Multi-wafer 3C—SiC heteroepitaxial growth on Si(100) substrates

<正>Epitaxial growth of semiconductor films in multiple-wafer mode is under vigorous development in order to improve yield output to meet the industry increasing demands.Here we report on results of the heteroepitaxial growth of multi-wafer 3C-SiC films on Si(100) substrates by employing a home-made horizontal hot wall low pressure chemical vapour deposition(HWLPCVD) system which was designed to be have a high-throughput,multi-wafer(3×2-inch) capacity. 3C-SiC film properties of the intra-wafer and the wafer-to-wafer including crystalline morphologies,structures and electronics are characterized systematically.The undoped and the moderate NH3 doped n-type 3C-SiC films with specular surface are grown in the HWLPCVD,thereafter uniformities of intra-wafer thickness and sheet resistance of the 3C-SiC films are obtained to be 6%~7%and 6.7%~8%,respectively,and within a run,the deviations of wafer-to-wafer thickness and sheet resistance are less than 1%and 0.8%,respectively.     

氮氟复合注入对注氧隔离SOI材料埋氧层内固定正电荷密度的影响

为了抑制埋层注氮导致的埋层内正电荷密度的上升, 本文采用氮氟复合注入方式, 向先行注氮的埋层进行了注氮之后的氟离子注入, 并经适当的退火, 对埋层进行改性. 利用高频电容-电压 (C-V) 表征技术, 对复合注入后的埋层进行了正电荷密度的表征. 结果表明, 在大多数情况下, 氮氟复合注入能够有效地降低注氮埋层内的正电荷密度, 且其降低的程度与注氮后的退火时间密切相关. 分析认为, 注氟导致注氮埋层内的正电荷密度降低的原因是在埋层中引入了与氟相关的电子陷阱. 另外, 实验还观察到, 在个别情况下, 氮氟复合注入引起了埋层内正电荷密度的进一步上升. 结合测量结果, 讨论分析了该现象产生的原因. 关键词： 绝缘体上硅(SOI) 材料 注氮 注氟 埋氧层正电荷密度     

4H-SiC同质外延生长及Ti/4H-SiC肖特基二极管

利用台阶控制外延生长技术在偏晶向Si-面衬底上进行了4H-SiC的同质外延生长研究,衬底温度为1500℃,在厚度为32μm、载流子浓度为2～5×1015cm-3的外延材料上制备出了反向阻塞电压大于1kV的Ti/4H-SiC肖特基二极管,二极管的正向与反向电流的整流比(定义偏压为±1V时的电流比值)在室温下超过107,在265℃的温度下超过102,在20～265℃的温度范围内,利用电流电压测量研究了二极管的电学特性,室温下二极管的理想因子和势垒高度分别为1.33和0.905eV,开态电流密度在2.0V的偏压下达到150A/cm2,比开态电阻(Ron)为7.9mΩ·cm2,与温度的关系遵守Ron～T2.0规律.