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本文通过对4H-SiC同质外延化学反应和生长条件的分析,建立了4H-SiC同质外延生长的Grove模型,并结合实验结果进行了分析和验证.通过理论分析和实验验证,得到了外延中氢气载气流量和生长温度对4H-SiC同质外延生长速率的影响.研究表明:外延生长速率在衬底直径上为碗型分布,中心的生长速率略低于边缘的生长速率;随着载气流量的增大,生长速率由输运控制转变为反应速率控制,生长速率先增大而后逐渐降低;载气流量的增加,会使高温区会发生漂移,生长速率的理论值和实验出现一定的偏移;随着外延生长温度的升高,化学反应速率和气相转移系数都会增大,提高了外延速率;温度对外延反应速率的影响远大于对生长质量输运的影响,当温度过分升高后,外延生长会进入质量控制区;但过高的生长温度导致源气体在生长区边缘发生反应,生成固体粒子,使实际参与外延生长的粒子数减少,降低了生长速率,且固体粒子会有一定的概率落在外延层上,严重影响外延层的质量.通过调节氢气流量,衬底旋转速度和生长温度,可以有效的控制外延的生长速度和厚度的均匀性. 相似文献
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Lateral depletion-mode 4H-SiC n-channel junction field-effect transistors operational at 400℃ 下载免费PDF全文
This paper presents the development of lateral depletion-mode n-channel 4 H-SiC junction field-effect transistors(LJFETs)using double-mesa process toward high-temperature integrated circuit(IC)applications.At room temperature,the fabricated LJFETs show a drain-to-source saturation current of 23.03μA/μm,which corresponds to a current density of 7678 A/cm2.The gate-to-source parasitic resistance of 17.56 kΩ·μm is reduced to contribute only 13.49%of the on-resistance of 130.15 kΩ·μm,which helps to improve the transconductance up to 8.61μS/μm.High temperature characteristics of LJFETs were performed from room temperature to 400℃.At temperatures up to 400℃in air,it is observed that the fabricated LJFETs still show normally-on operating characteristics.The drain-to-source saturation current,transconductance and intrinsic gain at 400℃are 7.47μA/μm,2.35μS/μm and 41.35,respectively.These results show significant improvement over state-of-the-art and make them attractive for high-temperature IC applications. 相似文献
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