首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   221篇
  免费   7篇
  国内免费   8篇
化学   75篇
力学   4篇
综合类   1篇
数学   4篇
物理学   29篇
综合类   123篇
  2022年   1篇
  2021年   2篇
  2020年   1篇
  2019年   3篇
  2018年   1篇
  2017年   6篇
  2016年   5篇
  2015年   5篇
  2014年   7篇
  2013年   27篇
  2012年   11篇
  2011年   18篇
  2010年   15篇
  2009年   11篇
  2008年   17篇
  2007年   14篇
  2006年   16篇
  2005年   14篇
  2004年   9篇
  2003年   13篇
  2002年   9篇
  2001年   5篇
  2000年   6篇
  1999年   2篇
  1998年   4篇
  1997年   3篇
  1995年   1篇
  1994年   3篇
  1992年   1篇
  1991年   1篇
  1989年   2篇
  1988年   2篇
  1987年   1篇
排序方式: 共有236条查询结果,搜索用时 15 毫秒
221.
印刷电路板预电离3.6 kW TEA CO2激光器   总被引:3,自引:2,他引:1  
在TEA CO2激光器中采用印刷电路板预电离结构,在单节放电体积为5cm×4cm×90cm 的两节串连的激光器中获得了20.4 J单脉冲能量输出,电光转换效率达12.8%.激光器重复频率工作时,气体清洗系数大于3,在最高重复频率180 Hz下获得了3.6 kW平均输出功率.  相似文献   
222.
印刷电路板固定故障的热模式   总被引:1,自引:0,他引:1  
在研究TTL集成电路和CMOS集成电路功耗的基础上,提出了一种新的印刷电路板(PCB)故障的描述方法,即PCB故障的热模式.并详细分析了两类PCB固定故障(SAF)即固定开路(SAO)故障和固定短路(SAS)故障的热模式,指出利用PCB故障热模式进行故障检测和诊断的可行性  相似文献   
223.
Micro via and line patterning for PCB using imprint technique   总被引:1,自引:0,他引:1  
Today’s electronic devices such as mobile phones, PDA, computers, etc. have more functions in a smaller size. Thus conducting lines and via holes of PCB (printed circuit board) which has a role of land for all kinds of electronic components are getting finer. In this study, the conducting lines and via holes are produced using thermal imprint technique rather than the conventional photo-lithography process. Imprint technique is a press process that transfers patterns of stamp to resins. Imprint technique is used to produce micro size trench lines and via holes in epoxy resins.Resins used in this work are silica (SiO2) reinforced epoxy. Resins were imprinted using 10 * 10 mm size Ni or polymer stamp. Line/space of pattern is 10/10 μm while diameter of via hole is 30 μm. The depths of lines and via holes are 15 and 30 μm, respectively. The anti-sticking treated stamp and epoxy resins were pressed at 100 °C for 30 min in vacuum. The stamp was released after resins were cured for 1 h at 130 °C. All patterns of stamp were successfully transferred with high fidelity and any noticeable defect was not observed within imprinted area. Imprinted resins were de-smeared to remove the residue at the bottom of via holes and to enhance the adhesion of resins with Cu. Electro/less copper plating was followed to fill in the imprinted patterns. Since the excess Cu layer was formed on the resins during Cu plating, the planarization process was introduced to obtain isolated lines and via holes.  相似文献   
224.
S. Centi  S. Laschi  M. Mascini 《Talanta》2007,73(2):394-399
A comparison of two electrochemical immunosensing strategies for PCBs detection, based on the use of two different solid phases, is here discussed. In both cases, carbon-based screen-printed electrodes (SPEs) are used as transducers in a direct competitive immunoassay scheme, where PCBs in solution compete with the tracer PCB28-alkaline phosphatase (AP) labeled for antibodies immobilized onto the solid-phase.In the standard format (called EI strategy), SPEs are both the solid-phase for immunoassay and electrochemical transducers: in this case the immunochemical reaction occurs onto the working electrode. Finally, the enzymatic substrate is added and an electroactive product is generated and detected by electrochemical measurement. In order to improve the performances of the system, a new approach (called EMI strategy) is developed by using functionalized magnetic beads as solid phase for the competitive assay; only after the immunosensing step they are captured by a magnet onto the working surface of the SPE for the electrochemical detection.Experimental results evidenced that the configuration based on the use of separate surfaces for immunoassay and for electrochemical detection gave the best results in terms of sensitivity and speed of the analysis. The improvement of analytical performances of the immunosensor based on EMI strategy was also demonstrated by the analysis of some spiked samples.  相似文献   
225.
