基于HMS87C1408B的籽棉、菜籽和粮食水分综合测试仪

介绍了使用HMS87C1408B作为主控芯片的籽棉、菜籽和粮食水分综合测试仪的实现方法,重点说明了阻抗变换、软件驱动LCD和语音播报技术的实施.     

基于FPGA的42英寸全色PDP存贮控制电路的实现

从等离子体平板显示器(PDP)的发光原理出发，分析和研究了存贮控制电路的工作原理，提出基于FPGA的电路设计方案，并给出数据整理电路和驱动信号产生电路的具体电路框图，最后给出部分仿真波形．     

话音ATM交换的实现─—ATM论坛电路仿真系列建议

近年来，随着ATM主干网络的建设和发展，研究ATM对现有通信业务的支持方式和适配技术是目前ATM技术研究的热点之一。话音ATM交换在降低话音通信成本和简化网络操作环境等方面提供了大量的技术手段，并且支持在单一网络环境中的多种综合业务传输。ATM论坛制定了电路仿真系列建议，话音ATM交换的技术已经基本成熟。文章通过对话音ATM交换在实现和优化方面的技术进行分析，并提出一种基于NativeModeATM的话音通信方式。     

智能同步广播激励器及其标频

使用智能同步广播激励器,并采用CCTV传输的1MHz标频信号,就有可能实现自适应相位跟踪同步广播。这将大大节省中波段的频率资源。     

无源软开关电路拓扑的研究

提出一个研究无源软开关电路的新技术方法;其特征是对基本的单管隔离型PWM DC/DC变换器进行类比分析,由此直接导出可行的缓冲能量再生复位电路.该新方法能使DC/DC PWM硬开关变换器转变为软开关变换器.以新型Boost无源软开关变换器为例,进行了电路理论分析与中功率样机的实验测试;结果表明此新变换器具有较宽的软开关工作范围、较低的电应力、较小的缓冲元件量值等特点.由此认为,这种研究方法推导简单、物理意义清晰,还能深入地研究无源软开关的新电路拓扑.     

拼接式彩色等离子体大屏幕显示驱动电路的研究

针对拼接结构的高分辨率彩色等离子体大屏幕系统的应用，指出了刷新型电路模式的不足之处，提出了一种混合型模式的驱动电路。从彩色模块ＡＣＰＤＰ的结构特性出发，详细讨论了该电路的工作原理，驱动波形以及放电过程。     

厚度伸缩压电陶瓷振子

对厚度伸缩压电陶瓷振子的振动状态进行了分析,并得到其等效电路.推导了振子的谐振频率、反谐振频率以及等效电路参数与振子尺寸、振子材料的介电、压电、弹性常数间的关系式.最后讨论了振子的一些特性和制作.     

Towards advanced circuit board materials: adhesion of copper foil to ultra‐high molecular weight polyethylene composite

Polyethylene based composites are attractive materials for advanced circuit board applications because of their unique combination of properties: low dielectric constant and loss factor, light weight, high flexural modulus and low thermal expansion coefficient controlled in all spatial directions. This investigation describes a process to consolidate chopped fibers of ultra‐high molecular weight polyethylene concurrently with its bonding to a copper foil. Bonding is affected by a thin sheet of low‐density polyethylene, incorporating a crosslinking agent with a concentration gradient across the sheets thickness. In this single step process, the composite material is formed and bonded to the metal foil, achieving good adhesion without the use of extraneous glue. Copyright © 2002 John Wiley & Sons, Ltd.     

Economic modeling of board test strategies

A long and deep recession, coupled with continuous competitive pressure to reduce costs, is forcing many companies to review their test strategies. Testing costs have become a more significant proportion of the overall manufacturing cost even though manufacturing yields have increased dramatically over the past ten or twelve years. This causes attention to be focused on testing costs as a key source of cost reduction. The increased use of DFT and the integration of design and test are very positive moves towards controlling testing costs but other methods employed can often backfire. The increased use of low priced testers is one such method. The pressure to reduce costs, higher process yields and exhortations that testing adds no value can lead the test engineering manager to take the cheap route. In reality this can often turn out to be an expensive decision. The only way to avoid expensive mistakes is to perform an economic analysis of the alternative courses of action. In most cases this is done, but not always in the right manner or with the necessary amount of detail to make the comparisons meaningful. This article discusses the need for effective cost analysis of test strategies and highlights some of the pitfalls.