Bonding wire characterization using automatic deformability measurement

A promising way to control underpad chip damage in IC packaging caused by wire bonding forces would be to use new wire chemistries that produce softer free-air balls (FABs). The number of new wire types that can be tested is limited by the available resources. The conventional FAB hardness characterization method is the microindentation test, a labour intensive and off-line task requiring cross-sectioning of a large number of samples. To accelerate FAB hardness characterization, an innovative on-line method is studied and presented here, enabling the fast comparison of different wire types. Collection of data from an instrumented wire bonder allows comparison of the deformability, i.e. the average amount of FAB deformation under a defined load. Increased deformability implies a softer FAB. The influences have been studied of changes in capillary, bonding substrate metallization and substrate temperature on the results obtained. It is found that these influences need to be held constant during a comparison study.     

Analysis of temperature and stress field in Al alloy’s twin wire welding

By analyzing the shape of twin wire welding’s arcs and the track of droplets’ transition, the phenomenon that the twin wire welding’s fore arc and rear arc all deflect to the middle of the two arcs is found. Based on this the double ellipsoid heat source model is amended, and a heat source model which can apply to calculate the twin wire welding’s temperature field is put forward. This model is testified by actual experiment of temperature sampling. By comparing the temperature field of twin wire welding and single wire welding, the results show that twin wire welding has slender weld pool the end part of which is ellipsoid, and its HAZ is narrower than that of single wire welding. So, twin wire welding can not only reduce the Al alloy generating hot crack, but can also weaken the “overaging” softened phenomenon of heat treated strengthening Al alloy. In the end, the evolving rules of 2219 Al alloy’s longitudinal and transverse stress when welded with twin wire welding are analyzed.     

印制板中地线正确连接原则的讨论

印制板的接地方式非常重要,如果地线布线不合理,就可能引起不可接受的测量误差。本文通过一个典型的热电偶数字测温系统的地线连接的分析,来说明PCB中地线正确连接的重要性和接地原则。文章说明了在模拟和数字信号混合系统中连接PCB地线时,应该防止有较大的地电流,特别是应防止数字电路中大的脉冲地电流流入模拟电路的地线中,尤其不应流入小信号模拟电路的地线中。     

Au线键合中"塌线"问题的研究

目前,在半导体闪存多芯片的金线键合工艺中,为满足堆叠芯片不断增加等结构需要,键合线弧要求更低、更长,制造工艺变得相对更加复杂。针对生产过程中常遇到的塌线问题,通过对金线键合工艺中线弧形成动作的过程分析,以金线弹动现象为线索,探究了生产过程中塌线问题产生的原因,并给出了相应解决方案。经过此研究,长线键合的生产工艺能力得到加强,其成果对新封装产品的研发及基板设计具有有益的参考价值。     

无铅松香芯焊锡丝中新型助焊剂的研制

通过扩展率实验对松香芯焊锡丝用助焊剂的成分及配比进行选择及优化,然后通过添加一种天然植物油(C油)对该优化过的助焊剂进行进一步改进,依据行业标准对制备的助焊剂进行了测试。结果表明,这款助焊剂不含卤素、无腐蚀性、表面绝缘电阻高(1.68×10~(11)Ω);无铅SnCu焊锡丝在使用这款助焊剂时,焊接效果好,松香飞溅值为0.3%,扩展率为75.9%。     

键合线弧高度对键合拉力的影响分析

在集成电路封装的质量控制中,键合拉力的地位非常重要。作为键合质量好坏的主要判定基准之一,影响键合拉力的因素有很多,包括键合工艺参数、焊线材料类型、拉力测试吊钩的测试位置、焊线线径以及线弧的长度和高度等。主要讨论在键合线弧投影长度不变的情况下,线弧高度的变化对键合拉力产生的影响。通过对不同线弧高度条件下测得的拉力数据进行整理分析,结果表明:键合线弧越高,拉力就越大;反之,拉力则越小。这为集成电路组装的正常量产过程中,工程技术人员对于键合线弧整体高度的合理有效控制及键合拉力规范的合理定义提供了参考依据。     

引线键合的动力相图和等效受载模型

 使用常规、微观电镜、动力相图和统计时频分析等方法,进行了引线键合机理的实验研究.通过对换能系统和劈刀振速的高频分量、键合压力的测试,以及键合界面微观结构的观察,建立了键合区域宏观受载等效模型,和对键合机理的框架认识.可作为键合过程优化的指导,和键合动力学建模的依据.     

嵌地线天线的辐射特性分析

采用混合位积分方程结合矩量法对嵌地线天线进行了分析, 讨论了Sommerfeld积分、阻抗矩阵元素及辐射场的计算等关键技术, 仿真计算了嵌地线天线的辐射特性, 并和FEKO软件的计算结果进行比对, 验证了分析方法的正确性.与FEKO等电磁软件相比, 文中方法在分析跨嵌电磁目标时, 其计算效率具有明显的优势.     

半导体封装行业中铜线键合工艺的应用

文章介绍了半导体封装行业中铜线键合工艺下,各材料及工艺参数(如框架、劈刀、设备参数、芯片铝层与铜材的匹配选择)对键合质量的影响,并总结提出如何更好地使用铜线这一新材料的规范要求。应用表明芯片铝层厚度应选择在0.025mm以上;劈刀应使用表面较粗糙的;铜线在键合工艺中使用体积比为95:5的氢、氮气混合保护气体;引线框架镀银层厚度应控制在0.03mm～0.06mm。     

Au nanoparticles as a novel coating for solid-phase microextraction

A novel solid-phase microextraction fiber based on a stainless steel wire coated with Au nanoparticles was prepared and has been applied, coupled with gas chromatography, to the extraction of aromatic hydrophobic organic chemical pollutants in rainwater and soil extract. The solid-phase microextraction fiber exhibited excellent extraction efficiency and selectivity. Effects of extraction time, extraction temperature, ionic strength, stirring rate and desorption conditions were investigated and optimized. Single fiber repeatability and fiber-to-fiber reproducibility were less than 7.90% and 26.40%, respectively. The calibration curves were linear in a wide range for all analytes. Correlation coefficients ranged from 0.9941 to 0.9993. The as-established SPME-GC method was used successfully to two real natural samples. Recovery of analytes spiked at 10 μg L(-1) and 100 μg L(-1) ranged from 78.4% to 119.9% and the relative standard deviations were less than 11.3%.