薄层色谱、凝胶色谱、薄层扫描分析核-壳型微交联聚苯乙烯微粒

本文用薄层色谱成功地将微交联核-壳结构聚苯乙烯微粒中的少量线性PS分子与微交联组分相分离,用凝胶色谱法测得线性PS的分子量为104-105数量级;0.2-1.6×10-6g的点样量,薄层扫描吸收峰面积与样品量成良好的线性关系;可直接由峰面积计算线性PS分子的含量;结合微粒的表观粘度,对微粒的核-壳结构进行了定性分析。     

固相萃取高效液相色谱-质谱法测定血浆中乙醇醛、甘油醛的含量

采用柱前衍生、固相萃取、高效液相色谱-质谱联用方法,建立了血浆中乙醇醛(GCO)、甘油醛(GCE)含量的测定方法。衍生试剂为3-m ethyl-2-benzoth iazolinone-hydrazone hydrochloride(MBTH);内标物为3-羟基丁醛;HPLC流动相为甲醇-醋酸铵(5 mmol/L),梯度洗脱;质谱电喷雾选择离子检测。比较了糖尿病大鼠和正常大鼠血浆中GCO、GCE的含量,正常大鼠血浆中GCO和GCE的含量分别为0.0574±0.0036μmol/L、0.0186±0.0019μmol/L;糖尿病大鼠血浆中GCO和GCE的含量分别为0.0763±0.0071μmol/L、0.0240±0.0023μmol/L,差异显著。     

“高分子物理”课程教学中的整体性思路初探

在"高分子物理"课程教学中,主要难点是教学内容比较繁杂,所涉及的概念很多且较抽象,各种高分子材料的结构和性能差异性大,不易把握其共性。以高分子结构、性能和分子运动的中间态,即高分子链的远程结构中分子链的形态、高聚物性能的高弹性和链段运动为基础,避开繁杂抽象的具体概念,以简洁的方式来呈现高分子物理的教学内容,帮助学生在渐进的教学过程之初便建立一个形象化的整体性思路,以此作为后续教学的指导性思路,在整个教学过程中进一步展开和强化,教学效果很好。     

Slip on the surface of silicon wafers under laser irradiation:Scale effect

The slip mechanism on the surface of silicon wafers under laser irradiation was studied by numerical simulations and experiments. Firstly, the slip was explained by an analysis of the generalized stacking fault energy and the associated restoring forces. Activation of unexpected {110} slip planes was predicted to be a surface phenomenon. Experimentally,{110} slip planes were activated by changing doping concentrations of wafers and laser parameters respectively. Slip planes were {110} when slipping started within several atomic layers under the surface and turned into {111} with deeper slip.The scale effect was shown to be an intrinsic property of silicon.     

Thermomechanical response of aluminum alloys under the combined action of tensile loading and laser irradiations

This study reports the investigation of the thermomechanical behavior of aluminum alloys(Al-1060, Al-6061, and Al-7075) under the combined action of tensile loading and laser irradiations. The continuous wave ytterbium fiber laser(wavelength 1080 nm) was employed as the irradiation source, while tensile loading was provided by the tensile testing machine. The effects of various pre-loading and laser power densities on the failure time, temperature distribution, and the deformation behavior of aluminum alloys are analyzed. The experimental results represent the significant reduction in failure time for higher laser power densities and for high preloading values, which implies that preloading may contribute a significant role in the failure of the material at elevated temperature. Fracture on a microscopic scale was predominantly ductile comprising micro-void nucleation, growth, and coalescence. The Al-1060 specimens behaved plastically to some extent, while Al-6061 and Al-7075 specimens experienced catastrophic failure. The reason and characterization of material failure by tensile and laser loading are explored in detail. A comparative behavior of under-tested materials is also investigated. This work suggests that studies considering only combined loading are not enough to fully understand the mechanical behavior of under-tested materials. For complete characterization, one should consider the effect of heating as well as loading rate and the corresponding involved processes with the help of thermomechanical coupling and the thermal elastic-plastic theory.     

焦距仪用五档变倍镜头设计

目前的焦距仪为了增大测量范围,会配备一组测量镜头。在测量不同范围焦距时需要进行更换,过程繁杂,影响工作效率。解决这一问题,设计一个五档变倍的测量镜头,通过了变焦与变物距两个方法实现变倍,用档位之间的切换代替目前的更换测量镜头提升工作效率。设计完成后,放大率变化为8.0~0.16X,物距变化为20~1000mm,测量范围:(-1000mm,-5mm)U(5mm,1000mm)。通过ZEMAX模拟仿真实验表明:设计得光学系统测量范围大,各个变倍位置成像质量良好,MTF曲线接近衍射极限,可以替代原有的测量镜头组。     

“核-壳”结构微交联聚苯乙烯微粒的合成与表征

本文用复合乳液聚合方法合成了粒径70—160nm的窄分散、微交联聚苯乙烯微粒,透射电子显微镜观测表明该微粒具有核-壳结构。用薄层色谱、透射电镜结合凝胶色谱、粘度等方法对该微粒进行了结构表征并探讨了影响微粒结构的主要因素。实验结果表明:双烯A用量为苯乙烯单体Ⅰ重量的1—4％,第一阶段聚合两小时后,滴加苯乙烯单体Ⅱ进行壳层聚合,合成的微粒含8.0—15.0％的线性聚苯乙烯,壳层主要由与核连接的聚苯乙烯链构成。     

Stress damage process of silicon wafer under millisecond laser irradiation

The stress damage process of a single crystal silicon wafer under millisecond laser irradiation is studied by experiments and numerical simulations. The formation process of low-quality surface is monitored in real-time. Stress damage can be observed both in laser-on and-off periods. Plastic deformation is responsible for the first stress damage in the laser-on period. The second stress damage in the laser-off period is a combination of plastic deformation and fracture, where the fundamental cause lies in the residual molten silicon in the ablation hole.