量子阱生长气压对InGaN/GaN黄光LED光电性能的影响

采用MOCVD技术在图形化硅衬底上生长了InGaN/GaN多量子阱黄光LED外延材料,研究了不同的量子阱生长气压对黄光LED光电性能的影响。使用高分辨率X射线衍射仪（HRXRD）和荧光显微镜（FL）对晶体质量进行了表征,使用电致发光系统积分球测试对光电性能进行了表征。结果表明：随着气压升高,In的并入量略有降低且均匀性更好,量子阱中的点缺陷数目降低,但是阱垒间界面质量有所下降。在实验选取的4个气压4,6.65,10,13.3 kPa下,外量子效率最大值随着量子阱生长气压的上升而显著升高,分别为16.60%、23.07%、26.40%、27.66%,但是13.3 kPa下生长的样品在大电流下EQE随电流droop效应有所加剧,在20 A·cm^-2的工作电流下,样品A、B、C、D的EQE分别为16.60%、19.77%、20.03%、19.45%,10 kPa下生长的量子阱的整体光电性能最好。     

AlN插入层对硅衬底GaN薄膜生长的影响

利用金属有机化合物气相外延沉积技术在2inch(5.08cm)Si(111)图形衬底上生长了GaN外延薄膜,在Al组分渐变AlGaN缓冲层与GaN成核层之间引入了AlN插入层,研究了AlN插入层对GaN薄膜生长的影响。结果表明,随着AlN插入层厚度的增加,GaN外延膜(002)面与(102)面X射线衍射摇摆曲线半峰全宽明显变小,晶体质量变好,同时外延膜在放置过程中所产生的裂纹密度逐渐减小直至不产生裂纹。原因在于AlN插入层的厚度对GaN成核层的生长模式有明显影响,较厚的AlN插入层使GaN成核层倾向于岛状生长,造成后续生长的nGaN外延膜具有更多的侧向外延成分,从而降低了GaN外延膜中的位错密度,减少了GaN外延膜中的残余张应力。同时还提出了一种利用荧光显微镜观察黄带发光形貌来表征GaN成核层形貌和生长模式的新方法。     

Effect of Mg-Preflow for p-AlGaN Electron Blocking Layer on the Electroluminescence of Green LEDs with V-Shaped Pits

In GaN-based green light-emitting diodes(LEDs) with and without Mg-preflow before the growth of p-Al GaN electron blocking layer(EBL) are investigated experimentally.A higher Mg doping concentration is achieved in the EBL after Mg-preflow treatment,effectively alleviating the commonly observed efficiency collapse and electrons overflowing at cryogenic temperatures.However,unexpected decline in quantum efficiency is observed after Mg-preflow treatment at room temperature.Our conclusions are drawn such that the efficiency decline is probably the result of different emission positions.Higher Mg doping concentration in the EBL after Mg-preflow treatment will make it easier for a hole to be injected into multiple quantum wells with emission closer to pGaN side through the(8-plane rather than the V-shape pits,which is not favorable to luminous efficiency due to the preferred occurrence of accumulated strain relaxation and structural defects in upper QWs closer to p-GaN.Within this framework,apparently disparate experimental observations regarding electroluminescence properties,in this work,are well reconciled.     

Electroluminescence from the InGaN/GaN Superlattices Interlayer of Yellow LEDs with Large V-Pits Grown on Si(111)

A blue emission originated from In GaN/GaN superlattice(SL) interlayer is observed in the yellow LEDs with V-pits embedded in the quantum wells(QWs), revealing that sufficient holes have penetrated through the QWs into SLs far away from the p-type layer. In the V-pits embedded LEDs, hole transport has two paths: via the flat c-plane region or via the sidewalls of V-pits. It is proved that the holes in SLs are injected from the sidewalls of V-pits, and the transportation process is significantly affected by working temperature, current density, and the size of V-pits. Four motion possibilities are discussed when the holes flow via the sidewalls. All these may contribute to a better understanding of hole transport and device design.     

p型层结构与掺杂对GaInN发光二极管正向电压温度特性的影响

在温度变化时, 如果GaInN发光二极管能够保持相对稳定的工作电压对其实际应用具有重要意义. 本文通过金属有机化学气相沉积生长了一系列包含不同有源区结构、不同p型层结构以及不同掺杂浓度纵向分布的样品, 并对其在不同温度区间内正向电压随温度变化的斜率(dV/dT)进行了研究. 结果表明: 1)有源区中包括插入层设计、量子阱结构以及发光波长等因素的变化对正向电压随温度变化特性影响很小; 2)影响常温区间(300 K± 50 K)正向电压随温度变化斜率的最主要因素为p-AlGaN 电子阻挡层起始生长阶段的掺杂形貌, 具有p-AlGaN陡掺界面的样品电压变化斜率为-1.3 mV·K^-1, 与理论极限值 -1.2 mV·K^-1十分接近; 3) p-GaN主段层的掺Mg浓度对低温区间(<200 K)的正向电压随温度变化斜率有直接影响, 掺Mg浓度越低则dV/dT斜率越大. 以上现象归因于在不同温度区间, p-AlGaN 以及p-GaN 发生Mg受主冻结效应的程度主要取决于各自的掺杂浓度. 因此Mg掺杂浓度纵向分布不同的样品在不同的温度区间具有不同的串联电阻, 最终表现为差异很大的正向电压温度特性.     

