淬火工艺对铬结构钢显微组织和机械性能的影响

本文研究了淬火工艺对低和中碳铬钢的显微组织,冲击韧性和断裂机制的影响,得出了无论是低碳,还是中、高碳钢,当奥氏体长大倾向稍大时,采取提高加热温度进行淬火的工艺均为不可取的结论。     

IPv4/IPv6翻译网关的研究

In this paper, a model of translation gateway is proposed. The communications between IPv4 network and IPv6 network are realized by using the Microsoft intermediate driver technology in environment of Windows 2000.     

Vapour Recoil Effect on a Vapour Liquid System with a Deformable Interface

A new two-sided model of vapour-liquid layer system with a deformable interface is proposed. In this model, the vapour recoil effect on the Marangoni-Bénard instability of a thin evaporating liquid layer can be examined only when the interface deflexion is considered. The instability of a liquid layer undergoing steady evaporation induced by the coupling of vapour recoil effect and the Marangoni effect is analysed using a linear stability theory. We modify and develop the Chebyshev-Tau method to solve the instability problem of a deformable interface system by introducing a new equation at interface boundary. New instability behaviour of the system has been found and the self-amplification mechanism between the evaporation flux and the interface deflexion is discussed.     

损伤断裂图型演化的统计描述

本文采用动力学演化与随机跃迁并存的模型,研究损伤断裂图型的演化规律。根据演化的终态,损伤演化可分为整体稳定(GS)和演化引起剧变(EIC)两种模式,后者联系于断裂现象。本文引入统计描述,并指出,即使微损伤的连接规律是确定性的,无序介质中断裂的出现亦应以概率分布函数描写。     

分形概念及其在材料科学中的应用

本文首先结合几个数学构造分形的例子介绍分形概念，然后对分形在材料科学中的应用作了简要介绍，主要包括：粉体生长中的分形、断裂面的分形、离子注入等非平衡方法产生的分形、表面分形、无机材料中的分形、自旋玻璃中的分形．     

并行树型机模拟系统的研究

介绍了一种树型ＭＩＭＤ机的模拟系统Ｐ－Ｓｉｍｕｌａｔｏｒ。该系统采用模块式结构设计，用户可根据需要任意选择所需要的结点个数，具有很强的灵活性和通用性。Ｐ－Ｓｉｍｕｌａｔｏｒ是在ＶＡＸ１１／７８０机上用Ｃ语言实现的，它通过进程及进程间通讯来模拟并行机系统中的处理机结点及结点之间的通讯，达到了很好的模拟效果。将Ｐ－Ｓｉｍｕｌａｔｏｒ用于并行归并、并行排序等算法。研究表明，Ｐ－Ｓｉｍｕｌａｔｏｒ具有良好     

考虑流体湿润性影响的核沸腾RohsenoW修正模型

添加界面活性剂的核沸腾在改变蒸气泡生长特性的同时，主要是强化了对流换热．本文考虑流体湿润性影响，对核沸腾换热沿用最广的对流类比模型－Ｒｏｈｓｅｎｏｗ模型进行了修正．通过对实验数据的检验，表明修正后的模型预示值与实测结果吻合很好．     

Self-Assembly of Micro-Parts onto Si Substrates at Liquid-Liquid Interface

We report a new approach for the self-assembly of cuboid micro-parts onto Si substrates to construct three-dimensional microstructures. To perform assembly, the Si substrates are prepared with a deep cavity array as binding sites. An aggregate composed of hundreds of uniformly aligned micro-parts is formed at the C10F18-H2O interface. The micro-parts are arranged by passing the substrate through the aggregate of micro-parts, thus the micro-parts are left on the substrate, and then the substrate is vibrated ultrasonically in the solution, making it possible for the micro-parts to fall into the cavities on the substrate. Finally the substrate is pulled out of the solution after assembly. This technique could give a high yield of up to 70%, providing a new method for micro-assembly.