In order to solve the problem of digital radiography for printed circuit board (PCB) defect inspection, a new inspection system for PCB defect inspection with high resolution X-ray is proposed and implemented in this paper. The influence of the focus size of X-ray source on imaging formation is analyzed to get the best geometrical magnification. Moreover, the relationship between the resolution of intensifier and geometrical magnification is presented by analyzing the performance of MCP-X intensifier, which results in calculating the comprehensive resolution of this system. The experiment result indicates that the measurements on defect character is achieved by inspection software, and the defect analysis accuracy on ball grid array (BGA) solder joint of circuit board achieves minimum resolution of 0.03 mm. As a result, this system succeeds in implementing invisible solder joint defect inspection on BGA.  相似文献   
226.
由于引脚、印制电路板和焊接剂的热-机材料属性不同,在受到热载荷或机械载荷时,引脚焊接界面端会产生奇异性应力,有可能产生界面开裂.为了基于界面端奇异场来评价QFP结构引脚界面端力学行为,本文拟采用数值方法求解引脚焊缝任意角度尖劈界面端的应力强度系数.具体步骤为:首先,基于高次内插有限元特征分析法确定两相任意角度尖劈界面端的奇异性指数和应力角分布函数,并引入常数热应力项,获得热-机耦合奇异性应力场表达式;采用有限元分析技术和最小二乘拟合法来获得应力强度系数的数值解.文中考察了热-机材料属性对热载荷下焊接剂/印制电路板界面端应力强度系数的影响,并给出改善界面端热应力状态的建议.  相似文献   
227.
随着电子行业的迅速发展,对作为电子元器件基本构件的印制板的需求量及其加工精度的要求越来越高。紫外线曝光机是印制板制造工艺中的重要设备,光学曝光过程中对光照均匀性的要求很高。基于照明设计软件LightTools,设计了一种新的曝光机照明系统。通过大量的仿真模拟对系统进行优化。实验表明,优化后的照明系统设计使得光照度的均匀性在原来的基础上提高了8倍,在有效的视场范围内,光强分布均匀稳定,达到了PCB曝光机照明系统的要求。  相似文献   
228.
Abstract

A commercially available kit has been applied successfully to screening for polychlorinated biphenyls (PCB's) in soil samples. The kit uses a competitive inhibition Enzyme ImmunoAssay (EIA) for recognition of the PCB structure. Test specificity is restricted to PCB's, primarily Aroclors 1016, 1242, 1248, 1254, and 1260. Soil sample preparation and analysis can be performed in the field or lab using disposable kit components. Screening of unidentified Aroclors at 4 levels from 1 to 50 μg/g in soil is possible using the calibrators in the kit. This screening use has been reviewed by the USEPA Office of Solid Waste and will be proposed for inclusion in the 4000 series of screening methods in the next SW846 update. Conventional analysis (Soxhlet/GC-ECD) and the EIA kit were compared by Manitoba Hydro using 112 field samples over one year. EIA technology was found to be an effective screening tool for determining PCB concentration at contaminated sites. Routine use of these kits in conjunction with conventional Soxhlet extraction procedures has increased the lab's testing capability and reduced the amount of samples requiring conventional testing, providing substantial savings to the corporation.  相似文献   
229.
Abstract

A capillary GC and GC-MS method, employing dibutyl esters is described for determining short-chain dicarboxylic acids in rain, fog and mist samples collected in the Los Angeles area. Approximately twenty dicarboxylic acids (C2-C10) were identified in the water samples, including cis (maleic) and trans (fumaric) unsaturated, saturated, normal, branched and aromatic. Oxalic acid is the dominant acid, followed by succinic and malonic acids. The total concentrations measured are 2.9–51μM, 64–66 μM and 12 μM for rain, fog and mist samples, respectively. These diacids are probably produced by photooxidation of anthropogenic and possibly biogenic organic compounds in the atmosphere.  相似文献   
230.
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号