A Two-Dimensional Photonic Crystal Slab Mirror with Silicon on Insulator for Wavelength 1.3μm

A concrete two-dimensional photonic crystal slab with triangular lattice used as a mirror for the light at wavelength 1.3μm with a silicon-on-insulator （SOI） substrate is designed by the three-dimensional plane wave expansion method. For TE-like modes, the bandgap in the Г-K direction is from 1087nm to 1559nm. The central wavelength in the bandgap is about 1.3μm, hence the incident light at wavelength 1.3μm will be strongly reflected. Experimentally, such a photonic crystal slab is fabricated on an SOI substrate by the combination of EBL and ICP etching. The measurement of its transmission characteristics shows the bandgap edge in a longer wavelength is about 1540 nm. The little discrepancy between the experimental data and the theoretical values is mainly due to the size discrepancy of the fabricated air holes.     

ZK—4、NaANaHS3种沸石的铝化

用高温气－固相置换法对ZK－4、NaANaHS3种沸石进行铝化。组成分析、尾气分析、X射线衍射、晶体形貌分析、红外光谱和^29Si高分辨魔角固体核磁结果表明，3种低硅铝比沸石铝化后骨架可能存在Al-O-Al键。     

圆形振动膜ZnO压电微传声器的研制

本文介绍了一种新型圆形振动膜ZnO压电微传声器的制备，并对传声器制备的工艺过程进行了较为详细的描述。圆形振动膜的压电传卢器与以前方形振动膜结构设计相比，较大幅度提高了传声器的灵敏度和成品率，灵敏度达到-70dB（相对于1V／Pa），成品率达到80％。     

真丝绸低温梁色原理与实践

近十年来，真丝绸的低温染色工艺取得了进展，基本上解决了由于高温染色产生的“灰伤”问题。     

多孔硅的形成及可见光发射

多孔硅是晶体硅片在氢氟酸溶液中进行阳极氧化，在硅衬底上形成多孔态的硅材料。本文介绍了多孔硅的形成和结构形貌，对其光学性质和发光机制进行了扼要讨论，并介绍了当前多孔硅研究中的一些热点问题。     

硅磷酸铝分子筛SAPO—34稳定性的研究

利用差热分析（ＤＴＡ）、原位ＸＲＤ技术研究了ＳＡＰＯ－３４分子筛原粉样品的晶体结构在模板剂烧除过程以及环境气氛中的变化情况。采用１０７３Ｋ下的高温焙烧和水蒸汽处理以及甲醇转化试验跟踪考察了该分子筛在结构和催化性能上的稳定性。     

小功率脉冲电镀仪在高效硅太阳电池中的应用

研制出用于制备空间硅太阳电池上电极的小功率脉冲电镀仪，该电镀仪脉冲电流的频率和占空比具有较宽的调节范围，满足高效率硅太阳电池脉冲电镀的要求，与国内，外普遍采用的真空蒸镀硅太阳电池上电极相比较，脉冲电镀可以制备更窄的栅指电极，电池上电极的遮光损失从７％￣９％降低到３％。     

Self-Assembly of Micro-Parts onto Si Substrates at Liquid-Liquid Interface

We report a new approach for the self-assembly of cuboid micro-parts onto Si substrates to construct three-dimensional microstructures. To perform assembly, the Si substrates are prepared with a deep cavity array as binding sites. An aggregate composed of hundreds of uniformly aligned micro-parts is formed at the C10F18-H2O interface. The micro-parts are arranged by passing the substrate through the aggregate of micro-parts, thus the micro-parts are left on the substrate, and then the substrate is vibrated ultrasonically in the solution, making it possible for the micro-parts to fall into the cavities on the substrate. Finally the substrate is pulled out of the solution after assembly. This technique could give a high yield of up to 70%, providing a new method for micro-assembly.