)     

Sub-nanosecond silicon-on-insulator optical micro-ring switch with low crosstalk

<正>We demonstrate a sub-nanosecond electro-optical switch with low crosstalk in a silicon-on-insulator(SOI) dual-coupled micro-ring embedded with p-i-n diodes.A crosstalk of -23 dB is obtained in the 20-μm-radius micro-ring with the well-designing asymmetric dual-coupling structure.By optimizations of the doping profiles and the fabrication processes,the sub-nanosecond switch-on/off time of400 ps is finally realized under an electrical pre-emphasized driving signal.This compact and fast-response micro-ring switch,which can be fabricated by complementary metal oxide semiconductor(CMOS) compatible technologies,have enormous potential in optical interconnects of multicore networks-on-chip.     

A comparison of silicon oxide and nitride as host matrices on the photoluminescence from Er+ ions

This paper compares the properties of silicon oxide and nitride as host matrices for Er ions.Erbium-doped silicon nitride films were deposited by a plasma-enhanced chemical-vapour deposition system.After deposition,the films were implanted with Er3+ at different doses.Er-doped thermal grown silicon oxide films were prepared at the same time as references.Photoluminescence features of Er3+ were inspected systematically.It is found that silicon nitride films are suitable for high concentration doping and the thermal quenching effect is not severe.However,a very high annealing temperature up to 1200° C is needed to optically activate Er3+,which may be the main obstacle to impede the application of Er-doped silicon nitride.     

BPM-FSRM混合法分析SOI脊形波导与光纤耦合

用束传播-自由空间辐射模（BPM-FSRM）混合法计算了SOI脊形波导和光纤耦合时的透射率, 提出计算反射率的积分公式. 将该混合法和一般FSRM、菲涅尔公式-重叠积分法的计算结果相比较, 提出只有在弱导条件下, 传统的菲涅尔公式法和重叠积分法才可以同时使用.     

High-efficiency focusing grating coupler with optimized ultra-short taper

A novel high-efficiency focusing non-uniform grating coupler is proposed to couple light into or off silicon photonic chips for large-scale silicon photonic integration. This kind of grating coupler decreases the transition length of the linking taper between the grating and the single-mode waveguide by at least 80%. The radian of the grating lines and the size of the taper are optimized to improve the coupling efficiency. An experimental coupling efficiency of ~ 68% at 1556.24 nm is obtained after optimization and the whole size of the grating is 12 μm × 30 μm, with a very short taper transition of ~15 μm long.     

SOI纳米线波导导光机理的物理分析

SOI（silicon-on-insulator）纳米线波导及其器件是近年来光电子学领域研究的重点内容之一．文章从基本的导波光学理论出发,引入古斯一汉森位移理论,对SOI纳米线波导导光的物理机制进行了分析并给出了物理解释和模拟结果．     

Wafer-Level Testable High-Speed Silicon Microring Modulator Integrated with Grating Couplers

A wafer-level testable silicon-on-insulator-based microring modulator is demonstrated with high modulation speed, to which the grating couplers are integrated as the fiber-to-chip interfaces. Cost-efflcient fabrications are realized with the help of optical structure and etching depth designs. Grating couplers and waveguides are patterned and etched together with the same slab thickness. Finally we obtain a 3-dB coupling bandwidth of about 6Ohm and 10 Gb/s nonreturn-to-zero modulation by wafer-level optical and electrical measurements.