Rapid solidification and dendrite growth of ternary Fe-Sn-Ge and Cu-Pb-Ge monotectic alloys

The phase separation and dendrite growth characteristics of ternary Fe-43.9%Sn- 10%Ge and Cu-35.5%Pb-5%Ge monotectic alloys were studied systematically by the glass fluxing method under substantial undercooling conditions. The maximum undercoolings obtained in this work are 245 and 257 K, respectively, for these two alloys. All of the solidified samples exhibit serious macrosegregation, indicating that the homogenous alloy melt is separated into two liquid phases prior to rapid solidification. The solidification structures consist of four phases including α-Fe, (Sn), FeSn and FeSn2 in Fe-43.9%Sn-10%Ge ternary alloy, whereas only (Cu) and (Pb) solid solution phases in Cu-35.5%Pb-5%Ge alloy under different undercoolings. In the process of rapid monotectic solidification, α-Fe and (Cu) phases grow in a dendritic mode, and the transition "dendrite→monotectic cell" happens when alloy undercoolings become sufficiently large. The dendrite growth velocities of α-Fe and (Cu) phases are found to increase with undercooling according to an exponential relation.     

Rapid growth of FeAl intermetallic compound under high undercooling conditions

Fe-58at%Al alloy is undercooled up to 222K (0.15TL) with the drop tube technique.It is found that there exists a critical undercooling about 185 K,beyond which a “dendrite-equiaxed” growth morphology transition occurs in FeAl intermetallic compound. This transition is characterized by sharp decrease of its grain size.Once the undercooling exceeds 215 K, the peritectic transformation is suppressed completely and a fibrous structure is formed,which results from the cooperative growth of FeAl and FeAl2 compounds.     

Numerical Modeling of Dendrite Growth in Al Alloys

Dendritic grains are the most often observed microstructure in metals and alloys. In the past decade, more and more attention has been paid to the modeling and simulation of dendritic microstructures. This paper describes a modified diffusion-limited aggregation model to simulate the complex shape of the dendrite grains during metal solidification. The fractal model was used to simulate equiaxed dendrite growth. The fractal dimensions of simulated Al alloy structures range from 1.63-1.88 …     

金属凝固组织的计算机仿真

探索了一种新的仿真金属凝固过程中微观组织形成的方法。通过引入导质形核模型，枝晶生长模型，几率形术底模型，借鉴单元动生长机制，仿真等轴晶、柱状晶组织形成的过程。结出了图形仿真结果，襁和实验结果符合得较好。     

3D打印激光制备多孔镍合金组织和力学性能研究

采用3D打印激光熔化技术制备了多孔镍基合金,并对其显微组织构成和压缩力学性能进行了分析。研究结果表明,采用3D打印激光熔化技术制备的多孔镍合金,孔隙率为14.68%~18.97%、抗压强度为461~535 MPa,其微观组织主要呈现γ-Ni枝晶,压缩断口为撕裂式枝晶断裂。     

铝硅合金铸件中的二次枝晶间距

针对ＺＬ１０５,ＺＬ１０１,ＺＬ１０９铝硅合金圆柱体铸件,在砂型铸造条件下,研究凝固时间τ,温度梯度Ｇ,凝固指数ｆｉ,温度梯度加速度ａＧＡＰ与铸件二次枝晶间距λＤＡＳ,孔洞率Ｐ和极限抗拉强度σｂ之间的关系。     

Sb2S3对枝状TiO2阵列的修饰及其在杂化太阳电池中的应用

为了提供多条电子传输通道,增加窄禁带半导体和有机半导体的负载量,采用一步水热法,在FTO基底上制备了由纳米管和纳米线组装而成的枝状TiO₂;通过化学浴沉积法,在枝状TiO₂上成功地制备了窄禁带半导体Sb₂S₃;利用SEM,XRD,紫外-可见吸收光谱,瞬态光电流,稳态荧光光谱及J-V曲线等手段,对样品形貌、晶型、吸光性能和光电性能进行了表征和测试,探究Sb₂S₃沉积时间对电池效率的影响。结果表明：稀疏的枝状TiO₂阵列垂直于FTO导电玻璃生长,为电荷传输提供了有利条件;Sb₂S₃的加入,加强了电极材料对可见光的吸收,提高了光电流强度及荧光猝灭强度,有利于光生载流子的产生和转移;由枝状TiO₂/Sb₂S₃(3 h)/P3HT/PEDOT∶PSS/Au构成的杂化太阳电池的能量转换效率达到了1.10%,是未沉积Sb₂S₃的杂化太阳电池能量转换效率的10倍。在多级结构TiO₂上沉积Sb₂S₃,有利于提高电极材料对可见光的吸收,加强光生载流子的传输能力,拓宽光谱响应范围,提高光电性能,对于解决单纯TiO₂电极吸收强度较弱和光谱响应范围较窄等问题具有重要意义。     

原位聚合表面修饰的金属锂负极

金属锂负极由于比容量高(3860 mAh·g^-1)及氧化还原电位极低(-3.04 V vs.标准氢气电极(SHE)),被认为是实现高能量密度锂电池的理想负极。然而,金属锂电极与电解液反应剧烈,且锂离子在电极表面沉积不均匀容易产生枝晶,导致其循环稳定性和安全性都较差,限制了其应用推广。我们前期通过构建金属锂-碳纳米管(Li-CNT)复合结构,极大的提高了金属锂的比表面积,降低了电极电流密度,从而有效地抑制了锂枝晶的生长,提高了金属锂电极的循环稳定性和安全性能。本工作在前期工作基础上,采用简单的液相反应,利用4-氟苯乙烯(FPS)对Li-CNT进行表面修饰并进行原位聚合,得到了表面富含氟化锂(Li F)保护层的Li-CNT(FPS-Li-CNT)。该表面修饰层能够有效抑制电解液和空气对Li-CNT的侵蚀,显著的提高了LiCNT电极的界面稳定性。FPS-Li-CNT与磷酸铁锂正极(LFP)组成的LFP||FPS-Li-CNT全电池,在正负极容量配比为1:6条件下,能够稳定循环280圈,库伦效率达到97.7%。     

人工界面层在金属锂负极中的应用

金属锂具有极高的比容量(3860 mAh·g^?1)和最低的电化学反应电位(相对标准氢电位为?3.040 V),被认为是高能量密度二次电池最具潜力的负极材料。然而金属锂负极界面稳定性差、不可控的枝晶生长、沉积/剥离过程中巨大的体积变化等严重阻碍了金属锂负极的商业化应用。在金属锂表面构建一层物理化学性质稳定的人工界面保护层被认为是解决金属锂负极界面不稳定和枝晶生长,缓解体积膨胀带来的界面波动等一系列问题的有效手段。本综述依据界面传导性质,从离子导通而电子绝缘的人工固态电解质界面(SEI)层、离子/电子混合传导界面、纳米界面钝化层三个部分对人工界面保护层进行了归纳总结。分析了人工界面保护层的物质结构与性能之间的构效关系,探讨了如何提高人工界面保护层的物理化学稳定性、界面离子输运、界面强度与柔韧性、界面兼容性等。最后,指出用于金属锂负极的人工界面保护层目前面临的主要挑战,并对其未来的发展进行了展望。