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Experimental study on the 3D‐printed plastic parts and predicting the mechanical properties using artificial neural networks
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This study investigates the mechanical properties of 3D‐printed plastic parts fabricated using Fused Deposition Modeling (FDM). For this purpose, a 3D printer named KASAME was designed and built by the researchers. The test samples were fabricated using polylactic acid (PLA). The experiments were conducted using three melt temperatures (190°C, 205°C, and 220°C), four layer thickness values (0.06 mm, 0.10 mm, 0.19 mm, and 0.35 mm), and three raster pattern orientations (+45°/?45° [the crisscross pattern], horizontal and vertical). Tensile strength tests were performed to determine tensile strength values of the samples and fracture surfaces were also analyzed. Using artificial neural networks, a mathematical model for the tensile test results was generated corresponding to the raster pattern employed in 3D fabrication. Tensile strength tests indicated that melt temperature, layer thickness, and raster pattern orientation had a significant effect on the tensile strengths of the samples. According to the result of the experiment, the maximum average tensile strength values were observed for the samples fabricated using the crisscross raster pattern. The analysis of variance (ANOVA) table shows the raster pattern (PCR) value of 48.68% was obtained with the highest degree of influence. With respect to R 2, the best performing artificial neural network model, with test and training values of 0.999199 and 0.999997, respectively, was observed to be the crisscross raster pattern. Copyright © 2016 John Wiley & Sons, Ltd. 相似文献
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Capacitance–voltage (C–V) and conductance–voltage (G/ω–V) measurements of the Au/n-GaAs Schottky barrier diodes (SBDs) in the wide frequency range of 10 kHz–10 MHz at room temperature were carried out in order to evaluate the reason of negative capacitance (NC). Experimental results show that C and G/ω are strong functions of frequency and bias voltage especially in the accumulation region. NC behavior was observed in the C–V plot for each frequency and the magnitude of absolute value of C increases with decreasing frequency in the forward bias region. Contrary to C, G/ω increases with decreasing frequency positively in this region. NC behavior may be explained by considering the loss of interface charges at occupied states below Fermi level due to impact ionization processes. Such behavior of the C and G/ω values can also be attributed to the increase in the polarization especially at low frequencies and the introduction of more carriers in the structure. The values of Rs decrease exponentially with increasing frequency according to literature. In addition, the values of C and G/ω at 1 MHz were corrected to obtain the real diode capacitance by taking the effect of Rs into account. 相似文献
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Colemanite (Ca2B6O11.H2O) in powder form was filled to polypropylene (PP) at concentrations of 5, 7.5, 11.25, 16.875, and 25.312 wt%, and filled PP granules were obtained. To prevent oxidation, an antioxidant (Songnox 1010) was added to the colemanite‐filled polypropylene mixture at a ratio of 0.2 wt%. The rheological properties of the resulting composite material were determined using a Melt Flow Index testing device, at four separate pressure settings (298.2, 524, 689.5, and 987.4 kPa) and four separate temperature settings (190°C, 200°C, 210°C, and 220°C). The viscosity, shear rate, shear stress, and power law index (n) values of the colemanite‐filled PP were measured as part of the testing conducted. The study determined that viscosity values increased by approximately 60% in response to increasing colemanite content in the resulting filled material, while shear rate values decreased by 62%. The viscosity values were found to decrease with increasing temperature and pressure values, while shear rate values were found to increase. Additionally, Power Law Index value was found to vary between 0.561 and 0.687, with an average value of 0.608 based on the colemanite content used. Copyright © 2017 John Wiley & Sons, Ltd. 相似文献
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