High holding voltage SCR for robust electrostatic discharge protection

A novel silicon controlled rectifier(SCR) with high holding voltage(Vh) for electrostatic discharge(ESD) protection is proposed and investigated in this paper. The proposed SCR obtains high Vhby adding a long N+ layer(LN+) and a long P+ layer(LP+), which divide the conventional low voltage trigger silicon controlled rectifier(LVTSCR) into two SCRs(SCR1: P+/Nwell/Pwell/N+ and SCR2: P+/LN+/LP+/N+) with a shared emitter. Under the low ESD current(IESD), the two SCRs are turned on at the same time to induce the first snapback with high V_h(V_(h1)). As the IESDincreases, the SCR2 will be turned off because of its low current gain. Therefore, the IESDwill flow through the longer SCR1 path, bypassing SCR2, which induces the second snapback with high V_h(V_(h2)). The anti-latch-up ability of the proposed SCR for ESD protection is proved by a dynamic TLP-like(Transmission Line Pulse-like) simulation. An optimized V_(h2) of 7.4 V with a maximum failure current(I_(t2)) of 14.7 m A/μm is obtained by the simulation.     

Ultralow turnoff loss dual-gate SOI LIGBT with trench gate barrier and carrier stored layer

A novel ultralow turnoff loss dual-gate silicon-on-insulator(SOI) lateral insulated gate bipolar transistor(LIGBT) is proposed. The proposed SOI LIGBT features an extra trench gate inserted between the p-well and n-drift, and an n-type carrier stored(CS) layer beneath the p-well. In the on-state, the extra trench gate acts as a barrier, which increases the carrier density at the cathode side of n-drift region, resulting in a decrease of the on-state voltage drop(Von). In the off-state, due to the uniform carrier distribution and the assisted depletion effect induced by the extra trench gate, large number of carriers can be removed at the initial turnoff process, contributing to a low turnoff loss(Eoff). Moreover, owing to the dual-gate field plates and CS layer, the carrier density beneath the p-well can greatly increase, which further improves the tradeoff between Eoffand Von. Simulation results show that Eoff of the proposed SOI LIGBT can decrease by 77% compared with the conventional trench gate SOI LIGBT at the same Von of 1.1 V.