Deposition of Diamond-Like Carbon Film and Mass Spectrometry Measurement in CH4/O2 RF Plasma

The deposition of diamond-like carbon (DLC) film and the measurements of ionic species by means of mass spectrometry were carried out in a CH ₄ /O ₂ RF (13.56 MHz) plasma. The film deposition rate greatly decreased with increasing O ₂ content up to 10% O ₂ . The oxygen ion density indicated the remarkable increase with the increase of O ₂ content up to 10%. The hydrocarbon ion density is increased considerably by the addition of 5% O ₂ , and then decreased monotonically for O ₂ contents more than 5%. Many oxygenated hydrocarbon ions were detected in the CH ₄ /O ₂ plasma. They were classified into three kinds of ions: C _n H _m O ⁺ , C _n H _m OH ⁺ , and C _n H _m O ₂ H ⁺. When the O ₂ content was increased, the higher hydrocarbon C _n H _m ⁺ (n2) ion densities (except C ₂ H ₄ ⁺ ) decreased more than the principal (CH ₃ ⁺ and CH ₄ ⁺ ) ion densities, since the generation of higher hydrocarbon ions would be suppressed by the formation of oxygenated hydrocarbons. It was also suggested that the great decrease in the film deposition rate in the CH ₄ /O ₂ plasma was mainly associated with considerable decrease in the higher hydrocarbon ion densities. The properties of DLC film obtained in CH ₄ /O ₂ plasma did not indicate considerable change from those obtained in pure CH ₄ plasma.     

Photo-chemical vapor deposition of hydrogenated amorphous silicon films

A photo-chemical vapor deposition, using ultraviolet light excitation and a mercury photo-sensitization, was investigated for depositing hydrogenated amorphous silicon films from SiH₄. The photoelectric and structural properties were examined to characterize the deposited films. Those properties were depended strongly on substrate temperature, and the films which were deposited at a substrate temperature more than 200°C contained dominant SiH configurations. A relatively large single crystalline grain size of about 0.5 m was observed in a 1.0 m thick film, which was obtained at a substrate temperature as low as 200°C. Phosphorus impurity doping into the films and Pt-Schottky diode fabrication were also attempted.     

Mass spectrometric study of SF6-N2 plasma during etching of silicon and tungsten

The reaction products in the SF₆-N₂ mixture rf plasma during reactive ion etching of Si and W have been measured by a mass spectrometric method. Two kinds of cathode materials were used in this work; they were stainless steel for the Si etching, and SiO₂ for the W etching. The main products detected in the etching experiments of Si and W included SF₄, SF₂, SO₂, SOF₂, SOF₄, SO₂F₂, NSF, NF₃, N₂F₄, N_xS_y, NO₂, and SiF₄. In the W etching with the SiO₂ cathode, additional S₂F₂, N₂O, and WF₆ molecules were also obtained. The formation reactions about the novel NSF compound and the sulfur oxyfuorides were discussed.     

Deposition of Diamond-Like Carbon Film in a Closed-Space CH4 RF Plasma

Deposition of diamond-like carbon (DLC) film and mass spectrometry measurements were carried out in a closed-space CH₄ rf (13.56 MHz) plasma (without both gas injection and vacuum pumping during the process). At pressures less than 0.6 Torr, the thickness of the DLC film deposited increased with increasing elapsed deposition time, and reached a maximum value, but after this the film thickness started to decrease, which was considered to be caused predominantly by ion-induced sputter etching. The maximum film thickness appeared at larger elapsed time for higher deposition pressure. The mass concentrations of hydrocarbon ions indicated anomalous behavior at early deposition times, but those of higher hydrocarbon ions are clearly increased at the point where the film thickness started to decrease. These results suggested that the ratio of precursor CH₃al density to the total hydrocarbon ion density (_CH3/_ion in the CH₄a was an important factor for the carbon film formation, and when this ratio reduced to a certain critical value with increasing elapsed deposition time, the deposited film was then re-etched predominately by the secondary higher hydrocarbon ions. At 1.0 Torr where a polymer-like soft carbon film was deposited, such re-etching of the deposited film was not observed.     

Deposition of Diamondlike Carbon Film and Mass Spectrometry Measurement in CH4/N2 RF Plasma

The deposition of diamondlike carbon (DLC) film and the measurements of ionic species by means of mass spectrometry were carried out in a CH₄/N₂ RF (13.56 MHz) plasma at 0.1 Torr. The film deposition rate greatly depended on both CH₄/N₂ composition ratio and RF power input. It was decreased monotonically as CH₄ content decreased in the plasma and then rapidly diminished to negligible amounts at a critical CH₄ content, which became large for higher RF power. The rate increased with increasing RF power, reaching a maximum value in 40% CH₄ plasma. The predominant ionic products in CH₄/N₂ plasma were NH⁺ ₄ and CH₄N⁺ ions, which were produced by reactions of hydrocarbon ions, such as CH⁺ ₃, CH⁺ ₂, CH⁺ ₅, and C₂H⁺ ₅ with NH₃ molecules in the plasma. It was speculated that the production of NH⁺ ₄ ion induced the decrease of C₂H⁺ ₅ ion density in the plasma, which caused a reduction in higher hydrocarbon ions densities and, accordingly, in film deposition rate. The N⁺ ₂ ion sputtering also plays a major role in a reduction of film deposition rate for relatively large RF powers. The incorporation of nitrogen atoms into the bonding network of the DLC film deposited was greatly suppressed at present gas pressure conditions.