Cu/Al引线键合界面金属间化合物生长过程的原位实验研究

铜引线键合由于在价格、电导率和热导率等方面的优势有望取代传统的金引线键合, 然而Cu/Al引线键合界面的金属间化合物(intermetallic compounds, IMC)的过量生长将增大接触电阻和降低键合强度, 从而影响器件的性能和可靠性. 针对以上问题, 本文基于原位高分辨透射电子显微镜技术, 研究了在50–220 ℃退火温度下, Cu/Al引线键合界面IMC的生长问题, 实时观测到了Cu/Al IMC的动态生长及结构演变过程. 实验结果表明, 退火前颗粒状的Cu/Al IMC 分布在键合界面, 主要成分为Cu₉Al₄, 少量成分为CuAl₂. 退火后Cu/Al IMC的成分是: 靠近Cu一端为Cu₉Al₄, 远离Cu的一端为CuAl₂. 同时基于原位观测Cu/Al IMC的动态生长过程, 计算得到了Cu/Al IMC 不同温度下的反应速率和激活能, 给出了基于原位实验结果的Cu/Al IMC的生长公式, 为优化Cu/Al引线键合工艺和提高Cu/Al引线键合的可靠性提供了指导.     

Raman spectroscopy characterization of two-dimensional materials

Two-dimensional(2D) materials have become a hot study topic in recent years due to their outstanding electronic,optical, and thermal properties. The unique band structures of strong in-plane chemical bonds and weak out-of-plane van der Waals(vdW) interactions make 2D materials promising for nanodevices and various other applications. Raman spectroscopy is a powerful and non-destructive characterization tool to study the properties of 2D materials. In this work, we review the research on the characterization of 2D materials with Raman spectroscopy. In addition, we discuss the application of the Raman spectroscopy technique to semiconductors, superconductivity, photoelectricity, and thermoelectricity.