A THEORETICAL MODELLING OF THE CHAIN STRUCTURE FORMATION IN ELECTRORHEOLOGICAL FLUIDS

IntroductionAnelectrorheological (ER)fluidconsistsofasuspensionoffineparticlesinaliquidoflowdielectricconstantandlowviscosity .Itsapparentviscosityincreasesdramaticallyinthepresenceofanappliedelectricfield .Iftheelectricfieldexceedsacriticalvalue,theERfluidturnsintoasolidwhoseyieldstressincreasesasthefieldisfurtherstrengthened .Thisphenomenoniscompletelyreversible .Uponelectricfieldcutoff,thesystemalmostimmediatelyresumesitsoriginalliquidstate .Thetimescaleforthetransitionisoftheorderofmill…     

塑料封装集成电路结构热应力分布的解析解

由于集成电路的硅芯片与其周围的塑料封装材料热膨胀系数的不协调,产生的热残余力会直接导致封装结构的破坏及集成电路的失效.将硅芯片的角点结构模化成半无限大楔体,求得了热应力分布的解析解.在此基础上,应用应变能密度因子准则评价电子封装结构角点处的开裂强度及开裂方向.     

电流变液中粒子成链机理的理论模型

建立了一理论模型用来解释在电场作用下电流变液中粒子集束成链的机理。通过假设在成链过程中释放的电磁能等于由于粘性流体而导致的能量耗散,建立了控制链长大的微分方程。基于这样的能量方程,可以预报成链的速度及电流变液的响应时间。该模型也预报了电场强度温度,以及诸如微粒的含量,介电常数等微结构参数对电流变液响应的影响。     

含有界面裂纹的粘弹性层合板应变能释放率的计算

将裂纹扩展所对应的能量释放率定义为同一时刻,同样载荷条件下两种状态的能量之差.一是裂纹长度为a时,系统内能,第二状态是指裂纹长度为a+Δa时系统内能.这样,所定义的能量释放率相当于在无限短时间内,裂纹从a扩展到a+Δa所释放的能量.通过计算发现,对于给定的加载历史,应变能释放率是时间的函数,它的最大值相对应于层间开裂临界状态.在William工作的基础上,根据经典梁的理论求得双悬臂梁结构的应变能释放率的显函表达式.     

Analytical solutions of thermal stress distribution in plastic encapsulated integrated circuit packages

IntroductionElectronicpackagesarecomplexcompositestructure.Theyhavemyriadcornersandinterfacesthatcanactaspotentialfailuresitesduringfieldoperation .Atpresenttime ,plasticencapsulatedintegratedcircuits (ICs)arewidelyusedinengineering .AplasticencapsulatedICpackageconsistsofasilicondie,dieattachment,passivation ,wireinterconnects,aleadframe ,andplasticmoldingcompound .Thermalexcursionduringpackagequalificationfromthermalcycling thermalshock ,orpowercyclingduringnormaloperationcansetupthermomec…     

On the calculation of energy release rate for viscoelastic cracked laminates

IntroductionGenerallyspeaking ,acrackinviscoelasticmaterialswillgrowinsomeunknownspeedeveniftheappliedloadisquasistatic,thusthemaindifficultyisinducedindervingtheenergyreleaserate .Knowledgeoftheconditiongoverningthedelaminationincompositelaminateswithviscoelasticlayersisofparamountimportanceinpracticalapplications.Forexample,inplasticencapsulatedICpackages,theinterfacialdelaminationbetweentheSilicondieandviscoelasticepoxymoldingcompoundunderthethermalloadingisthemainfailuremodeofthestructure…