Nanoscale strained-Si MOSFET physics and modeling approaches: a review

An attempt has been made to give a detailed review of strained silicon technology. Various device models have been studied that consider the effect of strain on the devices, and comparisons have been drawn. A review of some modeling issues in strained silicon technology has also been outlined. The review indicates that this technology is very much required in nanoscale MOSFETs due to its several potential benefits, and there is a strong need for an analytical model which describes the complete physics of the strain technology.     

Two-dimensional threshold voltage analytical model of DMG strained-silicon-on-insulator MOSFETs

For the first time,a simple and accurate two-dimensional analytical model for the surface potential variation along the channel in fully depleted dual-material gate strained-Si-on-insulator(DMG SSOI) MOSFETs is developed.We investigate the improved short channel effect(SCE),hot carrier effect(HCE),drain-induced barrier-lowering(DIBL) and carrier transport efficiency for the novel structure MOSFET.The analytical model takes into account the effects of different metal gate lengths,work functions,the drain ...     

Analytical model for subthreshold current and subthreshold swing of short-channel double-material-gate MOSFETs with strained-silicon channel on silicon-germanium substrates

The present work gives some insight into the subthreshold behaviour of short-channel double-material-gate strained-silicon on silicon-germanium MOSFETs in terms of subthreshold swing and off-current. The formulation of subthreshold current and, thereupon, the subthreshold swing have been done by exploiting the expression of potential distribution in the channel region of the device. The dependence of the subthreshold characteristics on the device parameters, such as Ge mole fraction, gate length ratio, work function of control gate metal and gate length, has been tested in detail. The analytical models have been validated by the numerical simulation results that were obtained from the device simulation software ATLAS^TM by Silvaco Inc.     

Two-dimensional analytical models for asymmetric fully depleted double-gate strained silicon MOSFETs

This paper develops the simple and accurate two-dimensional analytical models for new asymmetric double-gate fully depleted strained-Si MOSFET. The models mainly include the analytical equations of the surface potential, surface electric field and threshold voltage, which are derived by solving two dimensional Poisson equation in strained-Si layer. The models are verified by numerical simulation. Besides offering the physical insight into device physics in the model, the new structure also provides the basic designing guidance for further immunity of short channel effect and drain-induced barrier-lowering of CMOS-based devices in nanometre scale.     

应变Si全耗尽SOI MOSFET二维亚阈电流模型

本文通过求解二维泊松方程,为应变Si 全耗SOI MOSFET建立了全耗尽条件下表面势模型,利用传统的漂移-扩散理论.在表面势模型的基础上,得到了应变Si 全耗SOI MOSFET的亚阈电流模型,并通过与二维器件数值模拟工具ISE的结果做比较,证明了所建立的模型的正确性.根据所建立的模型,分析了亚阈电流跟应变Si应变度的大小,应变Si膜的厚度和掺杂浓度的关系,为应变Si 全耗SOI MOSFET物理参数设计提供了重要参考. 关键词： 应变硅 FD-SOI MOSFET 表面势 亚阈电流