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目前,c面氮化镓(GaN)基发光二极管的制备技术已经十分成熟并取得了商业化成功,但仍面临极化电场导致的大电流密度下效率下降(Droop效应)和黄绿光波段效率低的问题。为消除极化电场的影响,人们开始关注半极性和非极性面GaN。其中,基于传统极性面衬底通过三维结构生长来获得半极性和非极性GaN的方法,由于其低成本和生长的灵活性,受到了广泛研究。本文首先总结了三种GaN三维结构的制备方法并分析其生长机理。接着,在此基础上介绍了不同晶面InGaN量子阱的外延生长和发光特性。最后,列举了GaN基三维结构在半极性面LED、颜色可调LED和无荧光粉白光发光二极管方面的应用。 相似文献
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Effects of SiNx on two-dimensional electron gas and current collapse of AlGaN/GaN high electron mobility transistors 下载免费PDF全文
SiN_x is commonly used as a passivation material for
AlGaN/GaN high electron mobility transistors (HEMTs). In this paper,
the effects of SiN_x passivation film on both two-dimensional
electron gas characteristics and current collapse of AlGaN/GaN HEMTs
are investigated. The SiN_x films are deposited by high- and
low-frequency plasma-enhanced chemical vapour deposition, and they
display different strains on the AlGaN/GaN heterostructure, which
can explain the experiment results. 相似文献
3.
Deep InP Gratings for Opto-Electronic Devices Etched by C12/CH4/Ar Inductively Coupled Plasma 下载免费PDF全文
Deep InP gratings are etched by C12/CH4/Ar inductively coupled plasma (ICP) at room temperature. A comparison is made between SiNz mask patterns formed by wet and dry etching. SF6 reactive ion etching is adopted for smooth and vertical sidewall. The etching conditions of C12/CH4/Ar ICP are optimized for high anisotropy, and a 1.7-μm-deep InP grating with an aspect ratio of 10:1 is demonstrated. The technique is then used for the fabrication of 1.55-μm laterally coupled distributed feedback A1GMnAs-InP laser. 相似文献
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Effects of SiNx on two-dimensional electron gas and current collapse of A1GaN/GaN high electron mobility transistors 下载免费PDF全文
SiNx is commonly used as a passivation material for AlGaN/GaN high electron mobility transistors (HEMTs). In this paper, the effects of SiN x passivation film on both two-dimensional electron gas characteristics and current collapse of AlGaN/GaN HEMTs are investigated. The SiNx films are deposited by high- and low-frequency plasma-enhanced chemical vapour deposition, and they display different strains on the AlGaN/GaN heterostructure, which can explain the experiment results. 相似文献
6.
利用金属有机气相外延方法研究了非故意掺杂GaN薄膜的方块电阻与高温GaN体材料生长时载气中N2比例的关系.研究发现,随着载气中N2比例的增加,GaN薄膜方块电阻急剧增加.当载气中N2比例为50%时,GaN薄膜方块电阻达1.1×108Ω/□,且GaN表面平整,均方根粗糙度为0.233nm.二次离子质谱分析发现,载气中N2比例不同的样品中碳、氧杂质含量无明显差别.随着载气中N2比
关键词:
半绝缘GaN薄膜
载气
金属有机气相外延
位错 相似文献
7.
GaN and AlN nanowires (NWs) have attracted great interests for the fabrication of novel nano-sized devices. In this paper, the nucleation processes of GaN and AlN NWs grown on Si substrates by molecular beam epitaxy (MBE) are investigated. It is found that GaN NWs nucleated on in-situ formed Si3N4 fully release the stress upon the interface between GaN NW and amorphous Si3N4 layer, while AlN NWs nucleated by aluminization process gradually release the stress during growth. Depending on the strain status as well as the migration ability of III group adatoms, the different growth kinetics of GaN and AlN NWs result in different NW morphologies, i.e., GaN NWs with uniform radii and AlN NWs with tapered bases. 相似文献
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利用金属有机气相外延方法研究了非故意掺杂GaN薄膜的方块电阻与高温GaN体材料生长时载气中N2比例的关系.研究发现,随着载气中N2比例的增加,GaN薄膜方块电阻急剧增加.当载气中N2比例为50%时,GaN薄膜方块电阻达1.1×108Ω/□,且GaN表面平整,均方根粗糙度为0.233 nm.二次离子质谱分析发现,载气中N2比例不同的样品中碳、氧杂质含量无明显差别.随着载气中N2比例的增加,GaN材料中螺型位错相关缺陷密度无明显变化,而刃型位错相关缺陷密度明显增加.结果表明,刃型位错的受主补偿作用是导致GaN薄膜方块电阻变化的主要原因. 相似文献
10.
复杂半导体材料结构中的载流子分布特性对器件性能有重要影响. 本文针对一种新型的波长上转换红外探测器, 研究了载流子阻挡结构对载流子分布和器件特性的影响. 论文通过自洽求解薛定谔方程、泊松方程、电流连续性方程和载流子速率方程分析了不同器件结构中的空穴分布. 同时, 生长了相应结构的外延材料, 并通过电致荧光谱分析了载流子阻挡结构对器件特性的影响. 结果表明, 2 nm厚的AlAs势垒层既能有效阻挡空穴又不影响电子输运, 有利于制作波长上转换红外探测器. 此外, 论文分析了阻挡势垒层的厚度和高度以及工作温度对载流子分布的影响. 本文研究结果亦可应用于其他载流子非均匀分布的半导体器件. 相似文献