手性山贝蒂12-甲醚的全合成研究

以化学拆分得(S)-(-)-α-环柠檬醛(9a)和(R)-(+)-α-环柠檬醛(9b)为A环合成子,以对溴苯甲醚为起始原料,经8步反应制得季盐18为C环合成子,经缩合及分子内环化反应可得到全反式构型关键中间体(3),再经结构修饰,即可对映选择性地得到(+)-山贝蒂12-甲醚[(+)-Montbretyl12-methylether](1a)和(-)-山贝蒂12-甲醚[(-)-Montbretyl-12-methylether](1b),其中BF₃·Et₂O环化反应为关键步骤.     

刻蚀AlN缓冲层对硅衬底N极性n-GaN表面粗化的影响

研究了等离子体刻蚀AlN缓冲层对硅衬底N极性n-GaN表面粗化行为的影响. 实验结果表明, 表面AlN缓冲层的状态对N极性n-GaN的粗化行为影响很大, 采用等离子体刻蚀去除一部分表面AlN缓冲层即可以有效提高N极性n-GaN在KOH溶液中的粗化效果, AlN缓冲层未经任何刻蚀处理的样品粗化速度过慢, 被刻蚀完全去除AlN缓冲层的样品容易出现粗化过头的现象. 经X射线光电子能谱分析可知, 等离子体刻蚀能够提高样品表面AlN缓冲层Al 2p的电子结合能, 使得样品表面费米能级向导带底靠近, 原子含量测试表明样品表面产生了大量的N空位, N空位提供电子, 使得材料表面费米能级升高, 这降低了KOH溶液和样品表面之间的肖特基势垒, 从而有利于表面粗化的进行. 通过等离子体刻蚀掉表面部分AlN缓冲层, 改善了N极性n-GaN在KOH溶液中的粗化效果, 明显提升了对应发光二级管器件的出光功率.     

热退火处理对AuGeNi/n-AlGaInP欧姆接触性能的影响

本文在n-(Al0.27Ga0.73)0.5In0.5P表面通过电子束蒸发Ni/Au/Ge/Ni/Au叠层金属并优化退火工艺成功制备了具有较低接触电阻的欧姆接触,其比接触电阻率在445℃退火600 s时达到1.4×10–4 W·cm2.二次离子质谱仪测试表明,叠层金属Ni/Au/Ge/Ni/Au与n-AlGaInP界面发生固相反应,Ga,In原子由于热分解发生外扩散并在晶格中留下Ⅲ族空位.本文把欧姆接触形成的原因归结为Ge原子内扩散占据Ga空位和In空位作为施主提高N型掺杂浓度.优化退火工艺对低掺杂浓度n-(Al0.27Ga0.73)0.5In0.5P的欧姆接触性能有显著改善效果,但随着n-(Al0.27Ga0.73)0.5In0.5P掺杂浓度提高,比接触电阻率与退火工艺没有明显关系.本文为n面出光的AlGaInP薄膜发光二极管芯片的n电极制备提供了一种新的方法,有望大幅简化制备工艺,降低制造成本.     

氮化镓基绿光LED中V坑对空穴电流分布的影响

采用实验与理论模拟相结合的方法,研究了氮化镓基绿光发光二极管（LED）中V坑对空穴电流分布的影响。首先,实验获得了V坑面积占比不同的3种样品;然后,建立数值模型,使得理论计算的外量子效率（EQE）及电压与实验测试的变化趋势相匹配,从而确立了所用数值模型的可信性。计算结果显示：V坑改变了空穴电流的分布,空穴电流密度在V坑处显著增加,在平台处明显减小。进一步的分析表明：V坑面积占比在0~10%范围内,V坑空穴电流占比与V坑面积占比之间呈近线性增长（斜率为2.06）,但V坑空穴注入在整个空穴注入的过程中仍未占主导。     

Effect of Green Quantum Well Number on Properties of Green GaN-Based Light-Emitting Diodes

In GaN-based green light-emitting diodes(LEDs) with different green quantum well numbers grown on Si(111)substrates by metal organic chemical vapor deposition are investigated. It is observed that V-shaped pits appear in the AFM images with the green quantum well number increasing from 5 to 9, and results in larger reverse-bias leakage current. Meanwhile, in the case of the sample with the number from 5 to 7 then to 9, the external quantum efficiency increases firstly, and then decreases. These phenomena may be related to the size of V-shaped pits in the active area and the distribution of electrons and holes in the active area caused by V-shaped pits. The optimal number of green quantum wells is determined to be 7.