氩、氢混合等离子体处理对GaAs表面性质及发光特性的影响

介绍了一种氩、氢混合等离子体清洗GaAs基片的实验工艺,深入研究了氩、氢等离子体清洗GaAs表面污染物和氧化层,并活化表面性能的基本原理,同时讨论了气体流量、溅射功率和清洗时间等不同溅射参数对等离子体清洗效果的影响。结果表明,在氩气和氢气流量分别为10 cm³/min和30 cm³/min,溅射功率为20 W,清洗时间为15 min的条件下,GaAs样品的光致发光强度提高达139.12%,样品表面的As-O键和Ga-O键基本消失。     

GaAs薄膜的有效量子限制长度及其极化子特性

本文用分数维方法研究Al_xGa_1-xAs衬底上GaAs薄膜中的极化子特性, 提出了确定GaAs薄膜的有效量子限制长度的一个新方法, 解决了原来方法中在衬底势垒处有效量子限制长度发散的困难, 得到了Al_xGa_1-xAs衬底上GaAs薄膜中的极化子的维数和结合能. 关键词： 分数维方法 极化子 GaAs薄膜     

Investigations on the photographic elementary process in AgCl single crystal foils

The behaviour of the latent image produced by actinic radiation (λ = 365 nm and λ = 407 nm) in AgCl monocrystal foils highly doped with Cd and grown and annealed under various conditions was studied by extinction measurements in the near infrared. The photographic elementary process in these highly doped crystals cannot be described satisfactorily by the classical Gurney Mott model. Therefore another model was used based on the creation of anion vacancies and molecular chlorine complexes. The radiation-induced electrons occupy these anion vacancies, and quasi- metallic centres are formed. By this model the behaviour of the light-induced latent image can also be described as the nuclear particle track formation in the Cd doped AgCl crystals.     

TEM study of ion implanted GaAs after pulsed electron beam annealing

Abstract

(001) GaAs single crystals were implanted with 150 keV Cr⁺ ions using a dose of 5 × 10¹⁵ ions cm^?2. The amorphized surface layers were subjected to pulsed electron beam annealing at energy densities in the range 0–1.3 J cm^?2. A detailed TEM investigation of the damaged and annealed surface layer was conducted. These observations were correlated with backscattering results.     

Effects of silicon negative ion implantation in semi-insulating gallium arsenide

ABSTRACT

In the present work, effects of silicon negative ion implantation into semi-insulating gallium arsenide (GaAs) samples with fluences varying between 1?×?10¹⁵ and 4?×?10¹⁷?ions?cm^?2 at 100?keV have been described. Atomic force microscopic images obtained from samples implanted with fluence up to 1?×?10¹⁷?ion?cm^?2 showed the formation of GaAs clusters on the surface of the sample. The shape, size and density of these clusters were found to depend on ion fluence. Whereas sample implanted at higher fluence of 4?×?10¹⁷?ions?cm^?2 showed bump of arbitrary shapes due to cumulative effect of multiple silicon ion impact with GaAs on the same place. GXRD study revealed formation of silicon crystallites in the gallium arsenide sample after implantation. The silicon crystallite size estimated from the full width at half maxima of silicon (111) XRD peak using Debye-Scherrer formula was found to vary between 1.72 and 1.87?nm with respect to ion fluence. Hall measurement revealed the formation of n-type layer in gallium arsenide samples. The current–voltage measurement of the sample implanted with different fluences exhibited the diode like behavior.     

The improvement of InAs/GaAs quantum dot properties capped by Graphene

InAs self‐assembled quantum dots (QDs) were grown by molecular beam epitaxy on (001) GaAs substrate. Uncapped and capped QDs with GaAs and graphene layers were studied using atomic force microscopy and Raman spectroscopy. Graphene multi‐layer was grown by chemical vapor deposition and transferred on InAs/GaAs QDs. It is well known that the presence of a cap layer modifies the size, shape, and density of the QDs. According to the atomic force microscopy study, in contrast to the GaAs capped sample, which induce a dramatic decrease of the density and height of dots, graphene cap layer sample presents a slight influence on the surface morphology and the density of the islands compared with the uncapped one. The difference shown in the Raman spectra of the samples is due to change of strain and alloy disorder effects on the QDs. Residuals strain and the relaxation coefficients have been investigated. All results confirm the best crystalline quality of the graphene cap layer dots sample relative to the GaAs capped one. So graphene can be used to replace GaAs in capping InAs/GaAs dots. To our knowledge, such study has not been carried out until now. Copyright © 2013 John Wiley & Sons, Ltd.     

GaAs pyramids on GaAs/AlAs Bragg reflectors as alternative microcavities

Pyramidal microcavities are a new class of optical resonators with potentially small mode volume and high quality factor. Our GaAs pyramids with embedded InGaAs quantum dots are placed on top of GaAs/AlAs distributed Bragg reflectors to increase the optical confinement at the base of the pyramids. The pyramidal shape is achieved by a wet-chemical etching process using an AlAs sacrificial layer. Temperature-dependent micro-photoluminescence measurements are used to verify optical modes.     

GaAs极化电子源激活的yo-yo过程研究

通过对GaAs晶体产生极化电子束流的实验过程研究,着重对yo-yo过程中不同的实验参数对产生极化束流以及束流稳定情况的影响进行了分析,为获得稳定而持久的极化电流提供了有力的实验支持,并讨论了极化电流强度的可控性. 关键词： GaAs晶体 极化电子束 yo-yo过程 激活     

GaN/GaAs(1 0 0) superlattices grown by metalorganic vapor phase epitaxy using dimethylhydrazine precursor

Superlattices of cubic gallium nitride (GaN) and gallium arsenide (GaAs) were grown on GaAs(1 0 0) substrates using metalorganic vapor phase epitaxy (MOVPE) with dimethylhydrazine (DMHy) as nitrogen source. Structures grown at low temperatures with varying layer thicknesses were characterized using high resolution X-ray diffraction and atomic force microscopy. Several growth modes of GaAs on GaN were observed: step-edge, layer-by-layer 2D, and 3D island growth. A two-temperature growth process was found to yield good crystal quality and atomically flat surfaces. The results suggest that MOVPE-grown thin GaN layers may be applicable to novel GaAs heterostructure devices.     

Detecting the micro-defects in the GaAs materials by time resolved emissions

The GaAs material is a major semiconductor material, and it has high electron transfer rate and direct transition energy band structure. The devices and inte-grated circuits fabricated on the GaAs substrates have a lot of advantages such as high speed information processing. Small perturbations in the manufacturing of GaAs materi-als can lead to defects. The defects in the GaAs materials can degrade the performance of materials. A new method is presented in this paper for detecting the micro-defects in GaAs materials by using time resolved emissions. In this method, the micro-defects in GaAs materials are detected by making use of the photon emission features of micro- defects. The strength of the emitted photons from the micro-defects is increased by applying the electric current or the periodic pulse signals to GaAs materials. The single-photon detector is used to detect the photon emissions of the micro-defects. The time resolved photon emissions and single-photon detection are used to record and compare the amounts of the emitted photons that come from the given regions of the normal GaAs materials and the defective GaAs materials. A lot of experimental results show that the micro-defects in the GaAs materials can be detected by using the method proposed in this paper.